Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA352 package SOT581-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA352
OT581-1
OT581-1
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sot582
Abstract: BGA388
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 2.15 mm SOT582-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X e1 v M B b e ∅w M y v M A AF AD AB Y V T P M K H F D B AE AC AA
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BGA388:
OT582-1
sot582
BGA388
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sot583
Abstract: BGA456 BGA-456
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 2.15 mm SOT583-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X e1 v M B b e ∅w M y v M A AF AD AB Y V T P M K H F D B AE AC AA
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BGA456:
OT583-1
sot583
BGA456
BGA-456
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BGA352
Abstract: sot581
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A AF AE AC AA W U R N L J G E
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BGA352:
OT581-1
BGA352
sot581
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BGA456
Abstract: sot584
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm SOT584-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X k k C e1 v M B b e ∅w M AF AE AD AC AB AA Y W V U T R P N M L K
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BGA456:
OT584-1
BGA456
sot584
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BGA456
Abstract: MS-034 BGA-456
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm SOT584-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AF AD AB Y V T P M K H
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BGA456:
OT584-1
MS-034
BGA456
MS-034
BGA-456
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MS-034
Abstract: No abstract text available
Text: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C AK AJ AH AG AF AE AD AC
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BGA596:
OT587-1
MS-034
MS-034
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MS-034
Abstract: No abstract text available
Text: PDF: 2001 Jun 27 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C AJ AG AE AC AA W U R N
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BGA596:
OT587-1
MS-034
MS-034
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA553 package SOT589-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA553
OT589-1
OT589-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA596 package SOT587-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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Original
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BGA596
OT587-1
OT587-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA456 package SOT584-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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Original
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PDF
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BGA456
OT584-1
OT584-1
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Untitled
Abstract: No abstract text available
Text: Package outline SOT589-1 BGA553: plastic ball grid array package; 553 balls; body 37.5 x 37.5 x 1.75 mm B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 AJ AG AE AC AA W U R N L J G E C A ∅v ∅w b e M M C A B C AH AF AD AB e Y V T e2 P M K H F D B
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OT589-1
BGA553:
MS-034
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BGA352
Abstract: MS-034 ED-7311-9A
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C AF AE AD AC AB AA Y W
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BGA352:
OT581-1
MS-034
ED-7311-9A
BGA352
MS-034
ED-7311-9A
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BGA-596
Abstract: sot587 3445 BGA596
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 b e AJ AG AE AC AA W U R N L J G E C v M B ∅w M y y1 C
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BGA596:
OT587-1
BGA-596
sot587
3445
BGA596
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sot589
Abstract: No abstract text available
Text: PDF: 2000 Apr 13 Philips Semiconductors Package outline BGA553: plastic ball grid array package; 553 balls; body 37.5 x 37.5 x 1.75 mm SOT589-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A AJ AG AE AC AA W U R N
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BGA553:
OT589-1
sot589
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sot586
Abstract: No abstract text available
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 2.15 mm SOT586-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X e1 AJ AG AE AC AA W U R N L J G E C A v M B b e y ∅w M v M A AK
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BGA596:
OT586-1
sot586
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA656 package SOT588-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA656
OT588-1
OT588-1
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Untitled
Abstract: No abstract text available
Text: Package outline BGA656: plastic ball grid array package; 656 balls; body 40 x 40 x 1.75 mm SOT588-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E
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BGA656:
OT588-1
MS-034
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MS-034
Abstract: k 3683 BGA-596
Text: PDF: 2003 Jan 27 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 2.15 mm SOT586-1 B D A D1 ball A1 index area A E1 E A2 A 1 detail X C e1 ∅v M C A B b 1/2 e e y1 C y ∅w M C AK AH AF AD AB Y V T
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BGA596:
OT586-1
MS-034
MS-034
k 3683
BGA-596
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k 3683
Abstract: MS-034 BGA656
Text: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA656: plastic ball grid array package; 656 balls; body 40 x 40 x 1.75 mm SOT588-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AK AJ AH AG AF AE AD AC
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BGA656:
OT588-1
MS-034
k 3683
MS-034
BGA656
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BGA516
Abstract: sot585 BGA-516
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA516: plastic ball grid array package; 516 balls; body 35 x 35 x 2.15 mm SOT585-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X e1 v M B b e ∅w M y v M A AF AE AC AA W U R N L J G E C AD AB Y
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BGA516:
OT585-1
BGA516
sot585
BGA-516
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MS-034
Abstract: SOT587-2 sot587 BGA-596
Text: PDF: 2001 Jun 27 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-2 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C AJ AG AE AC AA W U R N
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BGA596:
OT587-2
MS-034
MS-034
SOT587-2
sot587
BGA-596
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Untitled
Abstract: No abstract text available
Text: TDA2540 TDA2540Q TELEVISION I.F. AMPLIFIER AND DEMODULATOR The T D A 2 5 4 0 is an i.f. a m p lifie r and dem odu la tor c irc u it fo r co lo u r and black and w h ite television receivers using n-p-n tuners. It incorporates the fo llo w in g functions: —
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OCR Scan
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PDF
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TDA2540
TDA2540Q
7Z7I828
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Untitled
Abstract: No abstract text available
Text: TDA2523 TDA2523Q CO LO U R DEM O D U LATO R COM BINATION The TDA2523 is an integrated synchronous dem odulator combination fo r colour television re c e iv e rs incorporating the following functions : - 8 , 8 MHz o sc illa to r followed by a divider giving two 4, 4 MHz signals used a s refe re n c e
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OCR Scan
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TDA2523
TDA2523Q
V12-4
V14-4
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