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Text: F-212 Most older products not shown in this catalog are still available. Call Samtec or see www.samtec.com/xxxx for availability and specifications. Substitute series callout for xxxx INDEX BY SERIES New product highlighted in bold. Series Description Page
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F-212
ACP-12
ACP-16
ACP-22
ACR-12
ACR-16
ACR-22
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Untitled
Abstract: No abstract text available
Text: F-206-1 samTec LOW PROHLE SOCKET STRIPS I FEATURES • Achieve low profile without sacrificing insertion depth! • Choice of four precision screw machined lead styles • Exceptionally low profile, down to 2,11mm .083" off of board • Mates with BBL or BDL
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F-206-1
S6890337
2-26904858-F
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Untitled
Abstract: No abstract text available
Text: F -1 9 9 -1 m samTec EVATED s Mates with: TYPE STRIP TS, TC , HTS, BBS, BBD. BBL. E DL, BHS, LBS I/I PLATING OPTION NO. PINS PER ROW Specifications: ESS, ESD n \ In sulator M aterial: • * Black Cilass Filled Polyester Flam m ability Rating: UL 9 4 V -0 Insulation Resistance:
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1-800-SAM
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Untitled
Abstract: No abstract text available
Text: F-206-1 samTec LOW PROHLE SOCKET STRIPS I FEATURES • Achieve low profile without sacrificing insertion depth! • Choice of four precision screw machined lead styles • Exceptionally low profile, down to 2,11mm .083" off of board • Mates with BBL or BDL
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F-206-1
852-26904858-Fax:
7747-Fax:
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Untitled
Abstract: No abstract text available
Text: F-207 IN TER C O N N EC T STR IPS BBD “ s&»Bt» HS BDL SERIES M a te s w ith : TYPE STRIP SS, SD, HSS, SL, SDL, ESS, ESD H U 1 I NO. PINS M I PER ROW U PLATING M OPTION U LEAD STYLE FEATURES • Low profile design achieves 3,89mm .153" board spacings
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F-207
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Untitled
Abstract: No abstract text available
Text: F-207 IN TER C O N N EC T STR IPS BBD “ s&»Bt» HS BDL SERIES M ates with: TYPE STRIP SS, SD, HSS, SL, SDL, ESS, ESD H U 1 I NO. PINS M I PER ROW U PLATING M OPTION U LEAD STYLE FEATURES • Low profile design achieves 3,89mm .153" board spacings when mated with SL
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F-207
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Untitled
Abstract: No abstract text available
Text: F-205-1 Mates with: TS, TD, HTS, BBS, BBD, BBL, BDL, BHS, TYPE STRIP I NO. PINS 1 I PER ROW PLATING OPTION SPECIFICATIONS For complete specifications see www.samtec.com?SS, www.samtec.com?ESS, www.samtec.com?SD or www.samtec.com?ESD SS. SD, ESS, ESD Insulator Material:
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F-205-1
84477280-Fax:
612-Fax:
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Untitled
Abstract: No abstract text available
Text: F-206-1 M a t e s w ith : TS, TD, HTS, BBS, BBD, BBL, BDL, BHS, TYPE STRIP . I NO. PINS 1 I PER ROW PLATING OPTION SPECIFICATIONS B LEAD STYLE i For complete specifications see www.samtec.com?SS, www.samtec.com?ESS, www.samtec.com?SD or www.samtec.com?ESD
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F-206-1
689CG37
972-3-752669D
852-26904858-Fax:
7747-Fax:
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Untitled
Abstract: No abstract text available
Text: F-207 M a t e s w ith : TS, TD, HTS, BBS, BBD, BBL, BDL, BHS, TYPE STRIP . I NO. PINS 1 I PER ROW PLATING OPTION SPECIFICATIONS B LEAD STYLE i For complete specifications see www.samtec.com?SS, www.samtec.com?ESS, www.samtec.com?SD or www.samtec.com?ESD —G
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F-207
852-26904858-Fax:
7747-Fax:
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Untitled
Abstract: No abstract text available
Text: F-206-1 M a te s w ith: TS, TD, HTS, BBS, BBD, BBL, BDL, BHS, TYPE STRIP . I NO. PINS • I PER ROW PLATING OPTION B LEAD STYLE i SPECIFICATIONS For complete specifications see www.samtec.com?SS, www.samtec.com?ESS, www.samtec.com?SD or www.samtec.com?ESD
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F-206-1
689CG37
7747-Fax:
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Untitled
Abstract: No abstract text available
Text: F-206-1 IN TER C O N N EC T STR IPS BBD “ s&»Bt» HS BDL SERIES M ates with: TYPE STRIP SS, SD, HSS, SL, SDL, ESS, ESD H U 1 I NO. PINS M I PER ROW U PLATING M OPTION U LEAD STYLE FEATURES • Low profile design achieves 3,89mm .153" board spacings when mated with SL
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F-206-1
2-26904858-F
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Untitled
Abstract: No abstract text available
Text: F-206-1 SUPPLEMENT m sam tec HLS & HLT SERIES M ates with: TS-1, HTS, BBS, BBL, BHS, BBD, BDL, LBS, HLT, TSB Lead sockets “float” and “self-center” when this low profile carrier is soldered. Ideal for most VP or IR processes. NO. PINS PER ROW NO. ROWS
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F-206-1
2-26904858-F
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1-800-SAMTEC-9
Abstract: No abstract text available
Text: SOCKET STRIPS M ates with: TS, TD, HTS, BBS, BBD, BBL, BDL, BHS, TYPE STRIP SPECIFICATIONS For complete specifications see www.samtec.com?SS, www.samtec.com?ESS, www.samtec.com?SD or www.samtec.com?ESD 01 thru 32 = SS, ESS Series SS. SD. ESS, ESD Insulator Material:
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Untitled
Abstract: No abstract text available
Text: F-206 IN T E R C O N N E C T S T R IP S BBD »"s&»“'»n s BDL SERIES Mates with: SS, SD, HSS, SL, SDL, ESS, ESD TYPE STRIP • ■ U 1 I NO. PINS M I PER ROW U PLATING M OPTION U LEAD STYLE FEATURES • Low profile design achieves 3,89mm .153" board spacings
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F-206
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Untitled
Abstract: No abstract text available
Text: 2 ,5 4 m m .100" SS, SD, ESD, ESS, HSS SERIES PRECISION MACHINED SOCKET STRIPS Mates with: TS, TD. HTS, BBS, BBD, BBL, BDL, BHS TYPE STRIP A I NO. PINS 1 I PER ROW PLATING OPTION D LEAD STYLE D OTHER OPTION OPTION SPECIFICATIONS For complete specifications
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408-395-59CO
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pari
Abstract: 1-800-SAMTEC-9
Text: F-206 SUPPLEMENT iamte c CARRIERSTRIPS Mates with: TS-1, HTS, BBS, BBL, BHS, BBD, BDL, LBS, HLT, TSB NO. I NO. PINS ROWS I PER ROW HLS Lead sockets “float” and “self-center” when this low profile carrier is soldered. Ideal for most VP or IR processes.
