4560 SMD 8 PIN
Abstract: 52 PLCC socket pin configuration 84 PLCC socket PLCC socket pin configuration 84 PLCC pin configuration 30f24 plcc 32 socket 28 PLCC socket pin configuration PLCC-32LP PLCC pin configuration
Text: A Sockets for IC-PLCC 1,27 2,54 0,45 x 0,25 1,27 0,8 A2 D2 C art. no. D E PLCC PLCC PLCC PLCC PLCC PLCC PLCC no. of contacts 20 28 32 44 52 68 84 20 28 32 44 52 68 84 A1 D1 A1 B1 VPE 38 32 28 24 22 18 15 A2 D2 A2 B2 3 8,3 2,54 C A1 5.08 7.62 7.62 12.70 15.24
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ECG transistor replacement guide book free
Abstract: 6v to 12v converter mini project ISA pressure transmitter data sheet SCR c106 PIN CONFIGURATION ZENER Diode b212 vhdl code 8 bit LFSR Project Report of fire alarm using IC 555 doc 12V convert to 3.7V vhdl code 16 bit LFSR sw dip-4
Text: C O M M U N I C AT I O N S P R O D U C T S S E L E C T O R G U I D E Device Number B212 B103 B202 CCITT V.21 CCITT V.23 CCITT V.22 CCITT V.22bis Description Power Supply Available Packages +5V +5V +5V +5V +5V 28 DIP, 28 PLCC 22 DIP 22, 28 DIP, 28 PLCC 22 DIP
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22bis
73K212L
73K212SL
73K221L
73K221SL
73K222L
73K222SL
73K222U
73K224L
73K224SL
ECG transistor replacement guide book free
6v to 12v converter mini project
ISA pressure transmitter data sheet
SCR c106 PIN CONFIGURATION
ZENER Diode b212
vhdl code 8 bit LFSR
Project Report of fire alarm using IC 555 doc
12V convert to 3.7V
vhdl code 16 bit LFSR
sw dip-4
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Heatsinks
Abstract: WLFT 404 PLCC-28 SMD
Text: Hola1 H A H Heatsinks for DIL-IC, PLCC and SMD Heatsinks for PLCC B C art. no. ICK R Rth [K/W] [mm] 19 D 12 E art. no. ICK PLCC 28 Rth [K/W] [mm] 25 F 11.8 G art. no. ICK CC 64 Rth [K/W] [mm] 17 17 H surface: black anodised I K L M H H H Thermal conduct. foil WLFT 404/405
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Equivalent IR 740
Abstract: ELC-68
Text: Photodiode EPD-740-9-0.4 6/28/2007 Preliminary rev. 01/07 Wavelength Type Technology Case Infrared SMD AlGaAs/AlGaAs TOPLED Description 2,8 ± 0,2 2,2 ± 0,1 Selective photodiode mounted in TOPLED PLCC-2 package, for easy circuit board mounting and assembling of arrays. Narrow response range 740
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EPD-740-9-0
ELC-68
D-12555
Equivalent IR 740
ELC-68
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PLCC-44 SMD
Abstract: plcc socket 84 PLCC PLCC-44-SMD plcc socket 32 PLCC PLCC-32-SMD
Text: Grafik DesignStudio Alexander Dietzel • Postfach 2127 • W-5880 Lüdenscheid SMD-Fassung für PLCC SMD-Sockets for PLCC Supports SMD pour PLCC B ±0,2 D ±0,2 A 0,5 4 1,27 C ±0,2 1,27 Q E SMD-Fassungen für PLCC Plastic Leaded Chip Carrier SMD-Sockets for PLCC
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PLCC-44 SMD
Abstract: plcc socket 44 PLCC plcc socket 84 PLCC PLCC-32-SMD PLCC-28 SMD plcc 32 socket plcc 68 PLCC-44-SMD jedec package PLCC 32
Text: SMD-Fassung für PLCC SMD-Sockets for PLCC Supports SMD pour PLCC B ±0,2 D ±0,2 A 0,5 4 1,27 C ±0,2 1,27 Q SMD-Fassungen für PLCC Plastic Leaded Chip Carrier SMD-Sockets for PLCC (Plastic Leaded Chip Carrier) Supports SMD pour PLCC (Plastic Leaded Chip Carrier)
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Untitled
Abstract: No abstract text available
Text: A Sockets for IC-PLCC SMD sockets for PLCC - low profile housing B These sockets conform to EIA/JEDEC "A" package requirements for leaded plastic chip carriers. B ±0,2 D ±0,2 A C ±0,2 C Q 1,27 A 0,5 4 1,27 art. no. PLCC PLCC PLCC PLCC PLCC PLCC PLCC 20
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PLC-068-442T-P
Abstract: PLCC SOCKET 52 PIN SMD PLC-068-442T 470FG lcc 28 socket Pc 614
Text: ADVANCED Surface Mount PLCC Sockets INTERCONNECTIONS ® 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850 / 401-823-5200 Fax 401-823-8723 Email [email protected] Internet http://www.advintcorp.com Surface Mount PLCC Sockets for SMD
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44pin
PLC-068-442T-P
PLCC SOCKET 52 PIN SMD
PLC-068-442T
470FG
lcc 28 socket
Pc 614
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Heatsinks
Abstract: b14-16 smd 123 25 34 SMD 4 DIL E 6 pin smd ic smd 83 51 a SMD IC smd E6 ART 230
Text: Hola1 H A H Heatsinks for DIL-IC, PLCC and SMD Heatsinks for DIL-IC B C art. no. ICK 6 8 L ICK 14 16 L ICK 20 L D for housings [mm] Rth [K/W] 6/8 contacts 14/16 contacts 20 contacts 8.5 19.0 25.0 83 46 34 for housings [mm] Rth [K/W] E art. no. ICK ICK ICK
