SOLDERABILITY TEST Search Results

SOLDERABILITY TEST Result Highlights (5)

Part	Manufacturer	Description	Download
FO-62.5LPBMT0-001	Amphenol Cables on Demand	Amphenol FO-62.5LPBMT0-001 MT-RJ Connector Loopback Cable: Multimode 62.5/125 Fiber Optic Port Testing .1m	Datasheet
FO-9LPBMTRJ00-001	Amphenol Cables on Demand	Amphenol FO-9LPBMTRJ00-001 MT-RJ Connector Loopback Cable: Single-Mode 9/125 Fiber Optic Port Testing .1m	Datasheet
SF-SFP28LPB1W-3DB	Amphenol Cables on Demand	Amphenol SF-SFP28LPB1W-3DB SFP28 Loopback Adapter Module for SFP28 Port Compliance Testing - 3dB Attenuation & 1W Power Consumption	Datasheet
FO-50LPBMTRJ0-001	Amphenol Cables on Demand	Amphenol FO-50LPBMTRJ0-001 MT-RJ Connector Loopback Cable: Multimode 50/125 Fiber Optic Port Testing .1m	Datasheet
SF-SFPPLOOPBK-003.5	Amphenol Cables on Demand	Amphenol SF-SFPPLOOPBK-003.5 SFP+ Loopback Adapter Module for SFP+ Port Compliance Testing - 3.5dB Copper/Optical Cable Emulation	Datasheet

SOLDERABILITY TEST Price and Stock

Filter by Manufacturer


Microchip Technology Inc VOP-SOLDERABILITY_TESTING Solderability Testing, Projected EOL: 2049-11-19
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Microchip Technology Inc	VOP-SOLDERABILITY_TESTING			28 Weeks		1 - 10 - 100 - 1000 - 10000 -	Buy Now
Microchip Technology Inc RFDS-SOLDERABILITY_TESTING Solderability Testing, Projected EOL: 2044-08-15
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Microchip Technology Inc	RFDS-SOLDERABILITY_TESTING			28 Weeks		1 - 10 - 100 - 1000 - 10000 -	Buy Now
Staffall SOLDERABILITY-TEST
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	SOLDERABILITY-TEST		1			1 $317.41 10 $317.41 100 $317.41 1000 $317.41 10000 $317.41	Buy Now
UNKNOWN SOLDERABILITYTESTING
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Bristol Electronics	SOLDERABILITYTESTING		4			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Others SOLDERABILITY TESTING
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
NexGen Digital	SOLDERABILITY TESTING		1			1 - 10 - 100 - 1000 - 10000 -	Get Quote

