Untitled
Abstract: No abstract text available
Text: 1000BASE-T LOW PROFILE MAGNETICS MODULE Designed to Support 1:1 Turns Ratio Transceivers RoHS-5 peak reflow temperature rating 235°C RoHS-6 peak reflow temperature rating 245°C° Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard
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1000BASE-T
H5019
H5019NL
LOG10
L0G10
H5019T.
o85538870
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Untitled
Abstract: No abstract text available
Text: 1000BASE-T LOW PROFILE MAGNETICS MODULE Designed to Support 1:1 Turns Ratio Transceivers RoHS-5 peak reflow temperature rating 235°C RoHS-6 peak reflow temperature rating 245°C° Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard
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1000BASE-T
H5019
H5019NL
LOG10
L0G10
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JEDEC J-STD-020d
Abstract: TES 1-0511V J-STD-020D JEDEC J-STD-020d Moisture Sensitivity 56756 4932 45328 j 182 JSTD-020D 4925
Text: Product: TES 1 Series Single Output Models Moisture Sensitivity Level MSL Test Report as per IPC/JEDEC J-STD-020D Table of Contents page Tested Flowchart 1 Tested Data before Reflow 2 245℃ Temperature Reflow Profile 3 Tested Data after Reflow 4 Pictures
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J-STD-020D
code0851)
JEDEC J-STD-020d
TES 1-0511V
J-STD-020D
JEDEC J-STD-020d Moisture Sensitivity
56756
4932
45328
j 182
JSTD-020D
4925
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80826
Abstract: TES-2N traco 212 DSASW004049
Text: Product: TES 2N Series Moisture Sensitivity Level MSL Test Report as per IPC/JEDEC J-STD-020C Table of Contents Tested Flowchart Page 1 Tested Data before Reflow 2 245℃ Temperature Reflow Profile 3 Tested Data after Reflow 4 Pictures Conclusion 5-40 41
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J-STD-020C
2N-1223
code0730)
J-STD-020
80826
TES-2N
traco 212
DSASW004049
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215C
Abstract: reflow
Text: Soldering Profile Vishay Dale Soldering Profiles RECOMMENDED PROFILES FOR SOLDER REFLOW Infrared Reflow 10 Second Max. 245°C 200 1 to 5°C/Second 1 to 5°C/Second Temperature °C 100 1 to 9°C/Second Preliminary Heating 60 Seconds 200 Seconds Time Vapor Phase Reflow
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08-Jun-05
215C
reflow
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reflow profile 245
Abstract: 215C dale
Text: Soldering Profile Vishay Dale RECOMMENDED PROFILES FOR SOLDER REFLOW Infrared Reflow 10 Second Max. 245°C 200 1 to 5°C/Second 1 to 5°C/Second Temperature °C 100 1 to 9°C/Second Preliminary Heating 60 Seconds 200 Seconds Time Vapor Phase Reflow 50 Second
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12-Jan-00
reflow profile 245
215C
dale
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0501b
Abstract: No abstract text available
Text: Pb-Free Assembly Reflow Profile AP NOTE: 0501B Page 1 of 2 Figure 5-1 Classification Reflow Profile FREQUENCY CONTROLS, INC. 357 Beloit Street, P.O. Box 457, Burlington, WI 53105-0457 U.S.A. Phone 262/763-3591 FAX 262/763-2881 Email: [email protected] www.nelfc.com
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0501B
J-STD-020C,
0501b
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! E1S Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page
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HC-49/UP
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! ECCM8 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! ECCM7 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! E3WC Series Recommended Solder Reflow Methods High Temperature Solder Bath Wave Solder Low Temperature Solder Bath (Wave Solder) High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! E4WC Series Recommended Solder Reflow Methods High Temperature Solder Bath Wave Solder Low Temperature Solder Bath (Wave Solder) High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! EU Series Recommended Solder Reflow Methods High Temperature Solder Bath Wave Solder Low Temperature Solder Bath (Wave Solder) High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page
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HC-49/U
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! ES51F5 Series Recommended Solder Reflow Methods Low Temperature Solder Bath Wave Solder High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Solder Bath (Wave Solder)
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ES51F5
Sensiti50
