| SOT909-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT909-1 |
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Original |
PDF
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| SOT909-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 4 x 4 x 0.85 mm |
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Original |
PDF
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| SOT909-1_115 |
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NXP Semiconductors
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HVSON8; reel pack; standard product orientation;12NC ending 115 |
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Original |
PDF
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| SOT909-1_118 |
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NXP Semiconductors
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HVSON8; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
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Original |
PDF
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