Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    TDA19988AU Search Results

    TDA19988AU Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    TDA19988AU NXP Semiconductors Bare die; 84 bond pads Original PDF

    TDA19988AU Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Bare die outline Bare die; 84 bond pads; 2.856 x 2.856 x 0.738 mm TDA19988AU D 84 66 1 65 e x E y 43 22 23 42 X Y P1 P2 P4 P3 A A2 A1 detail X detail Y Dimensions Unit A 1 A1 A2 D(2) E(2) e(3) max nom 0.738 0.013 0.725 2.856 2.856 min mm 0.08 P1(4) P2(5)


    Original     		PDF TDA19988AU tda19988au