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    SN63PB37 SOLDER WIRE 245 Search Results

    SN63PB37 SOLDER WIRE 245 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    SN63PB37 SOLDER WIRE 245 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    24-7068-1407

    Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
    Text: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com


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    sn63pb37 solder wire

    Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
    Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information


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    bellcore GR-78

    Abstract: sn63pb37 solder wire sn63pb37 solder wire shelf life kester 245 solder wire GR-78 sn63pb37 Sn62Pb36Ag02 ROSIN FLUX TYPE ROL0 245 Rosin Flux Cored Solder Kester 245
    Text: 245 No-Clean Cored W ire Product Description Reliability Properties Kester 245 No-clean Cored Wire was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have


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    PDF MIL-F-14256. GR-78 J-STD-004, IPC-TM-650, J-STD-00ions 15Jun07 bellcore GR-78 sn63pb37 solder wire sn63pb37 solder wire shelf life kester 245 solder wire sn63pb37 Sn62Pb36Ag02 ROSIN FLUX TYPE ROL0 245 Rosin Flux Cored Solder Kester 245

    kester 245 solder wire

    Abstract: bellcore GR-78 kester 245 sn63pb37 solder wire ROSIN FLUX TYPE ROL0 GR-78 sn63pb37 solder wire shelf life J-STD-004 Kester IPC-TM650
    Text: 245 No-Clean Cored W ire Product Description Reliability Properties Kester 245 No-clean Cored Wire was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have


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    PDF MIL-F-14256. GR-78 12Jul06 kester 245 solder wire bellcore GR-78 kester 245 sn63pb37 solder wire ROSIN FLUX TYPE ROL0 sn63pb37 solder wire shelf life J-STD-004 Kester IPC-TM650

    SN63PB37

    Abstract: No abstract text available
    Text: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product


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    PDF EM907 EM828 SN63PB37

    GR-78-CORE

    Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
    Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with


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    PDF 65-0n-Tien GR-78-CORE ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527

    Sn62Pb36Ag02

    Abstract: 959T kester 245 solder wire bellcore GR-78 Kester 275 sn63pb37 solder wire shelf life GR-78 IPC-TM-650 IPC-TM650 j-std-004
    Text: 275 No-Clean Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the


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    PDF J-STD-004, IPC-TM-650, 15Jun07 Sn62Pb36Ag02 959T kester 245 solder wire bellcore GR-78 Kester 275 sn63pb37 solder wire shelf life GR-78 IPC-TM-650 IPC-TM650 j-std-004

    J-STD-004

    Abstract: Kester 275 Sn62Pb36Ag02 Sn63pB37 J-STD-004 solder wire sn63pb37 solder wire IPC-TM650 952-D6 Kester Sn63
    Text: 275 No-Clean Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the


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    PDF 04Feb05 J-STD-004 Kester 275 Sn62Pb36Ag02 Sn63pB37 J-STD-004 solder wire sn63pb37 solder wire IPC-TM650 952-D6 Kester Sn63

    J-STD-004 solder wire rom1

    Abstract: kester 285 solder wire J-STD-004 Kester Kester* 1544 kester 245 solder wire kester Sn62Pb36Ag02 Sn62Pb36Ag02 IPC-TM-650 IPC-TM650
    Text: 48 Activated Rosin Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester


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    PDF J-STD-004, IPC-TM-650, J-STD-00ions 14Jun07 J-STD-004 solder wire rom1 kester 285 solder wire J-STD-004 Kester Kester* 1544 kester 245 solder wire kester Sn62Pb36Ag02 Sn62Pb36Ag02 IPC-TM-650 IPC-TM650

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    Abstract: No abstract text available
    Text: 275 No-Clean Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the


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    PDF 07Sep05

    IPC-7525

    Abstract: jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220
    Text: Fairchild Semiconductor Application Note September 2005 Revised September 2005 PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages Introduction MLP Package Construction Overview The current miniaturization trend towards higher performance in


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    PDF AN-5067 IPC-7525 jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220

    sn63pb37 solder SPHERES

    Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
    Text: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual


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    PDF AN-353-4 AN-353 AN-81. sn63pb37 solder SPHERES J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D