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smd transistor HX
Abstract: TRANSISTOR SMD MARKING CODE TK TRANSISTOR SMD MARKING CODE MP smd transistor HX 45 cdp68hc68 hc221 TRANSISTOR SMD MARKING CODE WM intersil standard part marking HIP SMD TRANSISTOR MARKING by 4p TRANSISTOR SMD MARKING CODES
Text: Ordering Nomenclature Guides 2 2-3 Elantec TYPES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 5962 SMD/DSCC - QML TYPES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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82CXXX
-25oC
-40oC
-55oC
125oC
JM38510/
1-888-INTERSIL
smd transistor HX
TRANSISTOR SMD MARKING CODE TK
TRANSISTOR SMD MARKING CODE MP
smd transistor HX 45
cdp68hc68
hc221
TRANSISTOR SMD MARKING CODE WM
intersil standard part marking HIP
SMD TRANSISTOR MARKING by 4p
TRANSISTOR SMD MARKING CODES
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Untitled
Abstract: No abstract text available
Text: Multiadapter for SMT RE460 - EPOXY fibre-glass FR4 1.50 mm, double-side 35 µm CU pth - chem. NI/AU and solder stop mask - through holes plated bores dia 1.00 mm - grid pitches from 0.50 mm to 1.27 mm - adaption board for 23 different SMD-IC´s - 0.500 mm Pitch: 64, 100 Pin
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RE460
RE460-01
RE460-02
RE460-03
RE460-04
RE460-05
RE460-06
RE460-07
RE460-08
RE460-09
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PSOP3-20
Abstract: EIA-481-1 5C smd 12MM 24MM EIA-481-2 EIA-481-3 MO-169 TB347
Text: Harris Semiconductor No. TB347 Harris Packaging January 1997 Tape and Reel Specification for Integrated Circuits Author: Laszlo Nemeth Introduction Many surface mounted devices SMD are being packaged for shipment in embossed tape and wound onto reels. The
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TB347
PSOP3-20
EIA-481-1
5C smd
12MM
24MM
EIA-481-2
EIA-481-3
MO-169
TB347
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SMD CODE 9Z
Abstract: 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products
Text: Information about SMD Plastic Packages Prepared by: Elisabeth Lamarti Pierre Houzé Quality Department SMD Packaging Contents 1. INTRODUCTION -2 2. GENERALITIES -2
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300mm
SMD CODE 9Z
80C251 PLCC44
J-STD-20
SMD CODE 9T
Smd parts identification
14x14x1.4mm
PLCC18
Temic PART DATE CODE
moisture sensitive handling and packaging
temic ulc products
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EIA-481-2
Abstract: EIA-481-3 MO-169 TB347 304 MQFP
Text: Tape and Reel Specification for Integrated Circuits Technical Brief June 1999 TB347.1 Author: Laszlo Nemeth Introduction • EIA-481-1-A . . . . . . . for the 8mm and 12mm Wide Tape Many surface mounted devices SMD are being packaged for shipment in embossed tape and wound onto reels. The
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TB347
EIA-481-1-A
EIA-481-2
EIA-481-3
EIA-481-2
EIA-481-3
MO-169
304 MQFP
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circuito
Abstract: plcc 68 aplicacion
Text: Multiadaptador SMD RE460 - epóxido FR4 1,50 mm, por dos lados 35 µm CU - lados de dos componentes con una superficie terminal quimica de niquel / oro aplicado - agujeros con contactos metalizados de Ø 1,00 mm - distancias entre los agujeros de la trama de 0,50 mm - 1,27 mm
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RE460
RE460-01
RE460-02
RE460-03
RE460-04
RE460-05
RE460-06
RE460-07
RE460-08
RE460-09
circuito
plcc 68
aplicacion
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AN-450 surface mounting methods
Abstract: PLCC20 SO16W SO20W SO24W SO28W VSO40 VSO56 SMD ic catalogue Packaging trends
Text: Issued July 1995 020-420 Data Pack H An introduction to surface mounting Data Sheet What is surface mounting? What are SMDs? In conventional board assembly technology the component leads are inserted into holes through the PCB and connected to the solder pads by wave soldering
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c225 diode smd
Abstract: HA1111 7C225-35 88518 CY7C225
Text: CY7C225 CYPRESS SEMICONDUCTOR • • CMOS for optimum speed/power • High speed — 25 ns max set-up • Slim 300-mil, 24-pin plastic or her metic DIP, 28-pin LCC, or 28-pin PLCC floating gate technology and byte-w ide in telligent program m ing algorithm s.
