SM5430
Abstract: SM5470 MEDICAL PRESSURE die
Text: SILICON MICROSTRUCTURES INCORPORATED • SM5430/SM5470 Low Cost Packaged Pressure Sensors SURFACE MOUNT AND DIP PRESSURE SENSORS LOW-COST PACKAGED DIE DESCRIPTION Silicon Microstructures provides its two most popular pressure sensor die in surface mount dual in-line package SO-16
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SM5430/SM5470
SO-16)
SM5430
SM5470
MEDICAL PRESSURE die
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Untitled
Abstract: No abstract text available
Text: SM-5310 Std. Pressure SMT SM-5350 Low Pressure SMT SM-5410 Std. Pressure DIP SM-5450 Low Pressure DIP I N C O R P O R A T E D an company Surface Mount and DIP Pressure Sensors Low-cost packaged die Description Silicon Microstructures provides its two most popular pressure sensor
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SM-5310
SM-5350
SM-5410
SM-5450
SM5350-008-G-P
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SENSYM SX7100D
Abstract: span zero circuits working SX7030D SX7100D SX7150D RTV 730 SX7300D SENSYM 150 SX7015D SENSYM
Text: 1 to 300 psig Pressure Sensors in a Button Package APPLICATIONS Medical Equipment Computer Peripherals Pneumatic Controls HVAC FEATURES Button Package High Pressure Small Size Low Noise RTV 730 Die Attach EQUIVALENT CIRCUITS Vs The SX7 Series sensors offer a high pressure sensor
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SX7001D)
SX7300D)
SENSYM SX7100D
span zero circuits working
SX7030D
SX7100D
SX7150D
RTV 730
SX7300D
SENSYM 150
SX7015D
SENSYM
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CPR3-AN03
Abstract: pressure low die attach UP78 silicon carbide LED cree AuSn eutectic ejector 0.5um silicon carbide LED bonding wire cree
Text: APPLICATION NOTE XThinTM Sn Die Attachment Recommendations This applications note provides the user with a basic understanding of Cree’s new low temperature attach version XThin chips, information on the recommended packaging, and an overview of some constraints to be considered when packaging the chips.
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CPR3-AN02,
CPR3-AN03
pressure low die attach
UP78
silicon carbide LED cree
AuSn eutectic
ejector
0.5um
silicon carbide LED
bonding wire cree
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SX7100D
Abstract: SX7300D RTV 730 SX7300 SX7001D SX7005D SX7015D SX7030D SX7150D
Text: SX7 Series 1 psig to 300 psig Button Package Plastic Silicon Pressure Sensors DESCRIPTION The SX7 Series sensors offer a high pressure sensor in a very small “button” style package. These special devices use an RTV 730 for die attach to allow measurement of gauge pressures of 1 psi SX7001D to 300
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SX7001D)
SX7300D)
008180-2-EN
SX7100D
SX7300D
RTV 730
SX7300
SX7001D
SX7005D
SX7015D
SX7030D
SX7150D
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RSK-401
Abstract: Thomas Betts wt RSK-201 RSK-301 MIL-F-21608 WT-740 trap connector RSK401 301JG RSK101
Text: Connector for Shielded Wire SHIELD-KON “Wrap-Around” RSK Connector for Shielded Pair Wire This solderless wrap-around connector provides a quick means of attaching a ground lead to shielded pair wire…without soldering. The low profile crimping tool and connector make grounding in crowded central offices much quicker, cleaner and easier.