    S-311-P-822

    Abstract: 311P822-MC-110-AS-D 311P822-FC-110-AS-D 311P822-FC-110-AG-D 311P822-MC-110-AG-D 311P822-FC-110-BS-D 311P822-FC-110-AS-D4 311P822MC 311P822-MK-05 EIA-364-87
    Text: REVISIONS SYMBOL DESCRIPTION DATE Released Revised per RN A-149 -A APPROVAL 11/13/07 8/22/08 Source Control Drawing SHEET REVISION STATUS SH 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 REV A A A A A A A A A A A A A A A A A A A A SH 21 22 23 24 25 26


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    PDF S-311-P-822 K2000-001-14 ZK2000-001-16 ZK2000-001-19 ZK2000-001-21 ZK2000-001-22 ZK2000-001-25 ZK2000-001-27 ZK2000-001-29 ZK2000-001-31 S-311-P-822 311P822-MC-110-AS-D 311P822-FC-110-AS-D 311P822-FC-110-AG-D 311P822-MC-110-AG-D 311P822-FC-110-BS-D 311P822-FC-110-AS-D4 311P822MC 311P822-MK-05 EIA-364-87

    NASA-STD-8739

    Abstract: MIL-W-16878/6 type ET SKT 24/02 MICRO-D 37S, 9P, M24308 EIA-364-87 Hysol 4215 Micro-D connectors SAE-AMS-QQ-P-416 mil-m-24519 GLCP-30F Hysol C9-4215
    Text: Series 89 Nanominiature Connectors MIL-DTL-32139 Qualified Connectors for Mission-Critical Board-to-Wire Applications United States  United Kingdom  Germany  France  Nordic  Italy  Spain  Japan Series 89 Nanominiature Product Selection Guide


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    PDF MIL-DTL-32139 NASA-STD-8739 MIL-W-16878/6 type ET SKT 24/02 MICRO-D 37S, 9P, M24308 EIA-364-87 Hysol 4215 Micro-D connectors SAE-AMS-QQ-P-416 mil-m-24519 GLCP-30F Hysol C9-4215

    JEDEC SMT reflow profile

    Abstract: AM-6000 S4 2A JEP113-B S4 1C J-STD-020A pcb warpage in ipc standard sn63pb37 solder wire shelf life steam trap S4 4C
    Text: Soldering and Rework of the HDSM-40xx Series, HDSM-50xx Series Patented Surface Mount Seven Segment-Displays Application Note 1240 Contents • Introduction to the Surface Mount Seven Segment Display • Tape and Reel Packing • Moisture Barrier Bag • JEDEC Moisture Level Characterization


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    PDF HDSM-40xx HDSM-50xx 5988-3568EN JEDEC SMT reflow profile AM-6000 S4 2A JEP113-B S4 1C J-STD-020A pcb warpage in ipc standard sn63pb37 solder wire shelf life steam trap S4 4C

    MLP-2216

    Abstract: MLP-2230 MLP-2205 MLP-2030 MLP-2015 MLP-2233 mlp-2005 beta mlp-2205 MLP-2033 MLP-2212
    Text: A Subsidiary of Data Device Corporation 40 Orville Drive, Bohemia, NY 11716-2529 Phone: 631 244-7393; Fax: (631) 244-8893 Web site: www.bttc-beta.com MLP-2000 SERIES MINIATURE LOW-PROFILE 0.185" MAXIMUM HEIGHT MIL-STD-1553 SMT TRANSFORMERS FEATURES • N


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    PDF MLP-2000 MIL-STD-1553 MIL-STD-1553, R-08/11-0 MLP-2216 MLP-2230 MLP-2205 MLP-2030 MLP-2015 MLP-2233 mlp-2005 beta mlp-2205 MLP-2033 MLP-2212