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Row95
pari
1-800-SAMTEC-9
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Untitled
Abstract: No abstract text available
Text: F-207 Mates with: TS, TD, HTS, BBS, BBD, BBL, BDL, BHS, TYPE STRIP . I NO. PINS 1 I PER ROW PLATING OPTION SPECIFICATIONS B LEAD STYLE i For complete specifications see www.samtec.com?SS, www.samtec.com?ESS, www.samtec.com?SD or www.samtec.com?ESD —G : 30 m" 0,76pm Gold contact,
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F-207
852-26904858-Fax:
7747-Fax:
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Untitled
Abstract: No abstract text available
Text: F-207 Mates with: TS, TD, HTS, BBS, BBD, BBL, BDL, BHS, TYPE STRIP . I NO. PINS • I PER ROW B PLATING OPTION SPECIFICATIONS —G =30 m" 0,76Mm Gold contact, 10mm (0,25Mm) Gold shell A dd - L su ffix fo r locking lead so cket in e n d positions. R e qu ire s S ty le -2 o r -2 2 a nd
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F-207
852-26904858-Fax:
7747-Fax:
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Untitled
Abstract: No abstract text available
Text: F-205-1 IN T E R C O N N E C T S T R IP S BBD »"s&»“'»n s BDL SERIES Mates with: SS, SD, HSS, SL, SDL, ESS, ESD TYPE STRIP NO. PINS PER ROW PLATING OPTION LEAD STYLE FEATURES Low profile design achieves 3,89mm .153" board spacings when mated with SL
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F-205-1
80-Fax:
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Untitled
Abstract: No abstract text available
Text: F-206-1 IN TER C O N N EC T STR IPS BBD “ s&»Bt» HS BDL SERIES M a te s w ith : TYPE STRIP SS, SD, HSS, SL, SDL, ESS, ESD H U 1 I NO. PINS M I PER ROW U PLATING M OPTION U LEAD STYLE FEATURES • Low profile design achieves 3,89mm .153" board spacings
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F-206-1
2-26904858-Fax:
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Untitled
Abstract: No abstract text available
Text: F-207 IN T E R C O N N E C T S T R IP S BBD “ S’M L-"H S& BDL SERIES M a te s w ith : TYPE STRIP SS, SD, HSS, SL, SDL, ESS, ESD H U 1 I NO. PINS M I PER ROW U PLATING M OPTION U LEAD STYLE FEATURES • Low profile design achieves 3,89mm .153" board spacings
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F-207
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Untitled
Abstract: No abstract text available
Text: F-206 SUPPLEMENT Mates with: TS-1, HTS, BBS, BBL, BHS, BBD, BDL, LBS, HLT, TSB B HLS Lead sockets “float” and “self-centef when this low profile carrier is soldered. Ideal for most VP or IR processes. NO. PINS PER ROW NO. ROWS PLATING OPTION OPTION —G
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F-206
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Untitled
Abstract: No abstract text available
Text: F-206 sam Tec Mates with: TS, TD, HTS, BBS, BBD, BBL, BDL, BHS, TYPE STRIP I NO. PINS 1 I PER ROW PLATING OPTION i SPECIFICATIONS For complete specifications see www.samtec.com?SS, www.samtec.com?ESS, www.samtec.com?SD or www.samtec.com?ESD SS. SD, ESS, ESD
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F-206
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Untitled
Abstract: No abstract text available
Text: F-206-1 Mates with: TS, TD, HTS, BBS, BBD, BBL, BDL, BHS, TYPE STRIP . I NO. PINS 1 I PER ROW PLATING OPTION B LEAD STYLE i SPECIFICATIONS For complete specifications see www.samtec.com?SS, www.samtec.com?ESS, www.samtec.com?SD or www.samtec.com?ESD —G =30 m" 0,76Mm Gold contact,
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F-206-1
972-3-752669D
852-26904858-Fax:
7747-Fax:
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