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    QFN PACKAGE Search Results

    QFN PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
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    QFN PACKAGE Price and Stock

    onsemi ARRAYRDM-0112A20-QFN-TR

    NIR-enhanced for Automotive LiDAR Applications  1x12 SiPM Array, Full reel (3k pieces)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com ARRAYRDM-0112A20-QFN-TR
    • 1 -
    • 10 -
    • 100 -
    • 1000 $30.42
    • 10000 $30.42
    		Buy Now

    onsemi ARRAYRDM-0112A20-QFN-TR1

    NIR-enhanced for Automotive LiDAR Applications  1x12 SiPM Array, Partial reel (1-2999 pieces)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com ARRAYRDM-0112A20-QFN-TR1
    • 1 $66.18
    • 10 $59.21
    • 100 $54.72
    • 1000 $54.72
    • 10000 $54.72
    		Buy Now

    QFN PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    QFN 7X7

    Abstract: qfn 8x8 56 qfn 7x7 QFN 7X7 package QFN-4x4 QFN 56 7x7
    Text: Package Diagram QFN 20-Lead QFN 4x4 mm LF20 51-85163-* 48-Lead QFN (7x7 mm) LF48 51-85152-* 1 Package Diagram 56-Lead QFN (8x8 mm) 51-85144-*A 2


    Original     		PDF 20-Lead 48-Lead 56-Lead QFN 7X7 qfn 8x8 56 qfn 7x7 QFN 7X7 package QFN-4x4 QFN 56 7x7

    TPS61070

    Abstract: TPS63 TPS61000 TPS61020 TPS61029 TPS61050 TPS61081 TPS61085 TPS61090 TPS61100
    Text: Boost Converter – TPS61… 4.5A Vout 1.8 to 5.5V 4x4 QFN TPS61087 3.0 to 18.5 3x3 QFN 5.0 to 38.0 HTSSOP 1.8 to 5.5V 4x4 QFN 3.0 to 18.5 3x3 QFN 1.8 to 5.5V 3x3 QFN 1.8 to 5.5V 3x3 QFN 1.8 to 5.5V 3x3 QFN Vin to 5.5V 2.1x1.9 DSBGA 1.5 to 5.5V 4x4 QFN 2.5 to 5.5V


    Original     		PDF TPS61. TPS61030 TPS61087 TPS61028 TPS61070 TSOT-23 TPS61175 TPS61090 TPS61085 TPS61029 TPS61070 TPS63 TPS61000 TPS61020 TPS61029 TPS61050 TPS61081 TPS61085 TPS61090 TPS61100

    QFN 5x5

    Abstract: qfn stencil "exposed pad" PCB via "thermal via" solder mask P4171 X-RAY INSPECTION via diameter pitch 40-QFN QFN "exposed die"
    Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.7 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.15 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should


    Original     		PDF com/data/tb/TB389 dwg/plastic/P4171 QFN 5x5 qfn stencil "exposed pad" PCB via "thermal via" solder mask P4171 X-RAY INSPECTION via diameter pitch 40-QFN QFN "exposed die"

    QFN 5X5

    Abstract: "thermal via" qfn land pattern
    Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.5 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.17 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should


    Original     		PDF com/data/tb/TB389 dwg/plastic/P4171 QFN 5X5 "thermal via" qfn land pattern

    Device Orientation

    Abstract: device QFN12 QFN-12 QFN16 QFN-16 qfn 12
    Text: Device Orientation Vishay Siliconix Device Orientation for QFN-12/QFN-16 DEVICE ORIENTATION PACKAGE METHOD QFN-12 T1 QFN-16 T1 User Direction of Feed Revision control of this drawing is maintained through Document Control, Pack Specification-PACK-0007-15 Document Number: 72725


    Original     		PDF QFN-12/QFN-16 QFN-12 QFN-16 Specification-PACK-0007-15 08-Nov-10 Device Orientation device QFN12 QFN16 qfn 12

    AD1882AJCIZ

    Abstract: virage AD1882AJCPZ AD1882A
    Text: AD1882A High Definition Audio Codec Data Sheet DSH-202011D September 2012 Ordering Information Device Set Order ID Package Type Operating Temperature Package AD1882AJCPZ* QFN 48-Lead QFN, 7x7 mm 0 °C to +70 °C AD1882AJCIZ* QFN 48-Lead QFN, 7x7 mm -40 °C to +85 °C


