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    QFN EXPOSED Search Results

    QFN EXPOSED Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NBSG53AMNG Rochester Electronics LLC 53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 Visit Rochester Electronics LLC Buy
    EL9112ILZ Renesas Electronics Corporation Triple Differential Receiver/Equalizer, QFN, /Tube Visit Renesas Electronics Corporation
    ISL59445IRZ Renesas Electronics Corporation 1GHz Triple Multiplexing Amplifiers, QFN, /Tube Visit Renesas Electronics Corporation
    ISL99125BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation
    ISL99135BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation

    QFN EXPOSED Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    QFN 5x5

    Abstract: qfn stencil "exposed pad" PCB via "thermal via" solder mask P4171 X-RAY INSPECTION via diameter pitch 40-QFN QFN "exposed die"
    Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.7 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.15 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should


    Original     		PDF com/data/tb/TB389 dwg/plastic/P4171 QFN 5x5 qfn stencil "exposed pad" PCB via "thermal via" solder mask P4171 X-RAY INSPECTION via diameter pitch 40-QFN QFN "exposed die"

    QFN 5X5

    Abstract: "thermal via" qfn land pattern
    Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.5 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.17 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should


    Original     		PDF com/data/tb/TB389 dwg/plastic/P4171 QFN 5X5 "thermal via" qfn land pattern

    AD1882AJCIZ

    Abstract: virage AD1882AJCPZ AD1882A
    Text: AD1882A High Definition Audio Codec Data Sheet DSH-202011D September 2012 Ordering Information Device Set Order ID Package Type Operating Temperature Package AD1882AJCPZ* QFN 48-Lead QFN, 7x7 mm 0 °C to +70 °C AD1882AJCIZ* QFN 48-Lead QFN, 7x7 mm -40 °C to +85 °C


    Original     		PDF AD1882A DSH-202011D AD1882AJCPZ* AD1882AJCIZ* 48-Lead MO-220-VKKD-2 AD1882AJCIZ virage AD1882AJCPZ

    AD1882AJCIZ

    Abstract: AD1882AJCPZ 882A 401F conexant hd audio Widgets
    Text: AD1882A High Definition Audio Codec Data Sheet DSH-202011C November 2009 Ordering Information Device Set Order ID Package Type Operating Temperature Package AD1882AJCPZ* QFN 48-Lead QFN, 7x7 mm 0 °C to 70 °C AD1882AJCIZ* QFN 48-Lead QFN, 7x7 mm -20 °C to 85 °C


    Original     		PDF AD1882A DSH-202011C AD1882AJCPZ* 48-Lead AD1882AJCIZ* MO-220-VKKD-2 AD1882A AD1882AJCIZ AD1882AJCPZ 882A 401F conexant hd audio Widgets

    size 0204

    Abstract: QFN PCB Layout guide TL-TORQUEDRIVER-05 TL-TORQUEDRIVER-06
    Text: GHz QFN Socket User Manual Tel: 800 404-0204 Fax: (952) 229-8201 www.ironwoodelectronics.com GHz QFN Socket User Manual Selecting QFN socket: You need to have the IC package drawing ready to select the correct QFN socket. Go to www.ironwoodelectronics.com. Select “Products” link, then under “Browse” menu, select


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: MPQ8636 High Efficiency, 10/20A, 18V Synchronous, Step-Down Converter FEATURES Part Number Package Input Voltage MPQ8636GLE10 QFN 3x4mm 4.5V to 18V Latch-off MPQ8636HGLE10 QFN(3x4mm) 4.5V to 18V NonLatch MPQ8636GVE20 QFN(5x4mm) 4.5V to 18V NonLatch OVP DESCRIPTION


    Original     		PDF MPQ8636 10/20A, MPQ8636GLE10 MPQ8636HGLE10 MPQ8636GVE20 MPQ8636 0A/20A MO-220.

