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    SURFACE MOUNT ASSEMBLY INSTRUCTION Search Results

    SURFACE MOUNT ASSEMBLY INSTRUCTION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD4164F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    BLM15PX121BH1D Murata Manufacturing Co Ltd FB SMD 0402inch 120ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM15PX181SH1D Murata Manufacturing Co Ltd FB SMD 0402inch 180ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM21HE802SN1L Murata Manufacturing Co Ltd FB SMD 0805inch 8000ohm NONAUTO Visit Murata Manufacturing Co Ltd

    SURFACE MOUNT ASSEMBLY INSTRUCTION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BGA PACKAGE TOP MARK

    Abstract: socket
    Text: GHZ BGA Probe Adapter surface mount Assembly Instructions 1. Reflow Socket Base assembly to the target PCB (as per BGA surface mount foot soldering instructions). 2. Place the square piece of elastomer provided into the socket base (rotation and orientation as shown).


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: GHZ BGA Probe Adapter surface mount Assembly Instructions 1. Reflow Socket Base assembly to the target PCB (as per BGA surface mount foot soldering instructions). 2. Place the square piece of elastomer provided into the socket base (rotation and 'side up' orientation are not critical).


    Original     		PDF

    BGA PACKAGE TOP MARK

    Abstract: No abstract text available
    Text: GHZ BGA Probe Adapter surface mount Assembly Instructions 1. Reflow Socket Base assembly to the target PCB (as per BGA surface mount foot soldering instructions). 2. Place the square piece of elastomer provided into the socket base (Note orientation mark on the socket base and the elastomer).


    Original     		PDF

    EIA-364-20

    Abstract: No abstract text available
    Text: Product Specification 108-1163-7 11Mar11 Rev B Inverted Six and Eight Position Surface Mount Shielded Modular Jack Assembly 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the TE Connectivity TE inverted six and eight position surface mount shielded modular jack assembly.


    Original     		PDF 11Mar11 24Mar00. EIA-364-20

    8 NARROW SO

    Abstract: electronic assembly tape PLCC-20 PLCC-28 SO8 NARROW SO24 wide bar code component 16 Narrow SO
    Text: Surface Mount Tape and Reel Specification General Description Tape-and-Reel is a method for shipment of surface mount devices. This approach simplifies the handling of semiconductors for automated circuit board assembly systems. A Tape-and-Reel holds hundreds-to-thousands of surface


    Original     		PDF

    national semiconductor pb-free suffix

    Abstract: SB70A SQA40b TS5B-24 LM431ACM3X IEC 384 14 250 volts LM2734XMK UFBGA 176 datasheet M08A M14A
    Text: Surface Mount - Tape & Reel • General Description Tape-and-Reel is one of the primary methods for shipping surface mount devices. This system simplifies the handling of semiconductors for automated circuit board assembly systems. Tape-and-Reel holds hundreds-to-thousands of surface mount devices so that pick-and-place machines have to


    Original     		PDF EIA-481 national semiconductor pb-free suffix SB70A SQA40b TS5B-24 LM431ACM3X IEC 384 14 250 volts LM2734XMK UFBGA 176 datasheet M08A M14A

    GDZ3V9LP3

    Abstract: No abstract text available
    Text: GDZ3V9LP3 - GDZ8V2LP3 ADVANCE INFORMATION ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE Features Mechanical Data • Ultra-Small Leadless Surface Mount Package 0.6 x 0.3mm   Ultra-Low Profile Package (0.3mm)   Ideally Suited for Automated Assembly Processes


    Original     		PDF X3-DFN0603-2 J-STD-020 DS35065 GDZ3V9LP3

    Untitled

    Abstract: No abstract text available
    Text: DDTC114ELP PRE-BIASED R1 = R2 SMALL SIGNAL SURFACE MOUNT 100mA NPN TRANSISTOR Features Mechanical Data • • • • • • • • Epitaxial Planar Die Construction Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes


    Original     		PDF DDTC114ELP 100mA AEC-Q101 DFN1006-3 J-STD-020 MIL-STD-202, DS30945

    Untitled

    Abstract: No abstract text available
    Text: UDZ3V6B-UDZ15B SURFACE MOUNT PRECISION ZENER DIODE Features Mechanical Data • Small, Surface Mount Package  Case: SOD323  Ideally suited for Automated Assembly Processes  Case Material: UL Flammability Classification Rating 94V-0  Very Sharp Breakdown Characteristics


    Original     		PDF UDZ3V6B-UDZ15B OD323 J-STD-020D MIL-STD-202, DS30290

    Untitled

    Abstract: No abstract text available
    Text: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • Planar Die Construction Small Surface Mount Package Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2


    Original     		PDF BZT52C2V0S BZT52C39S AEC-Q101 OD323 J-STD-020 MIL-STD-202, DS30093

    Untitled

    Abstract: No abstract text available
    Text: DDTC114ELP PRE-BIASED R1 = R2 SMALL SIGNAL SURFACE MOUNT 100mA NPN TRANSISTOR Features Mechanical Data • • • • • • • • Epitaxial Planar Die Construction Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes


    Original     		PDF DDTC114ELP 100mA AEC-Q101 DDTC114ELP DFN1006-3 J-STD-020 MIL-STD-202, DS30945 621-DDTC114ELP-7

    DDZ9689T

    Abstract: No abstract text available
    Text: DDZ9689T - DDZ9717T SURFACE MOUNT PRECISION ZENER DIODE Features Mechanical Data • • • • • • • • • Ultra-Small Surface Mount Package Very Sharp Breakdown Characteristics Very Tight Tolerance on VZ Ideally Suited for Automated Assembly Processes


    Original     		PDF DDZ9689T DDZ9717T OD-523 J-STD-020D MIL-STD-202, DS30553

    Untitled

    Abstract: No abstract text available
    Text: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • Planar Die Construction Small Surface Mount Package Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2