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SMT330
Abstract: No abstract text available
Text: SX SMT Series Microstructure Pressure Sensors 0 psi to 1 psi through 0 psi to 150 psi The SX SMT Series provides a most cost-effective method of ported device offers a tube attachment port that is particularly measuring absolute and gage pressures in a fully packaged
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008098-5-EN
SMT330
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Untitled
Abstract: No abstract text available
Text: SX SMT Series Microstructure Pressure Sensors 0 psi to 1 psi through 0 psi to 150 psi The SX SMT Series provides a most cost-effective method of ported device offers a tube attachment port that is particularly measuring absolute and gage pressures in a fully packaged
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008098-3-EN
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SMT330
Abstract: No abstract text available
Text: SX SMT Series Microstructure Pressure Sensors 0 psi to 1 psi through 0 psi to 150 psi The SX SMT Series provides a most cost-effective method of ported device offers a tube attachment port that is particularly measuring absolute and gage pressures in a fully packaged
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008098-2-EN
SMT330
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Untitled
Abstract: No abstract text available
Text: SX SMT Series Microstructure Pressure Sensors 0 psi to 1 psi through 0 psi to 150 psi The SX SMT Series provides a most cost-effective method of ported device offers a tube attachment port that is particularly measuring absolute and gage pressures in a fully packaged
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008098-4-EN
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MPX10DP motorola
Abstract: pressure low die bond sensor RTV MPXL10
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 10 kPa Uncompensated Silicon Pressure Sensors The MPX10 and MPXL10 series devices are silicon piezoresistive pressure sensors providing a very accurate and linear voltage output — directly proportional to the applied
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MPX10
MPXL10
EPX10
MPX10D
MPX10DP
MPX10GP
MPX10GP
MPX10DP motorola
pressure low die bond sensor RTV
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MPX5010
Abstract: No abstract text available
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPX5010 MPXL5010 SERIES Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, INTEGRATED PRESSURE SENSOR 0 to 10 kPa 0 to 1.45 psi 0.2 to 4.7 V Output Temperature Compensated and Calibrated The MPX5010 and MPXL5010 series piezoresistive
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MPX5010
MPXL5010
MPX5010D
MPX5010DP
MPX5010GP
MPX5010GP
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MEMS blood pressure sensor
Abstract: mems brake pressure ptc fuel level sensor Capacitive Pressure Transducer MLX90807-0 PTC-04 mems brake pressure chip capacitive pressure sensor washing MLX90807 Q100
Text: MLX90807/90808 Integrated Relative and Absolute Pressure Sensors Features and Benefits Application Examples Compact monolithic single die solution Absolute and Relative pressure sensors for different ranges Fully programmable through the connector with OTP memory
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MLX90807/90808
AEC-Q100
ISO14001
3901090808P001
MEMS blood pressure sensor
mems brake pressure
ptc fuel level sensor
Capacitive Pressure Transducer
MLX90807-0
PTC-04
mems brake pressure chip
capacitive pressure sensor washing
MLX90807
Q100
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MPX200DP application notes
Abstract: MPX200 circuit 344C-01
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPX200 SERIES 200 kPa Uncompensated Silicon Pressure Sensors The MPX200 series device is a silicon piezoresistive pressure sensors provide a very accurate and linear voltage output — directly proportional to the applied pressure. This
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MPX200
MPX200D
MPX200DP
MPX200GP
MPX200GP
MPX200DP application notes
MPX200 circuit
344C-01
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KTH-1000
Abstract: KTH-1000 tools and dies KTH-1000 dies KTH1000 KTH-2000 SERIES DIE SETS KTM-5000 KTH-5000 Kings Electronics KTH-2000 CRIMP TOOLS
Text: Winchester Electronics Presents. Crimp Tools Machine Crimp Tool Product Benefits Portable, bench-mounted with no permanent airline attached. Designed for use with KINGS KTH-1000 and KTH-2000 die sets. Ideal for long or short production runs. Convenient foot control frees operator
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KTH-1000
KTH-2000
KTM-5000
KTH-5000
KTH-1000
KTH-1000 tools and dies
KTH-1000 dies
