SMT PROCESS ROADMAP Search Results

SMT PROCESS ROADMAP Result Highlights (5)

Part	Manufacturer	Description
TMP89FS60AUG	Toshiba Electronic Devices & Storage Corporation	8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E
TMP89FS63AUG	Toshiba Electronic Devices & Storage Corporation	8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65
TMP89FS60BFG	Toshiba Electronic Devices & Storage Corporation	8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP64-1414-0.80-002
TMP89FS63BUG	Toshiba Electronic Devices & Storage Corporation	8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP52-1010-0.65-002
TMP89FS62AUG	Toshiba Electronic Devices & Storage Corporation	8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80A

SMT PROCESS ROADMAP Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
INTEL application notes Abstract: land pattern BGA 0.75 PCB design for very fine pitch csp package land pattern for TSOP 2 1mm pitch BGA socket land pattern for TSOP BGA reflow guide pcb thermal Design guide trace theta layout micro pitch BGA socket s1 SOLDER PROFILE Text: 5.0 5.1 5.2.1 MANUFACTURING CONSIDERATIONS SMT Process Many factors contribute to a high yielding assembly process. A few of the key focus areas and their contributing factors are highlighted in Table 7. 5.2 PCB Design Guidelines One of the key efforts in implementing the	Original		PDF
Sn62Pb36Ag2 Abstract: Boards for assembly with 100OHM impedance erni 32 pins connector 68 pin high density flat connector Z-PACK DIN 1.5mm header connector SMT roadmap Text: DesignCon 2005 ERNI MicroSpeed, the Revolution in Mezzanine Connection Andreas Scheck, President & CEO, ERNI Electronics, Inc. Abstract For many reasons, today’s electronic systems are being built in three rather than two dimensions. As such, inter-board connectors – “mezzanine connectors” – play an	Original		PDF
Untitled Abstract: No abstract text available Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension	Original	100kHz NOSC107M004 NOSC157M004 NOSD227M004 NOSD337M004 NOSE477M004 NOSD107M006	PDF
capacitor esr 100khz Abstract: No abstract text available Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension	Original	100kHz capacitor esr 100khz	PDF
Untitled Abstract: No abstract text available Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension	Original	100kHz NOSC107M004 NOSC157M004 NOSD227M004 NOSD337M004 NOSE477M004 NOSD107M006	PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original		PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100 Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original		PDF
Fuse m1 250C Abstract: SIEMENS b43471 B43991 SIEMENS b43405 B43876 B43875 m1 250c fuse B41684 epcos B43991 B43405 Text: Microwave Ceramics and Modules RF LTCC Filter for ISM 2.4 GHz Filter B69893K2457C101 Preliminary datasheet Features • Low Profile maximum height 0.9 mm Change History Revision Detail of change P1 First release Date 09.06.06 Author Stadler Contents Page 2	Original	B69893K2457C101 2002/95/EC 2005/747/EC Fuse m1 250C SIEMENS b43471 B43991 SIEMENS b43405 B43876 B43875 m1 250c fuse B41684 epcos B43991 B43405	PDF
B43875 Abstract: B43991 epcos B43991 EPCOS Sikorel B41684 B43876 B43405 B41684 SIEMENS b43405 B43471 Epcos B41684 Text: SAW Components SAW filter TD-SCDMA Series/type: Ordering code: B7853 B39202B7853C710 Date: Version: September 28, 2006 2.2  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.	Original	B7853 B39202B7853C710 LK39B. C61157-A8-A3 LK39A. B43875 B43991 epcos B43991 EPCOS Sikorel B41684 B43876 B43405 B41684 SIEMENS b43405 B43471 Epcos B41684	PDF
B43875 Abstract: B43876 SIEMENS b43471 SIEMENS b43405 epcos B43991 B41684 Epcos sikorel b41684 E70 ferrite core DDS2004 E16* transformer Text: SAW Components SAW Rx filter WCDMA band I Series/type: Ordering code: LK39B Date: Version: Sep. 26, 2006 1.1  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.	Original	LK39B LK39B. C61157-A8-A3 B39202B7853C710 LK39A. B43875 B43876 SIEMENS b43471 SIEMENS b43405 epcos B43991 B41684 Epcos sikorel b41684 E70 ferrite core DDS2004 E16* transformer	PDF
JAE MX34 Abstract: SMT pitch roadmap CONNECTOR jae 50 SMT roadmap JAE ffc JAE CONNECTORS FPC 0.6mm pitch MX23A MX34 TX20A Text: JAE Product guide 15/11/05 1:43 pm Page 3 CONNECTOR PRODUCT GUIDE JAE Product guide 15/11/05 1:43 pm Page 4 Board to Board SERIES AA01A No of contacts 10,30,40,60 Pitch 0.5mm Current Rating 0.2 amp PCB Mounting Method SMT Operating Temp -40 +85 degrees Reeled	Original	AA01A KX14/KX15 TX24/TX25 LOGO05/2 JAE MX34 SMT pitch roadmap CONNECTOR jae 50 SMT roadmap JAE ffc JAE CONNECTORS FPC 0.6mm pitch MX23A MX34 TX20A	PDF
B43875 Abstract: SIEMENS b43405 B43406 B41684 epcos B43991 B43991 B43876 Epcos sikorel b41684 DDS2004 B43405 Text: SAW Components SAW filter MediaFLO Series/type: Ordering code: LR24A Date: Version: June 19, 2006 1.0  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.	Original	LR24A 2002/95/EC 2005/747/EC B43875 SIEMENS b43405 B43406 B41684 epcos B43991 B43991 B43876 Epcos sikorel b41684 DDS2004 B43405	PDF
Untitled Abstract: No abstract text available Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension	Original	NOJA156 NOJB226 NOJB336 NOJC476 NOJC686 NOJC107 NOJC157 NOJD227 NOJD337 NOJE477	PDF
Untitled Abstract: No abstract text available Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension	Original	NOJE477M004# NOJV687M004# NOJA106M006# NOJB156M006# NOJB226M006# NOJB336M006# NOJC336M006# NOJC476M006# NOJC686M006# NOJD107M006#	PDF