    Original     		PDF BZT52C2V0S BZT52C39S AEC-Q101 OD323 J-STD-020 MIL-STD-202, OD323 DS30093

    Untitled

    Abstract: No abstract text available
    Text: GDZ5V1LP3 - GDZ8V2LP3 ADVANCE INFORMATION ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE Features Mechanical Data • Ultra-Small Leadless Surface Mount Package 0.6 x 0.3mm   Ultra-Low Profile Package (0.3mm)   Ideally Suited for Automated Assembly Processes


    Original     		PDF X3-DFN0603-2 J-STD-020 DS35065

    Untitled

    Abstract: No abstract text available
    Text: DDTCxxxxLP R1≠R2 Series PRE-BIASED SMALL SIGNAL SURFACE MOUNT 100mA NPN TRANSISTOR Mechanical Data Features • • • • • • • • Epitaxial Planar Die Construction Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes


    Original     		PDF 100mA AEC-Q101 DDTC123JLP DDTC143ZLP DDTC114YLP DFN1006-3 J-STD-020D DS30755

    BZT52C3V9LP

    Abstract: No abstract text available
    Text: BZT52C2V4LP - BZT52C39LP SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes Lead Free By Design/RoHS Compliant Note 1 "Green" Device (Note 2)


    Original     		PDF BZT52C2V4LP BZT52C39LP AEC-Q101 X1-DFN1006-2 J-STD-020 MIL-STD-202, DS30506 BZT52C3V9LP

    Untitled

    Abstract: No abstract text available
    Text: MMBZ5221BTS - MMBZ5259BTS TRIPLE SURFACE MOUNT ZENER DIODE ARRAY Features Mechanical Data • Three Isolated Zeners in Ultra-Small Surface Mount Package   Ideally Suited for Automated Assembly Processes   Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2


    Original     		PDF MMBZ5221BTS MMBZ5259BTS J-STD-020D AEC-Q101 MIL-STD-202, OT363 DS30184

    Untitled

    Abstract: No abstract text available
    Text: MMBZ5221BW - MMBZ5259BW 200mW SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • • Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally Suited for Automated Assembly Processes Lead Free/RoHS Compliant Note 2


    Original     		PDF MMBZ5221BW MMBZ5259BW 200mW AEC-Q101 OT-323 J-STD-020D MIL-STD-202, DS31037

    LMV240

    Abstract: national semiconductor pb-free suffix DS90C2501SLB LM431ACM3X DSP-92 TS5B-24 LM3351MM LM3351MMX M08A M14A
    Text: Surface Mount - Tape & Reel General Description Tape-and-Reel is one of the primary methods for shipping surface mount devices. This system simplifies the handling of semiconductors for automated circuit board assembly systems. Tape-and-Reel holds hundreds-to-thousands of


    Original     		PDF EIA-481-1-A EIA-481-2-A CSP-9-111S2) CSP-9-111S2. LMV240 national semiconductor pb-free suffix DS90C2501SLB LM431ACM3X DSP-92 TS5B-24 LM3351MM LM3351MMX M08A M14A

    DDZ9689T

    Abstract: No abstract text available
    Text: DDZ9689T - DDZ9717T SURFACE MOUNT ZENER DIODE Features Mechanical Data • Small, Low Profile Surface Mount Package • • Very Sharp Breakdown Characteristics • • Ideally Suited for Automated Assembly Processes Case: SOD523 Case Material: Molded Plastic, “Green” Molding Compound. UL


    Original     		PDF DDZ9689T DDZ9717T OD523 J-STD-020D MIL-STD-202, DS30553

    Untitled

    Abstract: No abstract text available
    Text: TPD6V8LP 85W SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR Features • • • • • • • Mechanical Data • • Planar Die Construction Ultra-Small Leadless Surface Mount Package Unidirectional Ideally Suited for Automated Assembly Processes Lead Free By Design/RoHS Compliant Note 1


    Original     		PDF AEC-Q101 DFN1006-2 J-STD-020 MIL-STD-202, DS30914

    Untitled

    Abstract: No abstract text available
    Text: TPD6V8LP SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR Features • • • • • • • Mechanical Data • • Planar Die Construction Ultra-Small Leadless Surface Mount Package Unidirectional Ideally Suited for Automated Assembly Processes Lead Free By Design/RoHS Compliant Note 1


    Original     		PDF AEC-Q101 X1-DFN1006-2 J-STD-020 MIL-STD-202, X1-DFN1006-2 DS30914

    umc4n

    Abstract: No abstract text available
    Text: UMC4N DUAL COMPLEMENTARY PRE-BIASED TRANSISTORS Features Mechanical Data • • • • • • • • • • Ultra-Small Surface Mount Package Epitaxial Planar Die Construction Surface Mount Package Suited for Automated Assembly Simplifies Circuit Design and Reduces Board Space


    Original     		PDF AEC-Q101 OT353 J-STD-020 MIL-STD202, OT353 DS31203 umc4n

    MIL-C-55302

    Abstract: GLCP-30 GLCP-30F MIL-M-24519 530719-7 1-530744-9 1-530744-4 mil-m-24519 GLCP-30F
    Text: Products for Surface Mount Assembly Catalog 65230 • Surface Mount Revised 11-95 Surface Mini-Box Pin Header Assemblies .050 [1.27] Centerline Board-to-Board Connectors M ount Box Contact Connectors Continued CD-ROM „Max. Style I Straddle M ount without


    OCR Scan     		PDF M55302/31-06 MIL-C-55302 GLCP-30 GLCP-30F MIL-M-24519 530719-7 1-530744-9 1-530744-4 mil-m-24519 GLCP-30F