SOLDERABILITY TEST Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
CuCrSiTi Abstract: k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability Text: Solderability 06-June-03 Back Up Block 3 Solderability Solderability Source: STMicroelectronics 06-June-03 SO 8 Wetting force mN/mm No forced ageing Ageing : 16H150°C Good solderability of Sn coated components in SnPb Wetting balance test 235°C Zero cross time << 3 seconds	Original	06-June-03 16H150 10mN/mm 10seconds 06-Junitial CuCrSiTi k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability	PDF
Solderability Tests Abstract: AN2036 AN-2036 an2036 st joint interfacial JESD22-B102 J-STD-002 Text: AN2036 APPLICATION NOTE Solderability Tests Lead-free devices, from STMicroelectronics, are warranted to pass the solderability tests, and to form a reliable solder joint with the base material of the circuit board, using Leaded Sn-Pb solder or Lead-free	Original	AN2036 2002/95/EU, Solderability Tests AN2036 AN-2036 an2036 st joint interfacial JESD22-B102 J-STD-002	PDF
Solderability Abstract: EIA-198-2-E EIA-198 EIA-198-2E Text: 6/3/02 http:www.niccomp.com Technical Inquiries: [email protected] COMPONENT SOLDERABILITY PRODUCTS: SMT CERAMIC CHIP CAPACITORS & ARRAYS SERIES: NMC / NMC-E / NMC-L / NMC-H / NCA SOLDERABILITY SPECIFICATION >95% Coverage of terminal finish by new solder coat	Original	EIA-198-2-E Solderability EIA-198-2-E EIA-198 EIA-198-2E	PDF
Sn63Pb Abstract: flux Text: Point of note about solderability of lead free products attach “G” to package name Test Test condition Note Use of Sn-63Pb solder Bath Pass: Solder bath temperature = 230°C, Dipping time = 5 seconds solderability rate until forming The number of times = one, Use of R-type flux	Original	Sn-63Pb Sn63Pb flux	PDF
Kester 182 Abstract: No abstract text available Text: Technical Paper Solderability of Lead Free Electrodeposits in Tin/Lead Solder Dr. Robert D. Hilty & Marjorie K. Myers Tyco Electronics Harrisburg, PA Copyright Tyco Electronics, 2004 Publication 503-1001 Revision O 10NOV04 Solderability of Lead Free Electrodeposits in Tin/Lead Solder	Original	10NOV04 Kester 182	PDF
MSQ1040 Abstract: 330UH SMD 330uH Text: MINIATURE SQUARE SHIELDED SMD POWER INDUCTORS SERIES MSQ1040 FEATURES - 100% ferrite shielded. Very high current handling capacity. - Excellent solderability. High heat resistance. Low price ELECTRICAL SPECIFICATIONS - Inductance range - Test conditions 1.5uH -7uH	Original	MSQ1040 330uH) 330uH 25Vrms 100kHz 330mm MSQ1040 330UH SMD 330uH	PDF
CviLux CONNECTOR Abstract: 21/CviLux CONNECTOR Text: FFC/FPC CONNECTORS CviLux CF SYSTEM CF Technical Specifications Testing Methods of Electronic Connectors Follow Below Military Standards: Dielectric Withstanding Voltage Contact Resistance Insulation Resistance Solderability - Per MIL-STD-1344A method 3001.1	Original	MIL-STD-1344A MIL-STD-202F CviLux CONNECTOR 21/CviLux CONNECTOR	PDF
RJ11 jack dimension Abstract: RJ45 jack low profile rj45 low profile RJ45 jack dimension RJ11 rj11 jack RJ11 pcb RJ11-6Z3 RJ45 dimension dimension RJ45 Text: Series Z Unfiltered low profile jack in RJ11 and RJ45 models. Shielded and unshielded models available. Specifications Contacts Material: Plating: Barrier underplating: Resistance: Initial: After durability testing 500 mating cycles : PCB Terminals Solderability	Original	1000VAC RJ11-6Z RJ11-6Z3 RJ11-6Z4 RJ45-8Z RJ45-8Z3 RJ45-8Z4 RJ11 jack dimension RJ45 jack low profile rj45 low profile RJ45 jack dimension RJ11 rj11 jack RJ11 pcb RJ11-6Z3 RJ45 dimension dimension RJ45	PDF
Untitled Abstract: No abstract text available Text: Device Under Test: 90HBW08PT, 90HBW10PT, 90B08ST, 90B05ST, 90B10ST Environmental Test: Thermal Shock, Moisture resistance, Thermal aging, Resistance to Reflow Physical Test: Mechanical Life, Mechanical shock, Vibration Resistance, Terminal Strength Flammability, Solderability, Process seal	Original	90HBW08PT, 90HBW10PT, 90B08ST, 90B05ST, 90B10ST SM04-17 SM04-17 MIL-STD-202,	PDF
Untitled Abstract: No abstract text available Text: FHV Vishay Techno Thick Film Planar Resistors, Through-Hole, High Voltage FEATURES MECHANICAL SPECIFICATIONS Terminal Strength: 5 pound pull test Solderability: Continuous satisfactory coverage when tested in accordance with MIL-R-10509 MATERIAL SPECIFICATIONS	Original	2002/95/EC MIL-R-10509 18-Jul-08	PDF
Untitled Abstract: No abstract text available Text: Z Series Unfiltered low profile jack in RJ11 and RJ45 models. Shielded and unshielded models available. Specifications Contacts Material: Plating: Barrier underplating: Resistance: Initial: After durability testing 500 mating cycles : PCB Terminals Solderability	Original	1000VAC RJ11-6Zating: RJ11-6Z RJ11-6Z3 RJ11-6Z4 RJ45-8Z RJ45-8Z3 RJ45-8Z4	PDF
Trichloroethane Abstract: No abstract text available Text: CLOCK OSCILLATOR GENERAL CHARACTERISTICS • MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability Maximum Soldering Temp. All units 100% leak tested.	Original		PDF
UMB01P050 Abstract: No abstract text available Text: Industrial Microphotonics Company Unmounted 50W Pulsed Laser Diode Bar Part Number: UMB01P050 2.00 50.00 Optical Power W Electrical to Optical Efficiency (%) 40.00 Excellent Solderability Lot Tested Also Available from 915nm-980nm 1.50 30.00 1.00 20.00 0.50	Original	UMB01P050 915nm-980nm laser2000 D-10/01 UMB01P050	PDF
alcohol isopropylic Abstract: No abstract text available Text: Cermet Potentiometer Specifications TESTS Piher typical test results 95% LOTS R % Value DIN std 41450 R(%) Resistance to soldering heat < ±1% < ± 2% Solderability 95% of treated surface covered with solder Temperature cycling < ±2% Temperature coeficient	Original		PDF

