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    PCN0515

    Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
    Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently


    Original     		PDF PCN0515 HC-100 UL-94 1x1011 PCN0515 sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC

    PCN0516

    Abstract: G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
    Text: PROCESS CHANGE NOTIFICATION PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES Change Description: Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array PBGA packaged devices. Devices in 225, 256, and 672 pin PBGA


    Original     		PDF PCN0516 x10-5/C x102N/mm2 UL-94 1X10E12 PCN0516 G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo

    sumitomo g770

    Abstract: SY56016 MIC69103 MIC44F18 0722L G770 sumitomo G770 MIC5318 MIC94069 MIC5232
    Text: UNISEM MLF Lead Free Package Rel Data NiPdAu Plating - Green Compound Sumitomo G770 High Temperature Storage Life +150 deg C, 1000 hours Device Lot No Pkg MSL Soak Date Code SS # Reject Hrs. MIC94060 YML 3A23056MNF MLF1216D-4 L1 0610 76 1000 MIC5319 2.9YML


    Original     		PDF MIC94060 3A23056MNF MLF1216D-4 MIC5319 7A46521MED 7A46521MEC MLF22D-6 MIC5305 sumitomo g770 SY56016 MIC69103 MIC44F18 0722L G770 sumitomo G770 MIC5318 MIC94069 MIC5232

    PCN0712

    Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
    Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array


    Original     		PDF PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100

    Tsi148-133IL

    Abstract: G770* sumitomo ablebond 2100A TSI148-133CL 2100a epoxy G770J A1001-01 8355F A1001 seal sumitomo
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1001-01 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: Apr 2, 2010 TSI148-133CL TSI148-133IL


    Original     		PDF A1001-01 TSI148-133CL TSI148-133IL Tsi148-133IL G770* sumitomo ablebond 2100A TSI148-133CL 2100a epoxy G770J A1001-01 8355F A1001 seal sumitomo

    SUMITOMO CRM1076

    Abstract: sumitomo g770hcd JESD22-A113 SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01R1 DATE: 4-Jun-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers


    Original     		PDF A1004-01R1 4-Jun-2010 VFQFP-N-32 2-Jul-2010 S395CKLF 9LVRS395CKLFT 9LVRS395ENGKLF 9LVRS395ENGKLFT 9LVRS396AKLF 9LVRS396AKLFT SUMITOMO CRM1076 sumitomo g770hcd JESD22-A113 SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H

    JESD22-A118

    Abstract: SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01 DATE: 2-Apr-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers


    Original     		PDF A1004-01 2-Apr-2010 VFQFP-N-32 2-Jul-2010 S395CKLF 9LVRS395CKLFT 9LVRS395ENGKLF 9LVRS395ENGKLFT 9LVRS396AKLF 9LVRS396AKLFT JESD22-A118 SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly

    sumitomo g770

    Abstract: G770* G770 mold compound Sumitomo 1000 JESD47E G770 mold compound G770* sumitomo G770 APP4132 Maxim date code DS2431 SUYIN 4 pin battery contact connector G770 sumitomo
    Text: Maxim > App Notes > 1-Wire devices Keywords: SFN, attachment, IC package, 1-Wire, 1Wire, calibration, authentication, monitoring, accessory, consumable, electromechanical contact Nov 26, 2007 APPLICATION NOTE 4132 Attachment methods for the electro-mechanical SFN package


    Original     		PDF DS2431 1024-Bit DS2432 DS28E01-100 com/an4132 AN4132, APP4132, Appnote4132, sumitomo g770 G770* G770 mold compound Sumitomo 1000 JESD47E G770 mold compound G770* sumitomo G770 APP4132 Maxim date code DS2431 SUYIN 4 pin battery contact connector G770 sumitomo

    sumitomo g770

    Abstract: SUYIN 4 pin battery contact connector G770 mold compound G600 mold compound G770* G770 mold compound Sumitomo 1000 G770* sumitomo SUYIN battery connector smt DS2431 SUYIN BATTERY CONNECTOR maxim CODE TOP MARKING
    Text: Maxim > App Notes > 1-Wire Devices Keywords: SFN, attachment, IC package, 1-Wire, 1Wire, calibration, authentication, monitoring, accessory, consumable, electro-mechanical contact Nov 26, 2007 APPLICATION NOTE 4132 Attachment Methods for the Electro-Mechanical SFN Package


    Original     		PDF com/an4132 DS2431: DS2432: DS28E01-100: AN4132, APP4132, Appnote4132, sumitomo g770 SUYIN 4 pin battery contact connector G770 mold compound G600 mold compound G770* G770 mold compound Sumitomo 1000 G770* sumitomo SUYIN battery connector smt DS2431 SUYIN BATTERY CONNECTOR maxim CODE TOP MARKING

    sac305

    Abstract: G770* sumitomo ABL-2100A G770J 2100a epoxy G770 sumitomo epoxy HSBGA VSC452XHW-02 secret
    Text: Package Material Composition and Mass Calculation Customer:Vitesse Package:23x23 HSBGA Device Type:VSC452XHW-02 Die Size: 7100 X 7300 um Total Pck. Weight g : 2675.785 Provided By: Gerry Alamillo Date: 2007/08/14 name Mold Compound Substrate Silicon Die Attach


    Original     		PDF 23x23 VSC452XHW-02 G770J sac305 G770* sumitomo ABL-2100A G770J 2100a epoxy G770 sumitomo epoxy HSBGA VSC452XHW-02 secret

    nitto GE

    Abstract: GE-7470L-A G770H GE-74 sumitomo g770h GE mold compound Nitto HI-3582PCI-10 mold compound 7470-LA
    Text: Assembly Location and Mold Compound Change for QFN Packages Product Change Notice PCN0806 v1.0 September 12, 2008 Overview This notice describes two changes to the ARINC 429 and MIL-STD 1553 family of devices which are manufactured in QFN packages: o Assembly plant location change for all QFN Packages (40PCS, 44PCS, and 64PCS) from current CARSEM,