    DSS-3330

    Abstract: DSS-3305 DSS-3333 DSS-3000 beta TRANSFORMER IPC-9503 DSS-3315 dss3305 DSS-3312 JESD22-A121
    Text: DSS-3000 SERIES A Subsidiary of Data Device Corporation 40 Orville Drive, Bohemia, NY 11716-2529 Phone: 631 244-7393; Fax: (631) 244-8893 Web site: www.bttc-beta.com DUAL SIDE-BY-SIDE MIL-STD-1553 SMT TRANSFORMERS FEATURES 0.351 Sq. In. Footprint 0.185" Max. Height


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    PDF DSS-3000 MIL-STD-1553 MIL-PRF-21038 MIL-STD-202 MIL-STD-1553, D-8/11-0 DSS-3330 DSS-3305 DSS-3333 beta TRANSFORMER IPC-9503 DSS-3315 dss3305 DSS-3312 JESD22-A121

    Untitled

    Abstract: No abstract text available
    Text: Series 89 Nanominiature Connectors Two Row Thru Hole Right Angle Printed Circuit Board 891-008 and -009 Right Angle Mount PCB Nano Connectors feature gold alloy NanoPin contacts. These nanomimiature connectors offer premium performance and reliability for demanding


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    PDF Sn63Pb37 MIL-DTL-32139. 06324/0CA77

    sn63pb37 solder wire 245

    Abstract: No abstract text available
    Text: Series 89 Nanominiature Connectors Two Row Right Angle Surface Mount 891-012 and -013 Right Angle Surface Mount PCB Nano Connectors feature gold alloy NanoPin contacts. These nanomimiature connectors offer premium performance and reliability for demanding applications. Available


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    PDF Sn63Pb37 MIL-DTL-32139. 06324/0CA77 sn63pb37 solder wire 245

    Untitled

    Abstract: No abstract text available
    Text: Double Row Connectors 891-008 and -009 Series 89 Nanominiature Connectors Double Row Thru Hole Right Angle Printed Circuit Board Right Angle Mount PCB Nano Connectors feature gold alloy TwistPin contacts. These nanomimiature connectors offer premium performance and reliability for demanding applications. Available with


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    PDF Sn63Pb37 MIL-DTL-32139. 06324/0CA77

    Untitled

    Abstract: No abstract text available
    Text: H ig h-Perfor m a n c e s eri es 8 9 Nanominiature Connectors for interconnect applications APRIL 2013 Series 89 nano miniature High density nanominiature Mil qualified and innovative Glenair circular and rectangular solutions N ow available from Glenair: Nanominiature circular and retangular connectors. The


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    PDF MIL-DTL-32139

    skt 450

    Abstract: No abstract text available
    Text: Double Row Connectors 891-012 and -013 Series 89 Nanominiature Connectors Double Row Right Angle Surface Mount Right Angle Surface Mount PCB Nano Connectors feature gold alloy TwistPin contacts. These nanomimiature connectors offer premium performance and reliability for


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    PDF Sn63Pb37 MIL-DTL-32139. 06324/0CA77 skt 450

    MS5534AM

    Abstract: DA5534 ic PRESSURE SENSOR FP4401 CAP tantal SMD "Pressure Sensor" digital output SENT protocol C6502 metal sensor interfacing with microcontroller silicon-gel-sensor MS5534
    Text: MS5534A BAROMETER MODULE ♦ ♦ ♦ ♦ Integrated pressure sensor Pressure range 300-1100 mbar 15 Bit ADC 6 coefficients for a software compensation stored on-chip ♦ 3-wire serial interface ♦ 1 system clock line 32.768 kHz ♦ Low voltage / low power


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    PDF MS5534A MS5534A DA5534 ECN493 MS5534AM ic PRESSURE SENSOR FP4401 CAP tantal SMD "Pressure Sensor" digital output SENT protocol C6502 metal sensor interfacing with microcontroller silicon-gel-sensor MS5534

    Untitled

    Abstract: No abstract text available
    Text: Double Row Connectors 891-008 and -009 Series 89 Nanominiature Connectors Double Row Thru Hole Right Angle Printed Circuit Board Right Angle Mount PCB Nano Connectors feature gold alloy TwistPin contacts. These nanomimiature connectors offer premium performance and reliability for demanding applications. Available with


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    PDF Sn63Pb37 MIL-DTL-32139. MOUNT27) 06324/0CA77