capacitor date codes Abstract: marking codes 93 Multi-Turn Potentiometers bi marking SMD CODES BCN31 HM80 P232 P270 smd marking codes SMD resistors codes Text: BI Technologies RoHS compliance roadmap Compliance herein is the same as Pb-free and indicates meeting E.U. RoHS legislation Directive 2002/95/EC and revisions to date . Pb in Cu (brass), steel, and Al are assumed exemptions (not listed). If P/N is changing, compliant date code indicates compliant production date not shipment date (due to non-compliant inventory)	Original	2002/95/EC EC/2002/95/EC) capacitor date codes marking codes 93 Multi-Turn Potentiometers bi marking SMD CODES BCN31 HM80 P232 P270 smd marking codes SMD resistors codes	PDF
MezzSelect Abstract: FCI Connector interface hybrid 84502 meg array FCI Connector top mount 0 stand off single row header 2.0mm pitch 10mm height bergstik 2,54 SMT roadmap gig-array connector footprint SMT pitch roadmap GR-1217-CORE Text: Targeted Technology Service Speed and Integrity MezzSelect presentation – Dec 2009 – FCI ELX 1 Choose precisely what you Need What is a mezzanine connector? A mezzanine connector… …provides an electrical and mechanical connection between two printed circuits.	Original		PDF
hp laptop MOTHERBOARD pcb CIRCUIT diagram Abstract: ips 500w circuit diagram 800w class d circuit diagram schematics IRS2092 audio amplifier circuit diagram 700w audio amplifier circuit diagram schematic diagram Electronic Ballast xenon 2000w audio amplifier circuit diagram 1000w class d circuit diagram schematics IR2153 spice model circuit diagram of smps 400w DESKTOP Text: Product Line Overview Applications Key Products Energy Saving Products • Appliances • Digital Control ICs Integrated design platforms that enable customers to add energyconserving features that achieve lower operating energy costs and manufacturing Bill of Material	Original		PDF
WP-72-08 Abstract: white papers coin sensor Text: Executive Briefing Avoiding an Energy Storage Crisis: The 8 Key Competitive Advantages of Solid State Batteries By Steve Grady Introduction If electronics manufacturers have a motto, it's probably this: Innovate or Die. For years, the industry's rapid rate of innovation and	Original	WP-72-08 WP-72-08 white papers coin sensor	PDF
ic 6116 datasheet from texas instruments Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram Text: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any	Original		PDF
XC68307 Abstract: toshiba Motherboards laptop layout MC68230P XC68834 B47K PPC860 XC68836 XC68040 XCF5102 XPC604 Text: High-Performance Internal Product Portfolio Overview Issue 10 Fourth Quarter, 1995 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and	Original	MOS11 MOS13 BR729/D, XC68307 toshiba Motherboards laptop layout MC68230P XC68834 B47K PPC860 XC68836 XC68040 XCF5102 XPC604	PDF