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! EB52F5 Series Recommended Solder Reflow Methods Low Temperature Solder Bath Wave Solder High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Solder Bath (Wave Solder)
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EB52F5
Sensiti50
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! ES52F3 Series Recommended Solder Reflow Methods Low Temperature Solder Bath Wave Solder High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Solder Bath (Wave Solder)
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ES52F3
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! EB51F3 Series Recommended Solder Reflow Methods Low Temperature Solder Bath Wave Solder High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Solder Bath (Wave Solder)
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EB51F3
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J-STD-020-C
Abstract: J-STD-020C JEDEC J-STD-020c 020C reflow profile JSTD020C JEDEC wave reflow profile 245
Text: Lead-Free Reflow Profile Recommendation IPC/JEDEC J-STD-020C Reflow Parameter Minimum preheat temperature (TsMIN) Maximum preheat temperature (TsMAX) Preheat time TsMAX to TL ramp-up rate Time above temperature TL (tL ) Peak temperature (TP) Time 25 °C to TP
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J-STD-020C)
J-STD-020-C
J-STD-020C
JEDEC J-STD-020c
020C
reflow profile
JSTD020C
JEDEC wave
reflow profile 245
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Untitled
Abstract: No abstract text available
Text: 1000Base-T Low Profile Magnetics Module Designed to Support 1:1 Turns Ratios Receivers RoHS-6 peak reflow temperature rating 245°C Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard Electrical Specifications @ 25°C - Operating Temperature 0°C to 70°C
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1000Base-T
H5019BNL
HX5019BNL
HX5180NL
LOG10
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Untitled
Abstract: No abstract text available
Text: 1000Base-T Low Profile Magnetics Module Designed to Support 1:1 Turns Ratios Receivers RoHS-6 peak reflow temperature rating 245°C Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard Electrical Specifications @ 25°C - Operating Temperature 0°C to 70°C
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1000Base-T
H5019NL
LOG10
H5019NLT.
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HX5019BNL
Abstract: HX5180 MCT-211 HX5019
Text: 1000Base-T Low Profile Magnetics Module Designed to Support 1:1 Turns Ratios Receivers RoHS-6 peak reflow temperature rating 245°C Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard Electrical Specifications @ 25°C - Operating Temperature 0°C to 70°C
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1000Base-T
H5019NL
H5019BNL
HX5019BNL
HX5180NL
LOG10
HX5180
MCT-211
HX5019
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Untitled
Abstract: No abstract text available
Text: AN0333 APPLICATION NOTE 0333 REFLOW SOLDER PROFILE RECOMMENDATION Introduction This application note provides guidelines for Diodes semiconductor packages relating to: • the board mounting • recommended reflow solder profiles This guideline based on IPC/JEDEC J-STD-020D.1 March 2008.
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AN0333
J-STD-020D
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pe69012t
Abstract: H0022 H0001 H0002 H0009 H0013 H0019 H0020 H0025 PE-69012
Text: 10/100 PC CARD LAN MAGNETICS MODULES RoHS-5 peak reflow temperature rating 235°C RoHS-6 peak reflow temperature rating 245°C Low profile packages from .094” 2,39mm to .078” (1,98mm) for PC card and cardbus applications Electrical Specifications @ 25°C — Operating Temperature 0°C to 70°C
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PE-69012
H0001
H0002
H0009
H0013
H0019
H0020
H0022
H0025
H0009
pe69012t
H0022
H0001
H0002
H0013
H0019
H0020
H0025
PE-69012
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H0019
Abstract: ethernet card schematic 69012 H0009 H0019NL h0020 H0001 H0002 H0013 H0022
Text: 10/100 PC CARD LAN MAGNETICS MODULES RoHS-5 peak reflow temperature rating 235°C RoHS-6 peak reflow temperature rating 245°C Low profile packages from .094” 2,39mm to .078” (1,98mm) for PC card and cardbus applications Electrical Specifications @ 25°C — Operating Temperature 0°C to 70°C
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PE-69012
H0001
H0002
H0009
H0013
H0019
H0020
H0022
H0025
H0009
H0019
ethernet card schematic
69012
H0019NL
h0020
H0001
H0002
H0013
H0022
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