pine alpha cleaning
Abstract: Pine Alpha AK225AES AK-225AES ST-100S
Text: HANDLING PRECAUTIONS • Soldering Conditions Please refer to each product to see if it’s compatible with lead-free soldering. Conventional Soldering Conditions SOLDERING IRON DIP SOLDERING REFLOW SOLDERING Iron Tip Temperature: 300°C Max. 30W Max. Soldering Time: 3 Seconds Max.
|
Original
|
PDF
|
AK-225AES
ST-100S
AK225AES
AAR121and
AAA121)
pine alpha cleaning
Pine Alpha
AK-225AES
ST-100S
|
T200
Abstract: T230 dip electrolytic capacitor
Text: SOLDERING CONDITIONS ALUMINUM ELECTROLYTIC CAPACITORS • Recommended soldering conditions ● Chip type aluminum electrolytic capacitors Lead free (1) Methods See the following Methods Advisability Reflow soldering Soldering iron ○ Flow soldering
|
Original
|
PDF
|
2006/2007E
2010/2011E
T200
T230
dip electrolytic capacitor
|
Untitled
Abstract: No abstract text available
Text: Quartz Crystal Units n Precautions for Use [Manual Soldering Heat Resistance] 3. Reflow Soldering The figure below shows the standards for reflow soldering Use condition: Apply 400 °C soldering iron to product terminal temperature profiles of surface-mount type crystal units.
|
Original
|
PDF
|
|
Soldering Conditions
Abstract: soldering
Text: Recommended soldering conditions of EOREX Pb-Free products 1 Surface Mount Type SMD IR reflow with a peak temperature of 260°C Wave soldering with molten solder in a 260°C soldering bath Partial lead heating via a 350°C solder iron tip 2 Through Hole Type (THD) Wave soldering with molten solder in a 260°C soldering bath
|
Original
|
PDF
|
|
wsp80
Abstract: weller wsd81 WRS3000 weller MT1500 WSD81 WQB3000 weller soldering tip wsd81 weller wsp80 WHA2000 WES50
Text: CooperTools Weller ELECTRONIC SOLDERING AND DESOLDERING TOOLS 1 Weller® Soldering Table of Contents Founded in 1945, Weller® has become the world’s leading supplier of professional quality soldering equipment, including the famous Weller® temperature controlled irons and soldering guns. Weller® also makes advanced
|
Original
|
PDF
|
WSD81
WSD161
MT1500
CT02-9564/AC/12181/25M/Printed
wsp80
weller wsd81
WRS3000
weller MT1500
WSD81
WQB3000
weller soldering tip wsd81
weller wsp80
WHA2000
WES50
|
soldering iron
Abstract: No abstract text available
Text: Soldering Irons Soldering Iron Tips Filter by Tip Shank Diameter inches Our Paragon Soldering Iron Tips Outlast Oridinary Tips Many Times Over. A selection of Paragon® Soldering Iron Tips are available for all American Beauty® Irons! Available in a variety of sizes and shapes (Chisel, Conical, Diamond, Screwdriver, etc.) that
|
Original
|
PDF
|
|
NOx sensor
Abstract: No abstract text available
Text: CP Potentiometers ! Application Notes In order to prevent danger or performance degradation, be sure to observe the following precautions in advance on 24 mm diameter CPáPotentiometers. 1. Precautions in soldering Items Soldering conditions soldering iron method
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Wire Wound Chip Inductor Ferrite LCWF Series FEATURES APPLICATIONS CONSTRUCTION • Very strong solderability by reflow soldering, soldering iron or wave soldering • Highly accurate dimensions • Automated mounting capable • Terminals are highly resistant to
|
Original
|
PDF
|
inductors12
|
Untitled
Abstract: No abstract text available
Text: MULTILAYER VARISTORS Soldering Profile REFLOW SOLDERING PROFILE Peak 230°C Soldering 10 sec. max. 230°C REFLOW SOLDERING PROFILE(Peak 250°C) Cooling 60 sec. min. Soldering 10 sec. max. 250°C 220°C 200°C 190°C 60 sec. max. 180°C 20 sec. max. 150°C
|
Original
|
PDF
|
|
vapor condensation cooling
Abstract: 45034
Text: VJ Soldering Recommendations Vishay Surface Mount Multilayer Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.
|
Original
|
PDF
|
03-Sep-09
vapor condensation cooling
45034
|
WIRE WOUND CHIP INDUCTOR
Abstract: No abstract text available
Text: Wire Wound Chip Inductor Ferrite LCWF Series FEATURES APPLICATIONS CONSTRUCTION • Very strong solderability by reflow soldering, soldering iron or wave soldering • Highly accurate dimensions • Automated mounting capable • Terminals are highly resistant to pull forces
|
Original
|
PDF
|
reliab30
WIRE WOUND CHIP INDUCTOR
|
Untitled
Abstract: No abstract text available
Text: NL03, NL05, NL08, NL10, NL12, NL20 【NL Series】 】 Wire Wound Chip Inductor Ferrite •Features －Very strong solderability by flow soldering, soldering iron or wave soldering －Highly accurate dimensions, can be mounted automatically －Terminals are highly resistant to pull forces
|
Original
|
PDF
|
100mm
250mm
28-Jan-2014
|
Untitled
Abstract: No abstract text available
Text: 页码，1/6 Products Products Product Name : Wond Chip Inductors Add to Inquiry Cart Features: Highly accurate dimensions, can be mounted automaticaly. Very strong solderability be flow soldering, soldering iron or wave soldering. Terminals are highly resistant to pull forces.
