PLCC 68 INTEL PACKAGE DIMENSIONS Search Results

PLCC 68 INTEL PACKAGE DIMENSIONS Result Highlights (5)

Part	Manufacturer	Description
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH2R408QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance
XPH2R106NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF)
XPH3R206NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF)
TPH4R008QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N)

PLCC 68 INTEL PACKAGE DIMENSIONS Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: PA51GB-68 Z Data Sheet 68 pin PLCC socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, the Intel 87C51GB microcontroller in either PLCC or CLCC package can be programmed on 40 pin DIP programmers capable of programming an 87C52.	Original	PDF	PA51GB-68 socket/40 87C51GB 87C52. 87C51GB 87C52 PA51GB68
R50-E2Y2-24 Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001 Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.	Original	PDF	PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
PLCC 68 intel package dimensions Abstract: 240800 intel packaging handbook 240800 MCS-96 N80C196KR INTEL PLCC 68 dimensions n80c196 Intel mcs-40 MCS-51 intel 68 PLCC Text: MCS -51 and MCS -96 Packaging Information November 1994 Order Number 272118-001 COPYRIGHT INTEL CORPORATION 1995 1 Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or copyright for sale and use of Intel products except as provided in	Original	PDF	MCS-51 MCS-96 84-LEAD 44-Lead 68-Lead 52-Lead 84-Lead PLCC 68 intel package dimensions 240800 intel packaging handbook 240800 N80C196KR INTEL PLCC 68 dimensions n80c196 Intel mcs-40 intel 68 PLCC
MIL-STD-81705 Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray Text: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an	Original	PDF	CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
MIL-STD-81705 Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273 Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes	Original	PDF
MQFP Shipping Trays Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are	Original	PDF
JEDEC TRAY DIMENSIONS Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are	Original	PDF
TS80C186XL12 Abstract: ADC 0800 interfacing with 8086 and programming Text: IA186XL/IA188XL 16-Bit Microcontrollers Preliminary Data Sheet September 30, 2008 IA186XL/IA188XL 16-Bit Microcontroller Data Sheet ® ENG211080711-01 UNCONTROLLED WHEN PRINTED OR COPIED Page 1 of 72 http://www.Innovasic.com Customer Support: 1-888-824-4184	Original	PDF	IA186XL/IA188XL 16-Bit ENG211080711-01 IA186XL IA188XL TS80C186XL12 ADC 0800 interfacing with 8086 and programming
EN80C186XL20 Abstract: EE80C186XL20 cross-reference es80C186XL20 es80C188 EE80C186XL20 EE80C188XL20 EE80C186XL12 IA188XLPLC68IR1 N80C186XL12 EE80C188XL12 Text: IA186XL/IA188XL 16-Bit Microcontrollers Data Sheet January 15, 2010 IA186XL/IA188XL 16-Bit Microcontroller Data Sheet ® IA211080711-04 UNCONTROLLED WHEN PRINTED OR COPIED Page 1 of 74 http://www.Innovasic.com Customer Support: 1-888-824-4184 IA186XL/IA188XL	Original	PDF	IA186XL/IA188XL 16-Bit IA211080711-04 1-888-82miconductor IA186XL EN80C186XL20 EE80C186XL20 cross-reference es80C186XL20 es80C188 EE80C186XL20 EE80C188XL20 EE80C186XL12 IA188XLPLC68IR1 N80C186XL12 EE80C188XL12
ST16C554DCJ68-F Abstract: No abstract text available Text: ST16C554 -Quad UART with 16-Byte FIFOs HomeNewsCareers Investor Relations Contact Us PartnerNet Login Search CommunicationsInterfacePower Management ST16C554 Support Info Request How to Order Samples How to Buy Print this page Quad UART with 16-Byte FIFOs	Original	PDF	ST16C554 16-Byte ST16C454, ST68C454, ST68C554, TL16C554 24MHz) ST16C554DCJ68-F
EXAR ST16C654 Abstract: No abstract text available Text: ST16C554/554D 2.97V TO 5.5V QUAD UART WITH 16-BYTE FIFO JUNE 2006 REV. 4.0.1 GENERAL DESCRIPTION FEATURES The ST16C554/554D 554 is a quad Universal Asynchronous Receiver and Transmitter (UART) with 16 bytes of transmit and receive FIFOs, selectable receive FIFO trigger levels and data rates of up to 1.5	Original	PDF	ST16C554/554D 16-BYTE 64-pin 68-pin 31-Jul-09 EXAR ST16C654
IA188XLPLC68IR2 Abstract: N80C186XL20 Text: IA186XL/IA188XL 16-Bit Microcontrollers Data Sheet February 11, 2013 IA186XL/IA188XL 16-Bit Microcontroller Data Sheet IA211080711-10 UNCONTROLLED WHEN PRINTED OR COPIED Page 1 of 75 http://www.Innovasic.com Customer Support: 1-888-824-4184 IA186XL/IA188XL	Original	PDF	IA186XL/IA188XL 16-Bit IA211080711-10 IA186XL/IA188X IA186XL IA188XLPLC68IR2 N80C186XL20
Untitled Abstract: No abstract text available Text: IA186XL/IA188XL 16-Bit Microcontrollers Data Sheet July 6, 2011 IA186XL/IA188XL 16-Bit Microcontroller Data Sheet ® IA211080711-09 UNCONTROLLED WHEN PRINTED OR COPIED Page 1 of 75 http://www.Innovasic.com Customer Support: 1-888-824-4184 IA186XL/IA188XL	Original	PDF	IA186XL/IA188XL 16-Bit IA211080711-09 1-888-824-418miconductor IA186XL
Untitled Abstract: No abstract text available Text: IA186XL/IA188XL 16-Bit Microcontrollers Data Sheet January 12, 2011 IA186XL/IA188XL 16-Bit Microcontroller Data Sheet ® IA211080711-05 UNCONTROLLED WHEN P RINTED OR COPIED Page 1 of 74 http://www.Innovasic.com Customer Support: 1-888-824-4184 IA186XL/IA188XL	Original	PDF	IA186XL/IA188XL 16-Bit IA211080711-05 IA186XL IA188XL

