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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: 2434 SERIES □ur in FFC/FPC CONNECTOR l.OOmm 0.039" Material: Housing: High tem pe ra ture housing U L 9 4V -0 withstands IR and VPR soldering methods. Contacts: Phosphor Bronze. Leg: Brass. Plating: Tin plated. E le ctrica l C h a ra cte ristics: Current Rating: 1 AMP.	OCR Scan	PDF	5000M 100mA. T0177S7
7912 Abstract: 152411 Text: 7912 SERIES □ u p i SLIM H.D. D -S U B RIGHT ANGLE TYPE i n Material: H ousing: High te m p e r a tu re housing U L 9 4 V - 0 w ithstands IR and VPR soldering m ethods. C o n ta cts: Phospho r Bronze. P lating: Selective Gold plated. E le c tric a l C h a r a c te r is tic s :	OCR Scan	PDF	UL94V-0 5000M 100mA. 40UNC 4-40UNC I--15 98--I D177S7 7912 152411
WAFER 2.54mm Abstract: No abstract text available Text: 4071 SERIES □upk kn WAFER 2 .5 4 m m 0 .1 0 0 " Material: Housing: Nyl on 6 6 F l a me C o ntacts: Br ass. Plating: Tin p l a te d . retardant UL94V-0. Electrical Characteristics: C u rren t Rating: 4 AMP MAX. per pin. In su lato r R esistance: 5 0 0 0 M Q mi n . at DC 500V.	OCR Scan	PDF	UL94V-0. 5000M 100mA. D000104 WAFER 2.54mm
Untitled Abstract: No abstract text available Text: 2011 SERIES □upiin PIN HEADER 2.54mmX2.54mm 0.100"X0.100" M aterial: Housing: 30% Glass filled PBT UL94-V-0. Contacts: Brass Plating: Gold plated: 5 /J,' over 50/T nickel. Tin plated: 150^’ over 7 0 j l nickel. E le c t r ic a l C h a r a c t e r i s t ic s :	OCR Scan	PDF	54mmX2 UL94-V-0. 5000M T0177S7 000000b
Untitled Abstract: No abstract text available Text: 2533 SERIES □upk kn FFC/FPC CONNECTOR 1.25mm 0.049" Material: Housing: 30% Glass filled PBT UL94V-0. C ontacts: Phosphor Bronze. Plating: Tin plated. E le ctrica l C h a ra cte ristics: Current Rating: 1 AMP. Insulator Resistance: 5000M Q min. at DC 500V.	OCR Scan	PDF	UL94V-0. 5000M 100mA. T0177S7 Q0D0100
4071 Abstract: GQQ0103 Text: 4071 SERIES □upi in HOUSING 2 .5 4 m m 0 .1 0 0 " Material: Housing: Nylon 66 F la m e r e t a r d a n t U L 9 4 V - 0 . C ontacts: B ra s s Term inol Plating: Tin p la te d . R ecom m end Wire: 22AWG to 28AWG. E le c tric a l C h a r a c te r istic s:	OCR Scan	PDF	UL94V-0. 22AWG 28AWG. 5000M 100mA. GQQ0103 4071
Untitled Abstract: No abstract text available Text: 2212 SERIES □upi in PIN HEADER 1.27mm 0.050" Material: Housing: High te m p e ra tu re housing w ithstands IR and VPR soldering m ethods. Contacts: Brass Plating: Gold plated: 5 / 1' over 5 0 ^ ' nickel. Tin plated: 150 / ! ' over 70 /1 ’ nickel. Selective gold plated: S tandard gold on	OCR Scan	PDF	5000M 100mA T0177S7
Untitled Abstract: No abstract text available Text: 2049 SERIES □ m kn P.C.B. SOCKET 2.5 4 m m 0 .1 0 0 " M aterial: H ousing: 30% Glass filled PBT UL94V— 0. C o n ta cts: P hospho r Bronze. P lating: Gold plated: 5 /I' over 5 0 /x nickel. Tin plated: 15 0 /i' over 70¡i nickel. E le c tric a l C h a r a c t e r is t ic s :	OCR Scan	PDF	54mmX7 UL94V-0. 5000M 100mA
Untitled Abstract: No abstract text available Text: mana 2044 SERIES P.C.B. SOCKET 2.54mmX2.54mm 0.100"X0.100" Material: Housing: 30% Glass filled PBT UL94V— 0. Contacts: Phosphor Bronze. Plating: Gold plated: 5/1 over 5 0 fi' nickel. Tin plated: 150 jl' over 70//" nickel. E lectrical C h aracteristics:	OCR Scan	PDF	54mmX2 UL94Vâ 5000M 100mA T0177S7
Untitled Abstract: No abstract text available Text: 2214 SERIES □upi in PIN HEADER 1.27mm 0.050" Material: Housing: High te m p e ra tu re housing w ithstands IR and VPR s o ld e r in g . m ethods. Contacts: Brass Plating: Gold plated: 5 fl' over 5 0 / I nickel. Tin plated: 150 fl' over 7 0 /!' nickel. Selective gold plated: S tandard gold on	OCR Scan	PDF	5000M 100mA 2214-1X T0177S7