    Original     		PDF AD1882A DSH-202011D AD1882AJCPZ* AD1882AJCIZ* 48-Lead MO-220-VKKD-2 AD1882AJCIZ virage AD1882AJCPZ

    AD1882AJCIZ

    Abstract: AD1882AJCPZ 882A 401F conexant hd audio Widgets
    Text: AD1882A High Definition Audio Codec Data Sheet DSH-202011C November 2009 Ordering Information Device Set Order ID Package Type Operating Temperature Package AD1882AJCPZ* QFN 48-Lead QFN, 7x7 mm 0 °C to 70 °C AD1882AJCIZ* QFN 48-Lead QFN, 7x7 mm -20 °C to 85 °C


    Original     		PDF AD1882A DSH-202011C AD1882AJCPZ* 48-Lead AD1882AJCIZ* MO-220-VKKD-2 AD1882A AD1882AJCIZ AD1882AJCPZ 882A 401F conexant hd audio Widgets

    size 0204

    Abstract: QFN PCB Layout guide TL-TORQUEDRIVER-05 TL-TORQUEDRIVER-06
    Text: GHz QFN Socket User Manual Tel: 800 404-0204 Fax: (952) 229-8201 www.ironwoodelectronics.com GHz QFN Socket User Manual Selecting QFN socket: You need to have the IC package drawing ready to select the correct QFN socket. Go to www.ironwoodelectronics.com. Select “Products” link, then under “Browse” menu, select


    Original     		PDF

    TPS630

    Abstract: TPS63000 TPS61130 TPS61170 TPS61175 TPS63 TPS63010 TPS63030
    Text: Buck-Boost Converter – TPS63… 3.0A TPS61175 2.0A TPS63010 1.8A TPS63000 Buck-Boost Boost in SEPIC Conf. new or preview Vout smallest package Vin to 38V 3x3 QFN 1.2V to 5.5V 2.1x1.9 CSP 1.2 to 5.5V 3x3 QFN Vin to 38V 2x2 QFN 2.5 to 5.5V 4x4 QFN Switch Current


    Original     		PDF TPS63. TPS63000 TPS63010 TPS61175 TPS61170 TPS61130 TPS63030 SLVT160 TPS630 TPS63000 TPS61130 TPS61170 TPS61175 TPS63 TPS63010 TPS63030

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OUTLINE 12,16,20,24L QFN THIN, 4x4x0.8 mm 21-0139 A PACKAGE OUTLINE 12,16,20,24L QFN THIN, 4x4x0.8 mm 21-0139 A


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: MPQ8636 High Efficiency, 10/20A, 18V Synchronous, Step-Down Converter FEATURES Part Number Package Input Voltage MPQ8636GLE10 QFN 3x4mm 4.5V to 18V Latch-off MPQ8636HGLE10 QFN(3x4mm) 4.5V to 18V NonLatch MPQ8636GVE20 QFN(5x4mm) 4.5V to 18V NonLatch OVP DESCRIPTION


    Original     		PDF MPQ8636 10/20A, MPQ8636GLE10 MPQ8636HGLE10 MPQ8636GVE20 MPQ8636 0A/20A MO-220.

    16L-QFN

    Abstract: 21-0102
    Text: PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM 21-0102 G 1 2 PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM 21-0102 G 1 2


    Original     		PDF

    QFN leadframe

    Abstract: omnix 5000 nsmd smd qfn stencil
    Text: AND8086/D Board Mounting Notes for Quad Flat-Pack No-Lead Package QFN http://onsemi.com APPLICATION NOTE INTRODUCTION Various ON Semiconductor components are packaged in an advanced Quad Flat–pack No–Lead Package (QFN). Because the QFN platform represents the latest in surface


    Original     		PDF AND8086/D r14525 QFN leadframe omnix 5000 nsmd smd qfn stencil

    MPLAB PM3

    Abstract: AC164322
    Text: Part Number: AC164322 - MPLAB PM3 Socket Module for 28/44L QFN This MPLAB PM3 Socket Module allows programming of 28/44L QFN packages.