|
Original
|
PDF
|
100cyclesMeasured
24hrs
1000hrsMeasured
1000hrsMeasured
tw/style/content/CN-03a/product
|
Untitled
Abstract: No abstract text available
Text: NL03, NL05, NL08, NL10, NL12, NL20 【NL Series】 Wire Wound Chip Inductor Ferrite •Features －Very strong solderability by flow soldering, soldering iron or wave soldering －Highly accurate dimensions, can be mounted automatically －Terminals are highly resistant to pull forces
|
Original
|
PDF
|
100mm
250mm
28-Nov-2012
|
|
|
Untitled
Abstract: No abstract text available
Text: Recommended Soldering Conditions Surface mounting type 1. Mounting method with solder 1-1 Recommended reflow soldering condition In reflow soldering process, exact temperature-cycle management is essential. We recommend pre-heating before soldering, so that you can prevent not only package
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: SMC SERIES CUTTING-EDGE TECHNOLOGIES OF EMI/EMC SOLUTIONS Wound Ferrite Chip Inductors Large Current • FEATURES Very strong solderability by flow soldering, soldering iron or wave soldering. Terminals are highly resistant to pull forces. Highly resistant to mechanical shocks and pressure.
|
Original
|
PDF
|
SMC-453232-470K
SMC-453232-560K
SMC-453232-680K
SMC-453232-820K
SMC-453232-101K
SMC-453232-121K
SMC-453232-151K
SMC-453232-181K
SMC-453232-221K
SMC-453232-271K
|
JIS C7021
Abstract: JIS-C-7021 JIS C7021 B-10 JIS C 7021B-10 C7021A
Text: • Soldering Instructions Iron soldering with 1.5mm iron tip Dip and flow soldering Types Temperature of the soldering bath Maximum soldering time Distance from solder joint to case Temperature of soldering iron Maximum soldering time Distance from solder joint
|
OCR Scan
|
PDF
|
10OOhrs
1000hrs
p7021
C7021
C--25
30min-
30min
C7021
JIS C7021
JIS-C-7021
JIS C7021 B-10
JIS C 7021B-10
C7021A
|
Untitled
Abstract: No abstract text available
Text: RECOMMENDED PATTERN Pattern Dimensions Unit: mm LL1005-FH and PTL1005-F Series • LL1608-FH/FS and PTL1608-F Series LL2012-FH and PTL2012-F Series R o w Soldering R eflow Soldering R o w Soldering R eflow Soldering Flow Soldering R eflow Soldering & 0 .3 - 0.5
|
OCR Scan
|
PDF
|
LL1005-FH
PTL1005-F
LL1608-FH/FS
PTL1608-F
LL2012-FH
PTL2012-F
|
945801
Abstract: No abstract text available
Text: LEAD FINISH: GDLD BUSHING FINISH: S IL V E R SOLDERING NOTES: 1. SOLDERING TO FILTER TERMINALS: DO NOT EXCEED 2 8 0 ’C IRON TIP TEMP. 2. MACHINE/OVEN SOLDERING: DO NOT EXCEED 210'C MAX. 0.O4OÌ.OO1 3. CONTACT SCI FOR [1 .0 2 Ì.0 2 ] MORE DETAILED SOLDERING
|
OCR Scan
|
PDF
|
125pF
MIL--STD--220
150MHz
10GHz
S803-1
945801
|
Untitled
Abstract: No abstract text available
Text: Soldering Recommendations Vishay Vitramon Monolithic Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 5. Soldering Techniques: Follow the soldering curves shown on next page. A. Our tin plate nickel barrier termination Termination
|
OCR Scan
|
PDF
|
22-Sep-99
|
Untitled
Abstract: No abstract text available
Text: Soldering Conditions Recommended Pattern Pattern Dimensions Unit: mm LL2012-F Series a b c Flow Soldering 1.0-1.4 0.8 - 1.2 0.8 ~ 1.0 Reflow Soldering 1.0- 1.2 0 .6 - 1.0 0.8 - 1.2 LL1608-F/FH Series Flow Soldering 0.8 - 1.0 0.8 - 1.0 0.6 - 0.8 Reflow Soldering
|
OCR Scan
|
PDF
|
LL2012-F
LL1608-F/FH
LL1005-FH
|
Untitled
Abstract: No abstract text available
Text: SIEMENS SFH302 Silicon NPN Phototransistor Operating/Storage Temperature Range Top . TStg .-40° to +80°C Soldering Temperature (>2 mm from case bottom) Dip Soldering (Ts) t<5 s . . 260°C Iron Soldering (Ts) t<3 s . 300°C
|
OCR Scan
|
PDF
|
SFH302
OW02247
|
LQG21
Abstract: LQN2A LQP21 coil LQP21A LQS33N LQS33 lqp21
Text: SURFACE MOUNT INDUCTORS SOLDERING SOLDERING METHOD RECOMMENDED SOLDERING CONDITIONS 2. Soldering Conditions Chip coils can be flow or reflow soldered. LQS33N, LQM32C, LQP21A/31A should be reflow soldered only. Please contact Murata Electronics regarding other
|
OCR Scan
|
PDF
|
LQS33N,
LQM32C,
LQP21A/31A
LQG21
LQG21N/C
LQS33N
LQS33
LQM32C
LQP21A
LQN2A
LQP21 coil
LQS33N
lqp21
|
Untitled
Abstract: No abstract text available
Text: 10. ASSEMBLING The following describes the recommended m ethods for attach in g device to PCB’s. 1 Using a soldering iron W hen atta ch in g devices by m eans of a soldering iron, do not exceed 260°C soldering tem p eratu re and a soldering time of 10 seconds or 350°C and 3 seconds, using a groundel
|
OCR Scan
|
PDF
|
FC-70
|
