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    Unisem

    Abstract: MIC2563A MP8000C MP-8000
    Text: UNISEM M BERHAD RELIABILITY & QUALITY ASSURANCE Co. No.: 183314-V QUALIFICATION LOT LABORATORY REPORT DESCRIPTION: MICREL LEAD-FREE PACKAGE SOLDERABILTY (MATTE TIN) LOT INFORMATION: Customer Package Device Lot # Serial # Die Attach Mold Comp. Date Code Pad Size


    Original     		83314-V 28SSOP MIC2563A 3A3275M42 SS16149 MP8000C 9-Dec-03 QU-2003-0144 Unisem MIC2563A MP8000C MP-8000 PDF