KTH1000
KTH-2000 SERIES DIE SETS
KTM-5000
KTH-5000
Kings Electronics
CRIMP TOOLS
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Kings kth-1000 dies
Abstract: KTH-2000 SERIES DIE SETS KTM-5000 KTH-1000 KTH-1000 dies KTH-5000 KTH-1000 tools and dies KTH-2000 kth1000 pneumatic crimping tools
Text: Crimp Tools Product Benefits - KTM-5000 KTM-5000, KTH-1000, KTH-5000 Portable, bench-mounted with no permanent air line attached Designed for use with KINGS KTH-1000 and KTH-2000 die sets Ideal for long or short production runs Convenient foot control frees
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KTM-5000
KTH-1000
KTH-2000
KTM-5000,
KTH-1000,
KTH-5000
KTH-5000
Kings kth-1000 dies
KTH-2000 SERIES DIE SETS
KTM-5000
KTH-1000 dies
KTH-1000 tools and dies
kth1000
pneumatic crimping tools
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pressure low die bond sensor RTV
Abstract: 344C 10 pin MPX10 MPX10DP pressure sensor strain gauge 344C Pressure Sensor MPXV10GC7U MPXV10GC6T1 pressure sensor response time ms Piezoresistive pressure sensors
Text: Freescale Semiconductor Technical Data MPX10 10 kPa Uncompensated Silicon Pressure Sensors The MPX10 and MPXV10GC series devices are silicon piezoresistive pressure sensors providing a very accurate and linear voltage output — directly proportional to the applied pressure. These standard, low cost, uncompensated
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MPX10
MPX10
MPXV10GC
MPX10D
MPX10DP
MPX10GP
MPX10GS
MPXV10GC6U
MPXV10GC7U
pressure low die bond sensor RTV
344C 10 pin
MPX10DP
pressure sensor strain gauge
344C
Pressure Sensor MPXV10GC7U
MPXV10GC6T1
pressure sensor response time ms
Piezoresistive pressure sensors
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Technical Data MPX12 Rev 4, 05/2005 10 kPa Uncompensated Silicon Pressure Sensors MPX12 SERIES The MPX12 series device is a silicon piezoresistive pressure sensor providing a very accurate and linear voltage output — directly proportional to the applied
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MPX12
MPX12D
MPX12DP
MPX12GP
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Untitled
Abstract: No abstract text available
Text: Surface Mount and DIP Pressure Sensors Low-cost packaged die Model Model Model Model 5310 standard pressure surface m ount 5350 ( low-pressure surface m ount) 5410 ( standard pressure DIP) 5450 ( low-pressure D IP) Description Silicon Microstructures provides its
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Untitled
Abstract: No abstract text available
Text: SILICON MICROSTRUCTURES DIVISION SM5310 Std. Pressure SMT SM5350 Low Pressure SMT SM5410 Std. Pressure DIP SM5450 Low Pressure DIP October 1997-1 Surface Mount and DIP Pressure Sensors Low-cost packaged die DESCRIPTION EXAR provides its two most popular pres
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SM5310
SM5350
SM5410
SM5450
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5310
Abstract: barometric pressure sensor SM5310
Text: SILICON MICROSTRUCTURES DIVISION SM-5310 Std. Pressure SMT SM-5350 Low Pressure SMT SM-5410 Std. Pressure DIP SM-5450 Low Pressure DIP April 1997-4 Surface Mount and DIP Pressure Sensors Low-cost packaged die DESCRIPTION EXAR provides its two most popular pres
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SM-5310
SM-5350
SM-5410
SM-5450
5310
barometric pressure sensor
SM5310
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Untitled
Abstract: No abstract text available
Text: Z *EX A R SILICON MICROSTRUCTURES DIVISION SM5310 SM5350 SM5410 SM5450 Std. Pressure SMT Low Pressure SMT Std. Pressure DIP Low Pressure DIP O cto b e r 1997-1 Surface Mount and DIP Pressure Sensors Low-cost packaged die DESCRIPTION EXAR provides its two most popular pres
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SM5310
SM5350
SM5410
SM5450
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MEDICAL PRESSURE die
Abstract: consumer LOW PRESSURE SENSOR pressure low die attach Exar cross low PRESSURE die pressure low die bond sensor SM5310 Silicon Microstructures
Text: ær EXAR SILICON MICROSTRUCTURES SM5310 Std. Pressure SMT ImSi n Z . Low Pressure SMT Std. Pressure DIP SM5450 d iv is io n Low Pressure DIP O cto b e r 1997-1 Surface Mount and DIP Pressure Sensors Low-cost packaged die DESCRIPTION EXAR provides its two most popular pres
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Untitled
Abstract: No abstract text available
Text: Chip Mounting and Handling of GaAs MMIC Chips CHIP DIE DOWN BONDING TECHNIQUES Die Attach The important considerations for die attach are to have low thermal resistance, strong mechanical bond over the desired temperature range, and no damage occurring to the chip
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