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    TEST & BURN-IN SOCKETS Search Results

    TEST & BURN-IN SOCKETS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    FO-62.5LPBMT0-001 Amphenol Cables on Demand Amphenol FO-62.5LPBMT0-001 MT-RJ Connector Loopback Cable: Multimode 62.5/125 Fiber Optic Port Testing .1m Datasheet
    FO-9LPBMTRJ00-001 Amphenol Cables on Demand Amphenol FO-9LPBMTRJ00-001 MT-RJ Connector Loopback Cable: Single-Mode 9/125 Fiber Optic Port Testing .1m Datasheet
    SF-SFP28LPB1W-3DB Amphenol Cables on Demand Amphenol SF-SFP28LPB1W-3DB SFP28 Loopback Adapter Module for SFP28 Port Compliance Testing - 3dB Attenuation & 1W Power Consumption Datasheet
    FO-50LPBMTRJ0-001 Amphenol Cables on Demand Amphenol FO-50LPBMTRJ0-001 MT-RJ Connector Loopback Cable: Multimode 50/125 Fiber Optic Port Testing .1m Datasheet
    SF-SFPPLOOPBK-003.5 Amphenol Cables on Demand Amphenol SF-SFPPLOOPBK-003.5 SFP+ Loopback Adapter Module for SFP+ Port Compliance Testing - 3.5dB Copper/Optical Cable Emulation Datasheet

    TEST & BURN-IN SOCKETS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    rf pogo pin

    Abstract: 180C high current pogo pin
    Text: SBT – Socket for Burn-in and Test Applications High Performance IC Sockets And Test Adaptors IP, June 2009 Problem Custom Burn-in and Standard Production Test Applications usually demand a spring probe solution • Custom Burn-in sockets are expensive • Need high cost tooling and long development time


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12


    Original     		PDF

    dead bug

    Abstract: wells Wells Electronics
    Text: SOCKETS/SOCKET TOOLS WELLS ELECTRONICS Burn-in and Test Sockets • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Flash Memory Tools Solution Program TSOP, PSOP, µBGA* packages and DIP Sockets for test and burn-in High force, high reliability contacts Open top, compact design TSOP


    Original     		PDF

    dead bug

    Abstract: PSOP wells 28F001BX 28F002BC 28F002BX 28F010 28F020 28F200BX
    Text: SOCKETS WELLS ELECTRONICS Burn-In and Test Sockets • ■ ■ ■ ■ ■ ■ ■ ■ ■ TSOP, PSOP & DIP sockets for test and burn-in High force, high reliability contacts Open top, compact design TSOP & PSOP Long life (10,000 cycles minimum) Live and dead bug insertion (TSOP)


    Original     		28F010, 28F001BX, 28F020, 28F002BC, 28F002BL, 28F002BV, 28F002BX, 28F200BL, 28F200BV, 28F200BX, dead bug PSOP wells 28F001BX 28F002BC 28F002BX 28F010 28F020 28F200BX PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MicroBGA Test & Burn-In Socket FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to solderless pressure


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required.


    Original     		27mm2. UL94V-0 PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any pitch device on 0.40mm or larger. • Pressure mounting, no soldering required.


    Original     		27mm2. UL94V-0 PDF

    1720G

    Abstract: No abstract text available
    Text: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to


    Original     		device17 1720G PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to


    Original     		device17 PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.


    Original     		27mm2. UL94V-0 PDF

    micro pitch BGA

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-In Socket For Devices Up to 55mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any device on 0.40mm pitch or larger. • 4 Point crown insures “scrub” on solder oxides.


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.


    Original     		27mm2. UL94V-0 PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.


    Original     		27mm2. UL94V-0 PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/µBGA Test & Burn-in Socket for Devices up to 40mm Square FEATURES • For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices • Any pitch device on 0.30mm or larger • 4-point crown insures “scrub” on solder oxides • Single Point Probes available for small land area contact pads


    Original     		PDF

    23019

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-in Socket for Devices Up to 40mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.40mm or larger. • 4 Point crown insures “scrub” on solder oxides. • Single Point Probes available for small land area contact pads.


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-In Socket For Devices Up to 55mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any device on 0.50mm pitch or larger. • 4 Point crown insures “scrub” on solder oxides. • Single Point Probes available for small land area contact pads.


    Original     		forma08) PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MicroBGA Test & Burn-In Socket FEATURES: AV AI LA B LE AT TH IS TI M E • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to solderless pressure


    Original     		PDF

    Test & Burn In Sockets

    Abstract: AXS-3215-02-01 abs07
    Text: CRYSTAL TEST & BURN IN SOCKETSOCKET CRYSTAL/CRYSTAL OSCILLATOR AXS-3215-02-01 Precision test socket for 3.2x1.5mm Pb RoHS Compliant 2 pad crystal packages. | | | | | | | | | | | | | | | FEATURES: • Accurate and reliable testing of frequency control devices


    Original     		AXS-3215-02-01 768kHz ABS07 com/Resonators/ABS07 Test & Burn In Sockets AXS-3215-02-01 abs07 PDF

    Test & Burn In Sockets

    Abstract: AXS-2520-04-09 ABM10 4 pin surface mount crystal oscillator
    Text: CRYSTAL TEST & BURN IN SOCKETSOCKET CRYSTAL/CRYSTAL OSCILLATOR AXS-2520-04-09 Precision test socket for 2.5X2mm, 4 pad crystal packages. Pb RoHS Compliant | | | | | | | | | | | | | | | FEATURES: • Accurate and reliable testing of frequency control devices


    Original     		AXS-2520-04-09 ABM10 com/Resonators/ABM10 Test & Burn In Sockets AXS-2520-04-09 ABM10 4 pin surface mount crystal oscillator PDF

    Untitled

    Abstract: No abstract text available
    Text: Test- und Burn-In Socket Sockel m it A us werfei^/Verriegelungshebeln Test- und Burn-In Sockel Test- and Burn-In sockets Sockel mit Auswerfer-/Verriegelungshebeln Lock/Eject-DIP-sockets NEU He w - b — - r - EJCCTORaOCK LATCH


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: YAMAICHI Socket Test Probes DESCRIPTION SPECIFICATIONS • Socket test probes are used in conj unction with your board tester to ensure the reliability of your burn-in or test board prior to test or burn-in process. • Probe head material is natural Ultem, unless


    OCR Scan     		PDF

    656C1202211-001

    Abstract: 656C1162211 656C1162211-001 656C1242211-001 656-1082211 656C1242211 R-535 C635 ZIF socket 478
    Text: 59G- Ss3 WELD ELECTRONIC Burn-ln/Test Sockets Series 656 SSO P ZIF Socket • Open top, Zero Insertion Force design for automatic loading. • Compact size for high board density. • High reliability, pre-loaded contacts. • For burn-in applications up to 150°C.


    OCR Scan     		r-535 656C1162211 656C1242211 656C1242211-001 656C1322211 656D2442211 656C1202211-001 656C1162211-001 656-1082211 R-535 C635 ZIF socket 478 PDF

    Untitled

    Abstract: No abstract text available
    Text: 3M " K Sockets • Sockets for computer chips • Test and burn-in sockets • Other production sockets 3M Electronic Specialty Markets http://www.mmm.com/esm 85


    OCR Scan     		PDF