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CY7C225
300-mil,
24-pin
28-pin
CY7C225
30DMB
CY7C225â
30LMB
c225 diode smd
HA1111
7C225-35
88518
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c225 diode smd
Abstract: CY7C225-40DC CY7C225 JTs smd diode
Text: bSE D CYPRESS SEMI CONDUCTOR CVP 5S ö ^ b b 2 c m i a m s CY7C225 CYPRESS SEMICONDUCTOR • Slim 300-mil, 24-pin plastic or her metic DIP, 28-pin LCC, or 28-pin PLCC • 5V ±10% V cc, commercial and military • TTL-compatible I/O • Direct replacement for bipolar
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55fi1bb2
CY7C225
300-mil,
24-pin
28-pin
T-90-20
c225 diode smd
CY7C225-40DC
JTs smd diode
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Untitled
Abstract: No abstract text available
Text: CY7C225 CYPRESS SEMICONDUCTOR • Slim 300-mil, 24-pin plastic o r h e r m etic DIP, 28-pin LCC, o r 28-pin PLCC • C M O S for op tim u m speed/pow er • High speed — 25 n s m ax set-up — 12 ns clock to o u tp u t floating gate technology and byte-wide intelligentprogram m ingalgorithm s.
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CY7C225
CY7C225
7C225
225--30LM
225--35LM
--40LM
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Untitled
Abstract: No abstract text available
Text: CY7C235A PRELIMINARY CYPRESS SEMICONDUCTOR • Features • CM OS for optimum speed/power • High speed — 18 ns max set-up — 12 ns clock to output IK x 8 Registered PROM Slim, 300-m il, 24-pin plastic or her m etic D IP or 28-pin LCC and PLCC • 5V ± 10% Vcc> commercial and
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CY7C235A
300-m
24-pin
28-pin
CY7C235A
30KMB
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Untitled
Abstract: No abstract text available
Text: Heatsinks for DIL-IC, PLCC and SMD H eatsinks for DIL-IC art. no. ICK 6 8 L ICK 14 16 L ICK 20 L art. no. ICK ICK ICK ICK ICK ICK 14 16 B 24 B 28 B 36 B 40 B 1000 B Imml fo r housings Rth [K/W] 6 /8 contacts 3.5 83 1 4 /1 6 contacts 1 9.0 46 2 0 contacts 2 5 .0
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Untitled
Abstract: No abstract text available
Text: CY7C235A PRELIMINARY SEMICONDUCTOR IK x 8 Registered PROM • Slim , 300-m il, 24-pin p lastic o r h e r m etic D IP o r 28-pin LCC an d PLCC Features • C M O S fo r o p tim u m speed/pow er • H igh speed — 18 n s m ax set-up — 1 2 n s clock to o u tp u t
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CY7C235A
7C235A
--40KM
--40D
--30D
--30LM
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AAAC
Abstract: No abstract text available
Text: Philips Semiconductors-Signetlcs FAST TTL Logic Series Surface Mounted ICs SECTION 7 INTRODUCTION Easier Board Rework Economic survival is driving the electronics industry to use cheaper, faster, more reliable and more dense systems and components. Assembly technologies, such as SMD
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74F126
Abstract: 74F154 16 line to 1 multiplexer IC 74F112 BCD adder and subtractor
Text: Philips Semiconduclors-Signetics FAST TTL Logic Series Availability Guide SE^ AVAILABILITY NO. OF DEVICE ° ^ PINS DESCRIPTION DIP SMD 74F00 14 Quad 2-Input NAND Gate A SO 74F02 14 Quad 2-Input NOR Gate A SO 74F04 14 Hex Inverter A 74F06 14 Hex Inverter Buffer/Driver OC
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74F00
74F02
74F04
74F06
74F06A
74F07
74F07A
74F08
74F10
74F11
74F126
74F154
16 line to 1 multiplexer IC
74F112
BCD adder and subtractor
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