    ZL30110LDG1

    Abstract: C25ao C25AB Crystal oscillator 12 MHz C25D ZL30110 ZL30110LDE C25E C25co
    Text: ZL30110 Telecom Rate Conversion DPLL Data Sheet Features May 2009 • Synchronizes to 8 kHz, 2.048 MHz, 8.192 MHz or 16.384 MHz • Provides a range of output clocks: Ordering Information ZL30110LDE ZL30110LDG1 ZL30110LDF1 32 Pin QFN 32 Pin QFN* 32 Pin QFN*


    Original     		PDF ZL30110 ZL30110LDE ZL30110LDG1 ZL30110LDF1 ZL30110LDG1 C25ao C25AB Crystal oscillator 12 MHz C25D ZL30110 ZL30110LDE C25E C25co

    QFN leadframe

    Abstract: omnix 5000 nsmd smd qfn stencil
    Text: AND8086/D Board Mounting Notes for Quad Flat-Pack No-Lead Package QFN http://onsemi.com APPLICATION NOTE INTRODUCTION Various ON Semiconductor components are packaged in an advanced Quad Flat–pack No–Lead Package (QFN). Because the QFN platform represents the latest in surface


    Original     		PDF AND8086/D r14525 QFN leadframe omnix 5000 nsmd smd qfn stencil

    J-STD-005

    Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently


    Original     		PDF TB389 J-STD-005 land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389

    IPC-7095B

    Abstract: IPC-7095 7095B IPC 7095B EN5312QI en5312 qfn stencil
    Text: Enpirion, Inc. EN5312QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5312QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package


    Original     		PDF EN5312QI IPC-7095B IPC-7095 7095B IPC 7095B en5312 qfn stencil

    TB389

    Abstract: No abstract text available
    Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing


    Original     		PDF TB389

    J-STD-005

    Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently


    Original     		PDF TB389 J-STD-005 nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 XQFN

    EN5311Qi

    Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil
    Text: Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package


    Original     		PDF EN5311QI EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil

    MAX3737

    Abstract: HFAN-02 MAX3737EGJ MAX3737ETJ SFF8472 NE164
    Text: 19-2818; Rev 2; 7/04 Multirate Laser Driver with Extinction Ratio Control TEMP RANGE PIN-PACKAGE MAX3737ETJ -40°C to +85°C 32 Thin QFN MAX3737ETJ+ -40°C to +85°C 32 Thin QFN MAX3737EGJ -40°C to +85°C +Denotes lead-free packaging. 32 QFN 26 APCFILT1 27 APCFILT2


    Original     		PDF OC-48 100mA MAX3737ETJ MAX3737ETJ+ MAX3737EGJ MAX3737 MAX3737 HFAN-02 MAX3737EGJ MAX3737ETJ SFF8472 NE164

    MAX3737

    Abstract: HFAN-02 MAX3737EGJ MAX3737ETJ SFF8472
    Text: 19-2818; Rev 3; 6/11 Multirate Laser Driver with Extinction Ratio Control TEMP RANGE PIN-PACKAGE MAX3737ETJ -40°C to +85°C 32 Thin QFN-EP* MAX3737ETJ+ -40°C to +85°C 32 Thin QFN-EP* MAX3737EGJ -40°C to +85°C 32 QFN-EP* +Denotes a lead Pb -free/RoHS-compliant package.


    Original     		PDF MAX3737ETJ MAX3737ETJ+ MAX3737EGJ 68mA/mA 82mA/mA 95mA/mA 62mA/mA 76mA/mA 90mA/mA MAX3737 HFAN-02 MAX3737EGJ MAX3737ETJ SFF8472

    MAX3737

    Abstract: No abstract text available
    Text: 19-2818; Rev 3; 6/11 Multirate Laser Driver with Extinction Ratio Control PART TEMP RANGE PIN-PACKAGE MAX3737ETJ -40°C to +85°C 32 Thin QFN-EP* MAX3737ETJ+ -40°C to +85°C 32 Thin QFN-EP* MAX3737EGJ -40°C to +85°C 32 QFN-EP* +Denotes a lead Pb -free/RoHS-compliant package.


