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Vishay Intertechnologies FSOT7509E10R00JE Res Wirewound 10Ohm 5% 95W 400ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT7509E10R00JE)
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Vishay Intertechnologies FSOT7509E1K000JE Res Wirewound 1KOhm 5% 95W 260ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT7509E1K000JE)
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Avnet Americas	FSOT7509E1K000JE	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Vishay Intertechnologies FSOT7509E600R0JE Res Wirewound 600Ohm 5% 95W 260ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT7509E600R0JE)
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Avnet Americas	FSOT7509E600R0JE	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Vishay Intertechnologies FSOT7509E20R00JENI Res Wirewound 20Ohm 5% 95W 260ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT7509E20R00JENI)
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Avnet Americas	FSOT7509E20R00JENI	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Vishay Intertechnologies FSOT7509E620R0JE Res Wirewound 620Ohm 5% 95W 260ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT7509E620R0JE)
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Avnet Americas	FSOT7509E620R0JE	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote

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SOT75 Datasheets (17)

Part	Manufacturer	Description	Datasheet Type	PDF
SOT750a	NXP Semiconductors	leadless surface mounted package; plastic cap; 28 terminations	Original	PDF
SOT751-1	NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm	Original	PDF
SOT751-1	NXP Semiconductors	Footprint for reflow soldering SOT751-1	Original	PDF
SOT751-2	NXP Semiconductors	Footprint for reflow soldering SOT751-2	Original	PDF
SOT751-2	NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm	Original	PDF
SOT753	NXP Semiconductors	Plastic surface-mounted package; 5 leads	Original	PDF
SOT753	NXP Semiconductors	Footprint for reflow soldering SOT753	Original	PDF
SOT753	NXP Semiconductors	Footprint for wave soldering SOT753	Original	PDF
SOT753_125	NXP Semiconductors	Tape reel SMD; reversed product orientation 12NC ending 125	Original	PDF
SOT754-1	NXP Semiconductors	Footprint for reflow soldering SOT754-1	Original	PDF
SOT754-1	NXP Semiconductors	Plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm	Original	PDF
SOT758-1	NXP Semiconductors	Footprint for reflow soldering SOT758-1	Original	PDF
SOT758-1_118	NXP Semiconductors	HVQFN16; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118	Original	PDF
SOT758-2	NXP Semiconductors	HVQFN16: plastic thermal enhanced very thin quad flat package	Original	PDF

SOT758-3	NXP Semiconductors	Footprint for reflow soldering SOT758-3	Original	PDF
SOT758-3	NXP Semiconductors	Plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm	Original	PDF
SOT759-1	NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 228 balls; body 12 x 12 x 1.05 mm	Original	PDF

SOT75 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: SOT753 Tape reel SMD; reversed product orientation 12NC ending 125 Rev. 1 — 26 November 2012 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel QA Seal Cover tape	Original	PDF	OT753 msc074
Untitled Abstract: No abstract text available Text: Reflow soldering footprint Footprint information for reflow soldering of HVQFN16 package SOT758-1 Hx Gx D P 0.025 0.025 C 0.105 SPx Hy SPy tot nSPx Gy SPy nSPy SLy By Ay SPx tot SLx Bx Ax solder land solder paste deposit solder land plus solder paste occupied area	Original	PDF	HVQFN16 OT758-1 sot758-1
Untitled Abstract: No abstract text available Text: Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm B D SOT758-2 A terminal 1 index area E A A1 c detail X e1 1/2 e v w b e 5 8 M M C C A B C y1 C y L 9 4 e e2 Eh 1/2 e 1 12 16 terminal 1	Original	PDF	HVQFN16: OT758-2 protr075 MO-220
sot751 Abstract: No abstract text available Text: PDF: 2003 Mar 20 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm A B D SOT751-1 ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J	Original	PDF	LFBGA80: OT751-1 sot751
BAP70Q Abstract: No abstract text available Text: BAP70Q Quad PIN diode attenuator Rev. 2 — 6 March 2012 Product data sheet 1. Product profile 1.1 General description Quad PIN diode in a SOT753 package. 1.2 Features and benefits        4 PIN diodes in a SOT753 package 300 kHz to 4 GHz	Original	PDF	BAP70Q OT753 BAP70Q
sot756 Abstract: No abstract text available Text: PDF: 2002 Mar 29 Philips Semiconductors Package outline SOT756 Plastic single-ended surface mounted package; 5 leads D A D1 A1 D2 E2 mounting base E E1 HE 1 2 3 4 e Lp 5 c w M b Q 2.5 5 mm scale DIMENSIONS mm are the original dimensions UNIT A A1 max. b	Original	PDF	OT756 sot756
SOT753 Abstract: SOT-753 Text: Package outline Philips Semiconductors Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 1 2 mm scale DIMENSIONS mm are the original dimensions UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100	Original	PDF	OT753 SC-74A SOT753 SOT-753
Untitled Abstract: No abstract text available Text: PC board footprint NXP Semiconductors Footprint for reflow soldering SOT753 SC-74A 3.45 1.95 0.45 0.55 (5x) (5×) 0.95 3.3 2.825 solder lands solder resist 0.95 solder paste occupied area 2.4 Dimensions in mm 0.7 (5×) 0.8 (5×) sot753_fr SOT753_fr PDF	Original	PDF	OT753 SC-74A) sot753
Untitled Abstract: No abstract text available Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm B D SOT754-1 A ball A1 index area A E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C V e U T R P N M K L F D B e2 J H 1/2 e G E C A ball A1	Original	PDF	TFBGA256: OT754-1 MO-216
Untitled Abstract: No abstract text available Text: PC board footprint NXP Semiconductors Footprint for wave soldering SOT753 SC-74A 5.3 1.5 (4x) solder lands 1.475 solder resist 5.05 0.45 occupied area 1.475 Dimensions in mm preferred transport direction during soldering 1.45 (5×) 2.85 sot753_fw SOT753_fw	Original	PDF	OT753 SC-74A) sot753
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	LFBGA80 OT751-2 OT751-2
Untitled Abstract: No abstract text available Text: BAP70Q Quad PIN diode attenuator Rev. 2 — 6 March 2012 Product data sheet 1. Product profile 1.1 General description Quad PIN diode in a SOT753 package. 1.2 Features and benefits        4 PIN diodes in a SOT753 package 300 kHz to 4 GHz	Original	PDF	BAP70Q OT753
BAP70Q Abstract: No abstract text available Text: BAP70Q Quad PIN diode attenuator Rev. 1 — 6 October 2010 Product data sheet 1. Product profile 1.1 General description Quad PIN diode in a SOT753 package. 1.2 Features and benefits 4 PIN diodes in a SOT753 package 300 kHz to 4 GHz High linearity	Original	PDF	BAP70Q OT753 BAP70Q
sot751 Abstract: No abstract text available Text: PDF: 2003 Sep 16 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M b ∅w M M L K J H G F E D C B A	Original	PDF	LFBGA80: OT751-2 sot751