    Original     		PDF 40PCS, 44PCS, 64PCS) GE-7470L-A PCN0806 JESD46-C, QR-8033 QFN-64 nitto GE G770H GE-74 sumitomo g770h GE mold compound Nitto HI-3582PCI-10 mold compound 7470-LA

    sumitomo g770hcd

    Abstract: G770H G770HC QMI519 Sumitomo G770HC g770HCD 8200T G770* sumitomo 9UMS9610BKLFT G770
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0907-03 DATE: 25-Aug-2009 Product Affected: 6mm x 6mm VFQFPN-48 (Green) Refer to Attachment II for the affected part numbers


    Original     		PDF A0907-03 25-Aug-2009 VFQFPN-48 25-Nov-2009 JESD22-A110 JESD22-A103 JESD22-A113. 9UM702AKLF 9UM702AKLFT sumitomo g770hcd G770H G770HC QMI519 Sumitomo G770HC g770HCD 8200T G770* sumitomo 9UMS9610BKLFT G770

    G770H

    Abstract: JESD22-B105 G770HC Sumitomo G770HC
    Text: 11/22/2005 PACKAGE RELIABILITY REPORT FOR NSEB, 2 SFN, 6x6x0.88um, Pb-Free Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292


    Original     		PDF JESD22-B105, G770H JESD22-B105 G770HC Sumitomo G770HC

    led constant current driver 700mA

    Abstract: led constant current driver 500mA G770HT sumitomo "luxeon LED Driver" ablebond 8290 da1002 G770* sumitomo Lumileds Luxeon driver schematic BAT42WS
    Text: SP7618 Solved by TM Constant Current LED Driver • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ FEATURES Very low dropout voltage 100mV @ 1A Accurate current regulation down to dropout voltage No external components Built-in current DAC Output current adjustable with 33.3 mA/steps


    Original     		PDF SP7618 100mV SP7619 SP7618/SP7619 -2000V /-100mA led constant current driver 700mA led constant current driver 500mA G770HT sumitomo "luxeon LED Driver" ablebond 8290 da1002 G770* sumitomo Lumileds Luxeon driver schematic BAT42WS

    PXA270 jtag flash programming

    Abstract: PXA270 BGA 23X23 blackberry LCD h3 0925 pxa270c motorola MCX 90 radio Intel pxa270 63 ball Vfbga thermal resistance MCX 90 motorola
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270 PXA270 jtag flash programming BGA 23X23 blackberry LCD h3 0925 pxa270c motorola MCX 90 radio Intel pxa270 63 ball Vfbga thermal resistance MCX 90 motorola

    pxa270

    Abstract: PXA270 instruction set BGA 23X23 fnd display h3 0925 motorola MCX 90 radio MCX 90 motorola xscale PXA270 PXA27x core developers guide PXA27x Processor Family
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet n n n n n n n n n n High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270 PXA270 instruction set BGA 23X23 fnd display h3 0925 motorola MCX 90 radio MCX 90 motorola xscale PXA270 PXA27x core developers guide PXA27x Processor Family

    pxa270c

    Abstract: tray bga 23x23 blackberry LCD PXA270C0C416 PXA270 jtag flash programming 63 ball Vfbga thermal resistance rtpxa270c0c520 356-ball Universal Subscriber Identity Module pxa25
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270 RCPXA270C0C312 RCPXA270C0C416 RCPXA270C0C520 RCPXA270C0C624 RTPXA270C0C312 RTPXA270C0C416 RTPXA270C0C520 RTPXA270C0C624 13x13x1 pxa270c tray bga 23x23 blackberry LCD PXA270C0C416 PXA270 jtag flash programming 63 ball Vfbga thermal resistance 356-ball Universal Subscriber Identity Module pxa25

    PXA270 instruction set

    Abstract: blackberry LCD PXA27x core developers guide pxa270 user guide Intel pxa270 PXA270 G770L intel 28000 BGA 23X23 0.8 23X23
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270 Glossary-14 PXA270 instruction set blackberry LCD PXA27x core developers guide pxa270 user guide Intel pxa270 G770L intel 28000 BGA 23X23 0.8 23X23

    G770LE

    Abstract: PXA270 instruction set blackberry LCD 63 ball Vfbga thermal resistance Intel pxa270 Intel XScale PXA270 pxa25 PXA270 programmer guide pxa270 PXA270 usb
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270 Glossary-14 G770LE PXA270 instruction set blackberry LCD 63 ball Vfbga thermal resistance Intel pxa270 Intel XScale PXA270 pxa25 PXA270 programmer guide PXA270 usb

    Untitled

    Abstract: No abstract text available
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270

    PXA255 MARVELL

    Abstract: Marvell pxa270 XScale PXA270 520Mhz AP270M Marvell PXA270M 520MHz Marvell pxa255 marvell pxa270m marvell ibis PXA270M pxa270
    Text: Cover Marvell PXA270 Processor Electrical, Mechanical, Thermal Specification Doc. No. MV-S104690-00 , Rev. D April 2009 Marvell. Moving Forward Faster Released PXA270 Processor Electrical, Mechanical, and Thermal Specification Document Conventions Note: Provides related information or information of special importance.


    Original     		PDF PXA270 MV-S104690-00 PXA270 MV-S104690-00 PXA255 MARVELL Marvell pxa270 XScale PXA270 520Mhz AP270M Marvell PXA270M 520MHz Marvell pxa255 marvell pxa270m marvell ibis PXA270M