    Original     		PDF MAX3737ETJ MAX3737ETJ+ MAX3737EGJ 68mA/mA 82mA/mA 95mA/mA 62mA/mA 76mA/mA 90mA/mA MAX3737

    QFN PACKAGE Junction to PCB thermal resistance

    Abstract: en5322 double sided pcb, thermal via EN5322QI J-STD-020A double sided pcb thermal
    Text: THERMAL NOTE EN5322QI DC-DC Converters September 2008 Thermal Characteristics The Enpirion EN5322QI DC-DC converter is packaged in 4x6x1.1mm, 24-pin QFN package. The QFN packages are constructed with copper lead frames that have exposed thermal pads. The recommended maximum junction temperature for


    Original     		PDF EN5322QI 24-pin QFN PACKAGE Junction to PCB thermal resistance en5322 double sided pcb, thermal via J-STD-020A double sided pcb thermal

    EN5336

    Abstract: EN5366Q QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE Junction to PCB thermal resistance EN5356 EN5365Q EN5335Q EN5365 J-STD-020A "thermal via"
    Text: THERMAL NOTE EN5365Q/EN5366Q DC-DC Converters ENPIRION Thermal Characteristics The Enpirion EN5365Q and EN5366Q DC-DC converters are packaged in 12x10x1.85mm 58-pin QFN packages that have the same thermal characteristics. The QFN packages are constructed with copper lead frames that have exposed thermal


    Original     		PDF EN5365Q/EN5366Q EN5365Q EN5366Q 12x10x1 58-pin EN5336 QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE Junction to PCB thermal resistance EN5356 EN5335Q EN5365 J-STD-020A "thermal via"

    TEXAS INSTRUMENTS, Mold Compound QFN

    Abstract: SLUA271 SLOA122 dsp layout guidelines QFN PACKAGE thermal resistance
    Text: Application Report SLOA122 – July 2006 QFN Layout Guidelines Yang Boon Quek . HPL Audio Power Amplifiers 1 Introduction Board layout and stencil information for most Texas Instruments TI Quad Flat No-Lead (QFN) devices is


    Original     		PDF SLOA122 TEXAS INSTRUMENTS, Mold Compound QFN SLUA271 SLOA122 dsp layout guidelines QFN PACKAGE thermal resistance

    temperature controller peltier 15V

    Abstract: pwm control of tec temperature controller using microcontroller PWM Regulator peltier TEC Driver peltier cooler peltier driver Peltier module MAX1978 temperature controller h bridge 15V
    Text: 19-2490; Rev 1; 2/07 Integrated Temperature Controllers for Peltier Modules ATE Ordering Information PART TEMP RANGE PIN-PACKAGE PKG CODE MAX1978ETM -40°C to +85°C 48 Thin QFN-EP* T4877-6 MAX1979ETM -40°C to +85°C 48 Thin QFN-EP* *EP = Exposed paddle.


    Original     		PDF MAX1978ETM T4877-6 MAX1979ETM MAX1978 MAX1979 MAX1978/MAX1979 temperature controller peltier 15V pwm control of tec temperature controller using microcontroller PWM Regulator peltier TEC Driver peltier cooler peltier driver Peltier module MAX1978 temperature controller h bridge 15V

    jedec package MO-247

    Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
    Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB


    Original     		PDF AC322 jedec package MO-247 qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline

    NIS5102

    Abstract: PNC0106A
    Text: AND8249/D Board Mounting Notes for NIS5102 Leadless Package QFN Prepared by: Alan Ball ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Various ON Semiconductor components are packaged in an advanced Quad Flat−Pack No−Lead Package (QFN) or


    Original     		PDF AND8249/D NIS5102 PNC0106A

    qfn 48 7x7 stencil

    Abstract: qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance
    Text: Application Note: CoolRunner, CPLD R PCB Pad Pattern Design and SurfaceMount Considerations for QFN Packages XAPP439 v1.0 April 11, 2005 Summary Xilinx Quad Flat No-Lead (QFN) package is a robust and low profile leadframe-based plastic package that has several advantages over traditional leadframe packages.The exposed die


    Original     		PDF XAPP439 qfn 48 7x7 stencil qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance

    EN5336Q

    Abstract: EN5335Q EN5336 QFN PACKAGE Junction to PCB thermal resistance via diameter pitch J-STD-020A
    Text: THERMAL NOTE EN5335Q/EN5336Q DC-DC Converters ENPIRION Thermal Characteristics The Enpirion EN5335Q and EN5336Q DC-DC converters are packaged in 10x7.5x1.85mm 44-pin QFN packages that have the same thermal characteristics. The QFN packages are constructed


    Original     		PDF EN5335Q/EN5336Q EN5335Q EN5336Q 44-pin EN5336 QFN PACKAGE Junction to PCB thermal resistance via diameter pitch J-STD-020A