Untitled Abstract: No abstract text available Text: BAP64Q Quad PIN diode attenuator Rev. 1 — 7 October 2010 Product data sheet 1. Product profile 1.1 General description Quad PIN diode in a SOT753 package. 1.2 Features and benefits ̈ ̈ ̈ ̈ ̈ ̈ ̈ 4 PIN diodes in a SOT753 package 300 kHz to 4 GHz High linearity	Original	PDF	BAP64Q OT753
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA256 package SOT754-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	TFBGA256 OT754-1 OT754-1
Untitled Abstract: No abstract text available Text: 6 N1 QF HV SOT758-1 HVQFN16; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 2 — 18 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape	Original	PDF	OT758-1 HVQFN16; 001aak603 OT758-1
Untitled Abstract: No abstract text available Text: Reflow soldering footprint Footprint information for reflow soldering of HVQFN16 package SOT758-3 Hx Gx D P 0.025 0.025 C 0.105 SPx Hy SPy tot nSPx Gy SPy nSPy SLy By Ay SPx tot SLx Bx Ax solder land solder paste deposit solder land plus solder paste occupied area	Original	PDF	HVQFN16 OT758-3 sot758-3
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	LFBGA80 OT751-1 OT751-1
Untitled Abstract: No abstract text available Text: Package outline Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 1 2 mm scale DIMENSIONS mm are the original dimensions UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26	Original	PDF	OT753 SC-74A
Untitled Abstract: No abstract text available Text: Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm SOT758-3 B D D1 A terminal 1 index area A4 E1 E A c A1 detail X e1 e 1/2 e b 5 8 v w M M C C A B C y1 C y L 4 9 e e2 Eh 1/2 e 1 12 terminal 1	Original	PDF	HVQFN16: OT758-3 MO-220
Untitled Abstract: No abstract text available Text: Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y ∅w M C M L K J H G F E D C B A ball A1 index area y1 C ∅v M C A B b e e2	Original	PDF	LFBGA80: OT751-2
sot750 Abstract: No abstract text available Text: PDF: 2003 Sep 23 Philips Semiconductors Package outline Leadless surface mounted package; plastic cap; 28 terminations 14x e Z D2 1 2 3 SOT750A (63×) b 4 5 6 7 8 9 Z E2 28 10 27 11 26 12 25 13 24 14 L (63×) Z E1 (18×) 23 22 21 20 19 18 17 16 15 Z D1 (14×)	Original	PDF	OT750A sot750
HVQFN16 Abstract: MO-220 sot758 SOT758-1 Text: PDF: 2002 Oct 22 Philips Semiconductors Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm A B D SOT758-1 terminal 1 index area A E A1 c detail X e1 C 1/2 e e 5 y y1 C v M C A B w M C	Original	PDF	HVQFN16: OT758-1 MO-220 HVQFN16 MO-220 sot758 SOT758-1

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SOT75 Price and Stock

Vishay Intertechnologies FSOT7509E10R00JE

Vishay Intertechnologies FSOT7509E1K000JE

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Vishay Intertechnologies FSOT7509E620R0JE

SOT75 Datasheets (17)

SOT75 Datasheets Context Search

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sot751

BAP70Q

sot756

SOT753

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BAP70Q

sot751

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sot750

HVQFN16