74729 latch Abstract: dms 59 to vga SFF8470 pinout DMS59 to vga PS-91525-001 DMS-59 to 15pin QSFP passive connector xaui mini HDMI plug 74752-2301 Micro-D connectors Text: I/O Products High Speed Pluggable I/O Solutions Small Form-Factor Pluggable SFP to N-3 Cable to N-8	Original		PDF
apqp MANUAL Abstract: PPAP MANUAL INCOMING RAW MATERIAL INSPECTION checklist INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION procedure 7020037 FORD apqp manual EIA-Std-541 INCOMING RAW MATERIAL INSPECTION report format ford ppap Text: Quality Cover.QXD A M 5/24/00 5:26 PM E R I C Page 1 A N M I C R O S Y S T E M S , I N C . GA00028 Quality.qxd 5/24/00 5:29 PM Page 1 AMI CORPORATE QUALITY MANUAL AMERICAN MICROSYSTEMS, INC. 2300 Buckskin Road Pocatello, Id. 83201 Spec. #5500011 Date: 2000	Original	GA00028 QUALMAN00 GA00028PP apqp MANUAL PPAP MANUAL INCOMING RAW MATERIAL INSPECTION checklist INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION procedure 7020037 FORD apqp manual EIA-Std-541 INCOMING RAW MATERIAL INSPECTION report format ford ppap	PDF
Infineon technology roadmap for mosfet Abstract: germanium transistor pnp smd smd mosfet sot-363 microwave transistor siemens bfp 420 varactor flip chip radar 77 ghz sige Infineon automotive semiconductor technology roadmap transistor SMD DK qs siemens spc 2 SiGe PNP transistor Text: Small CHIPS for big visions Silicon Discretes www.infineon.com Never stop thinking. INTRODUCTION O n e o f t h e w o r l d ' s major manufacturers of radio frequency RF components, Infineon Technologies is committed to innovative technologies and products, flexible service and the very best supply conditions for customers and partners.	Original	B191-H7496-G1-X-7600 Infineon technology roadmap for mosfet germanium transistor pnp smd smd mosfet sot-363 microwave transistor siemens bfp 420 varactor flip chip radar 77 ghz sige Infineon automotive semiconductor technology roadmap transistor SMD DK qs siemens spc 2 SiGe PNP transistor	PDF
General Micro-electronics Abstract: SMT pitch roadmap ansys darveaux ansys CP-01019-1 Electronic Arrays FR4 thermal expansion constant vs temperature neural network BGA cte amkor flip Text: Building Reliability Into Full-Array BGAs Yuan Li, Ph.D., Anil Pannikkat, Ph.D., Larry Anderson, Tarun Verma, Bruce Euzent Altera Corporation 101 Innovation Drive, San Jose, CA 95134 Electronic Arrays, NEC, IMP and Altera Corp. He joined Altera in 1992 and is currently Director	Original		PDF

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SMT PROCESS ROADMAP Search Results

SMT PROCESS ROADMAP Result Highlights (5)

SMT PROCESS ROADMAP Datasheets Context Search

INTEL application notes

Sn62Pb36Ag2

Untitled

capacitor esr 100khz

Untitled

TAIYO PSR 4000

TAIYO PSR 4000

Fuse m1 250C

B43875

B43875

JAE MX34

B43875

Untitled

Untitled

capacitor date codes

MezzSelect

hp laptop MOTHERBOARD pcb CIRCUIT diagram

WP-72-08

ic 6116 datasheet from texas instruments

XC68307

74729 latch

apqp MANUAL

Infineon technology roadmap for mosfet

General Micro-electronics