    Original     		PDF AC164322 28/44L MPLAB PM3

    IPC-7095B

    Abstract: IPC-7095 7095B IPC 7095B EN5312QI en5312 qfn stencil
    Text: Enpirion, Inc. EN5312QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5312QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package


    Original     		PDF EN5312QI IPC-7095B IPC-7095 7095B IPC 7095B en5312 qfn stencil

    JESD22-A113

    Abstract: QFN-20 reflow ipc-SM-782 JESD47 JESD-47 QFN-20 JEDEC SMT reflow profile jstd for msl 3 qfn density metcal apr 5000
    Text: Silicon Laboratories SMT Soldering Guidelines for MCU Products SCOPE: For all of the Silicon Laboratories Microcontroller Products in QFN, TQFP/LQFP, and PDIP packages. I. SMT Soldering Considerations for QFN Packages • See the CARSEM QFN application note, which can be found at http://www.carsem.com/.


    Original     		PDF IPC-SM-782 APR-5000 QFN-24 -QFN11 JESD22-A113 QFN-20 reflow JESD47 JESD-47 QFN-20 JEDEC SMT reflow profile jstd for msl 3 qfn density metcal apr 5000

    TB389

    Abstract: No abstract text available
    Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing


    Original     		PDF TB389

    Untitled

    Abstract: No abstract text available
    Text: QFN Flat Lids Al2O3 Barry Industries LID-XX-XXX* *See Chart for Specific Part Number The QFN Lid Series was designed for Barry’s C-QFN Al2O3 Air Cavity Family. There are several methods of attachment. Below are some of the more common methods. QFN Lid Attachment Options:


    Original     		PDF LID-XX-000) ISO9001

    J-STD-005

    Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently


    Original     		PDF TB389 J-STD-005 nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 XQFN

    EN5311Qi

    Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil
    Text: Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package


    Original     		PDF EN5311QI EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil

    22V10A

    Abstract: LVCMOS33 LVCMOS18 QFN PACKAGE thermal resistance LVCMOS25 QFN footprint amkor mlf qfn
    Text: Using the ispGAL22V10A in the QFN Package April 2003 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is


    Original     		PDF ispGAL22V10A AN8074 22V10A 22V10 sizCMOS25 LVCMOS18 ispGAL22V10A 1800adapter 1-800-LATTICE LVCMOS33 QFN PACKAGE thermal resistance LVCMOS25 QFN footprint amkor mlf qfn

    NX2837

    Abstract: 24v to 5V 2A SW regulator NX2114 NX9415 nx211 nx2155 NX7101 QFN-32L 5X5 QFN32L NX2838
    Text: Switching Regulators Part Number Package NX4108 SOT23-5L NX4110 SOT23-5L LX13088 3x3 DFN-10L LX1918 3x3 MLP-8L LX13045A 3x3 -MLP-6L LX3005 SOIC-8 NX7101 SOIC-8 NX7102 SOIC-8, EXP NX9415 4x4 QFN-24L NX9511B 5x5 QFN-32L NX9548 5X5 QFN-32L Description Iout Vin Range


    Original     		PDF NX4108 OT23-5L NX4110 LX13088 DFN-10L LX1918 LX13045A LX3005 NX7101 NX2837 24v to 5V 2A SW regulator NX2114 NX9415 nx211 nx2155 NX7101 QFN-32L 5X5 QFN32L NX2838

    22V10

    Abstract: 22V10A LVCMOS25 LVCMOS33 ABEL plastron
    Text: Using the ispGAL22V10A in the QFN Package November 2007 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is


    Original     		PDF ispGAL22V10A AN8074 22V10A 22V10 1800adapter 1-800-LATTICE 22V10 LVCMOS25 LVCMOS33 ABEL plastron

    XR1011-QH

    Abstract: No abstract text available
    Text: 4.5-10.5 GHz GaAs Receiver QFN, 4x4mm R1011-QH March 2008 - Rev 31-Mar-08 Features Integrated LNA, Mixer and LO Buffer Amplifier 1.8 dB Noise Figure 13.0 dB Conversion Gain 4x4mm QFN Package 100% RF, DC and NF Testing General Description Mimix Broadband’s 4.5-10.5 GHz QFN packaged receiver has


    Original     		PDF 31-Mar-08 R1011-QH XR1011-QH