Untitled Abstract: No abstract text available Text: CLOCK OSCILLATOR GENERAL CHARACTERISTICS MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability OSCILLATORS Maximum Soldering Temp. 44 All units 100% leak tested.	Original		PDF
posistor Abstract: H60A Text: Item Continuous Operating Temperature Resistance R25 Withstanding Voltage Tensil Strength of Lead Wire Terminal Bending Strength of Lead Wire Terminal Solderability Terminal Durability of Soldering Humidity Test Load Cycle Test at High Temperature Method of examination	Original	R/R25 posistor H60A	PDF
Untitled Abstract: No abstract text available Text: EMI Filters 4.1 to 4.7 4.1 - Production process flowchart 4.3 - Tests conducted during batch manufacture Standard products Multilayer ceramic part manufacture discoidal or planar array Solderability ● Voltage proof test DWV / Flash Solder assembly Cleaning process	Original	50Vdc 100Vdc 200Vdc 300Vdc 500Vdc	PDF
208H Abstract: No abstract text available Text: Schematic: Notes: 1. Solderability: Leads shall meet MIL-STD-202G, Method 208H fo r solderability. 2. Flammability: UL94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters	OCR Scan	MIL-STD-2026, UL94V-0 E151556 102mm) O-80-90- 10O-110-120- SHIELD/77 300MHmensions: 12x00 XF10G02C-CTxul 208H	PDF
208H Abstract: No abstract text available Text: Schematic: Notes: 1. Solderability: Leads shall meet M IL-STD-202G, Method 208H for solderability. 2. Flammability: U L94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters	OCR Scan	MIL-STD-2026, UL94V-0 E151556 102mm) SHIELD/77 2MHz-50MHz 200MHz 400MHz 500MHz 12x00 208H	PDF
208H Abstract: VE1000 Text: 2 . Sch em atic: 1. M echanical D im ensions: PRI CO CM ° o ° o E h 2 1 HIPOT: 125Vrms, Wdg to Wdg t 1 Rated Voltage: 50Vdc Rated Current: 2A Notes: 1. Solderability: Leads shall meet MIL-STD-202G, Method 208H fo r solderability. 2. Flammabllity: UL94V—0	OCR Scan	XF0406 20M-300MHz 125Vrms, 50Vdc MIL-STD-202G, UL94V-0 E151556 102mm) XF0406â 208H VE1000	PDF
Untitled Abstract: No abstract text available Text: 1. M echanical D im ensions: 1.28 Max A 2. Sch em atic: 3. E lectrical Specification s: 25°C OCL: 47uH ±20% I.O K H z 1.0V, OAdc OCL: 23.7uH±20% ®1KHz 1.0V, 11.8Adc DCR: 0.012 Ohms Max Notes: 1. Solderability: Leads shall meet M IL-STD -202, Method 208D for solderability.	OCR Scan	3XF0476â MIL-STD-202, UL94V-0 E151556 102mm)	PDF
208H Abstract: No abstract text available Text: 1. M echanical D im ensions: X o -S m tn S - r \y CM co 0.004 0.638 Max 0.453 -ir 0.059 o to CO CD K CM O SUGGESTED PAD LAYOUT) Notes: 1. Solderability: Leads shall meet MIL—STD—202G, Method 208H fo r solderability. 2. Flammability: U L 94V -0 3. ASTM oxygen index: > 28%	OCR Scan	MIL-STD-202G, UL94V-0 E151556 102mm) 10KHz XFHCL01 208H	PDF
W-S-6536 Abstract: WS6536 MIL-M38510 lead finish WS-6536 Text: Signetics SOW-2000 Solderability Acceptance Testing Statement of Work Military Products Reference Guide FEATURES • Complies with MIL-STD-2000 solderabllity requirements • Complies with WS6536E/I solderabllity requirements • Maximizes component “Shelf	OCR Scan	SOW-2000 MIL-STD-2000 WS6536E/I MIL-STD-2000 WS6536E/I MIL-STD-105, MIL-M-38510/P3 MIL-STD-2000/P5 WS6536/P4 W-S-6536 WS6536 MIL-M38510 lead finish WS-6536	PDF
P1B14 Abstract: No abstract text available Text: 2 1. M echanical Dim ensions: . Schem atic: XFMRS ► P YYWW O D 0 .1 2 5 Min Hi— pot: 0O.O2D±D.OO5 G » 0 .1 0 0 o o o o o o - 1 8 16 9 O D O O O D O o O - N o te s: 1. Solderability: Leads shall meet MIL— STD-Z0Z, Method 2 OSD fo r solderability.	OCR Scan	XF0013T13 1500Vac 100KHz UL94V-0 E151556 P1B-14 P11-9 013T1 P1B14	PDF

SOLDERABILITY TEST Search Results

SOLDERABILITY TEST Result Highlights (5)

SOLDERABILITY TEST Price and Stock

Microchip Technology Inc VOP-SOLDERABILITY_TESTING

Microchip Technology Inc RFDS-SOLDERABILITY_TESTING

Staffall SOLDERABILITY-TEST

UNKNOWN SOLDERABILITYTESTING

Others SOLDERABILITY TESTING

SOLDERABILITY TEST Datasheets Context Search

CuCrSiTi

Solderability Tests

Solderability

Sn63Pb

Kester 182

MSQ1040

CviLux CONNECTOR

RJ11 jack dimension

Untitled

Untitled

Untitled

Trichloroethane

UMB01P050

alcohol isopropylic

Untitled

posistor

Untitled

208H

208H

208H

Untitled

208H

W-S-6536

P1B14