rf pogo pin
Abstract: 180C high current pogo pin
Text: SBT – Socket for Burn-in and Test Applications High Performance IC Sockets And Test Adaptors IP, June 2009 Problem Custom Burn-in and Standard Production Test Applications usually demand a spring probe solution • Custom Burn-in sockets are expensive • Need high cost tooling and long development time
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Abstract: No abstract text available
Text: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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dead bug
Abstract: wells Wells Electronics
Text: SOCKETS/SOCKET TOOLS WELLS ELECTRONICS Burn-in and Test Sockets • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Flash Memory Tools Solution Program TSOP, PSOP, µBGA* packages and DIP Sockets for test and burn-in High force, high reliability contacts Open top, compact design TSOP
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dead bug
Abstract: PSOP wells 28F001BX 28F002BC 28F002BX 28F010 28F020 28F200BX
Text: SOCKETS WELLS ELECTRONICS Burn-In and Test Sockets • ■ ■ ■ ■ ■ ■ ■ ■ ■ TSOP, PSOP & DIP sockets for test and burn-in High force, high reliability contacts Open top, compact design TSOP & PSOP Long life (10,000 cycles minimum) Live and dead bug insertion (TSOP)
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28F010,
28F001BX,
28F020,
28F002BC,
28F002BL,
28F002BV,
28F002BX,
28F200BL,
28F200BV,
28F200BX,
dead bug
PSOP
wells
28F001BX
28F002BC
28F002BX
28F010
28F020
28F200BX
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Untitled
Abstract: No abstract text available
Text: CSP/MicroBGA Test & Burn-In Socket FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to solderless pressure
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Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required.
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27mm2.
UL94V-0
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Untitled
Abstract: No abstract text available
Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any pitch device on 0.40mm or larger. • Pressure mounting, no soldering required.
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1720G
Abstract: No abstract text available
Text: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to
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device17
1720G
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Untitled
Abstract: No abstract text available
Text: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to
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device17
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Untitled
Abstract: No abstract text available
Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.
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UL94V-0
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micro pitch BGA
Abstract: No abstract text available
Text: CSP/MICRO BGA Test & Burn-In Socket For Devices Up to 55mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any device on 0.40mm pitch or larger. • 4 Point crown insures “scrub” on solder oxides.
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Untitled
Abstract: No abstract text available
Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.
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UL94V-0
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Untitled
Abstract: No abstract text available
Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.
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27mm2.
UL94V-0
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Untitled
Abstract: No abstract text available
Text: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to
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Untitled
Abstract: No abstract text available
Text: CSP/µBGA Test & Burn-in Socket for Devices up to 40mm Square FEATURES • For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices • Any pitch device on 0.30mm or larger • 4-point crown insures “scrub” on solder oxides • Single Point Probes available for small land area contact pads
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23019
Abstract: No abstract text available
Text: CSP/MICRO BGA Test & Burn-in Socket for Devices Up to 40mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.40mm or larger. • 4 Point crown insures “scrub” on solder oxides. • Single Point Probes available for small land area contact pads.
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Untitled
Abstract: No abstract text available
Text: CSP/MICRO BGA Test & Burn-In Socket For Devices Up to 55mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any device on 0.50mm pitch or larger. • 4 Point crown insures “scrub” on solder oxides. • Single Point Probes available for small land area contact pads.
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forma08)
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Untitled
Abstract: No abstract text available
Text: CSP/MicroBGA Test & Burn-In Socket FEATURES: AV AI LA B LE AT TH IS TI M E • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to solderless pressure
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Test & Burn In Sockets
Abstract: AXS-3215-02-01 abs07
Text: CRYSTAL TEST & BURN IN SOCKETSOCKET CRYSTAL/CRYSTAL OSCILLATOR AXS-3215-02-01 Precision test socket for 3.2x1.5mm Pb RoHS Compliant 2 pad crystal packages. | | | | | | | | | | | | | | | FEATURES: • Accurate and reliable testing of frequency control devices
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AXS-3215-02-01
768kHz
ABS07
com/Resonators/ABS07
Test & Burn In Sockets
AXS-3215-02-01
abs07
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Test & Burn In Sockets
Abstract: AXS-2520-04-09 ABM10 4 pin surface mount crystal oscillator
Text: CRYSTAL TEST & BURN IN SOCKETSOCKET CRYSTAL/CRYSTAL OSCILLATOR AXS-2520-04-09 Precision test socket for 2.5X2mm, 4 pad crystal packages. Pb RoHS Compliant | | | | | | | | | | | | | | | FEATURES: • Accurate and reliable testing of frequency control devices
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AXS-2520-04-09
ABM10
com/Resonators/ABM10
Test & Burn In Sockets
AXS-2520-04-09
ABM10
4 pin surface mount crystal oscillator
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Untitled
Abstract: No abstract text available
Text: Test- und Burn-In Socket Sockel m it A us werfei^/Verriegelungshebeln Test- und Burn-In Sockel Test- and Burn-In sockets Sockel mit Auswerfer-/Verriegelungshebeln Lock/Eject-DIP-sockets NEU He w - b — - r - EJCCTORaOCK LATCH
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Abstract: No abstract text available
Text: YAMAICHI Socket Test Probes DESCRIPTION SPECIFICATIONS • Socket test probes are used in conj unction with your board tester to ensure the reliability of your burn-in or test board prior to test or burn-in process. • Probe head material is natural Ultem, unless
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656C1202211-001
Abstract: 656C1162211 656C1162211-001 656C1242211-001 656-1082211 656C1242211 R-535 C635 ZIF socket 478
Text: 59G- Ss3 WELD ELECTRONIC Burn-ln/Test Sockets Series 656 SSO P ZIF Socket • Open top, Zero Insertion Force design for automatic loading. • Compact size for high board density. • High reliability, pre-loaded contacts. • For burn-in applications up to 150°C.
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r-535
656C1162211
656C1242211
656C1242211-001
656C1322211
656D2442211
656C1202211-001
656C1162211-001
656-1082211
R-535
C635
ZIF socket 478
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Untitled
Abstract: No abstract text available
Text: 3M " K Sockets • Sockets for computer chips • Test and burn-in sockets • Other production sockets 3M Electronic Specialty Markets http://www.mmm.com/esm 85
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