n80c188 Abstract: EN80C188XL20 Text: IA186XL/IA188XL 16-Bit Microcontrollers Data Sheet July 6, 2011 IA186XL/IA188XL 16-Bit Microcontroller Data Sheet ® IA211080711-09 UNCONTROLLED WHEN PRINTED OR COPIED Page 1 of 75 http://www.Innovasic.com Customer Support: 1-888-824-4184 IA186XL/IA188XL	Original	PDF	IA186XL/IA188XL 16-Bit IA211080711-09 IA186XL/IThe IA186XL n80c188 EN80C188XL20
CERAMIC CHIP CARRIER LCC 68 socket Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a	Original	PDF
intel packaging Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than	Original	PDF	CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
29f040b Abstract: teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6 Text: White Electronic Designs Table Of Contents Product Overview . 2 Commitment . 3	Original	PDF	DMD2006F 29f040b teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6
st16c554dcj Abstract: No abstract text available Text: ST16C554/554D 2.97V TO 5.5V QUAD UART WITH 16-BYTE FIFO APRIL 2006 REV. 4.0.0 GENERAL DESCRIPTION FEATURES The ST16C554/554D 554 is a quad Universal Asynchronous Receiver and Transmitter (UART) with 16 bytes of transmit and receive FIFOs, selectable receive FIFO trigger levels and data rates of up to 1.5	Original	PDF	ST16C554/554D 16-BYTE 64-pin 68-pin st16c554dcj
16C554 Abstract: ST16C554 CDB 411 TE 2161 motorola 16-BYTE 68C554 ST16C454 ST16C554CQ64 ST16C554DCQ64 ST68C454 Text: ST16C554/554D 2.97V TO 5.5V QUAD UART WITH 16-BYTE FIFO JUNE 2006 REV. 4.0.1 GENERAL DESCRIPTION FEATURES The ST16C554/554D 554 is a quad Universal Asynchronous Receiver and Transmitter (UART) with 16 bytes of transmit and receive FIFOs, selectable receive FIFO trigger levels and data rates of up to 1.5	Original	PDF	ST16C554/554D 16-BYTE 64-pin 68-pin 16C554 ST16C554 CDB 411 TE 2161 motorola 68C554 ST16C454 ST16C554CQ64 ST16C554DCQ64 ST68C454
Side Brazed Ceramic Dual-In-Line Packages Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year	Original	PDF
TSOP 56 socket Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817 Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the	Original	PDF	68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
MCS-96 Abstract: 240800 intel packaging handbook 240800 PLCC 68 intel package dimensions intel HANDBOOK MCS-51 MCS 48 Intel 100 pin PQFP dimension mcs 96 rohs MCS-96 datasheet Text: MCS -51 and MCS ®-96 Packaging Information July 2004 Order Number: 272118-002 1 COPYRIGHT INTEL CORPORATION: 2004 Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Intel products except as provided in	Original	PDF	MCS-51 MCS-96 44/52/68/84-LEAD 44-Lead 68-Lead 52-Lead 84-Lead 240800 intel packaging handbook 240800 PLCC 68 intel package dimensions intel HANDBOOK MCS 48 Intel 100 pin PQFP dimension mcs 96 rohs MCS-96 datasheet
Untitled Abstract: No abstract text available Text: l p 13« PIMMMGT [PIF3EWEW in te l. 80L188EA8 16-BIT HIGH INTEGRATION EMBEDDED PROCESSOR • 3V Operation, Vcc = 2.7V-5.5V ■ Full Static Operation ■ True CMOS Inputs and Outputs Integrated Feature Set — Static 186 CPU Core — Power Save, Idle and Powerdown	OCR Scan	PDF	80L188EA8 16-BIT 80C188 80L188EA 68-lead 80-lead

Privacy Settings

PLCC 68 INTEL PACKAGE DIMENSIONS Search Results

PLCC 68 INTEL PACKAGE DIMENSIONS Result Highlights (5)

PLCC 68 INTEL PACKAGE DIMENSIONS Datasheets Context Search

Untitled

R50-E2Y2-24

PLCC 68 intel package dimensions

MIL-STD-81705

MIL-STD-81705

MQFP Shipping Trays

JEDEC TRAY DIMENSIONS

TS80C186XL12

EN80C186XL20

ST16C554DCJ68-F

EXAR ST16C654

IA188XLPLC68IR2

Untitled

Untitled

n80c188

CERAMIC CHIP CARRIER LCC 68 socket

intel packaging

29f040b

st16c554dcj

16C554

Side Brazed Ceramic Dual-In-Line Packages

TSOP 56 socket

MCS-96

Untitled