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    THROUGH-HOLE NETWORK PACKAGING Search Results

    THROUGH-HOLE NETWORK PACKAGING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD4164K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    THROUGH-HOLE NETWORK PACKAGING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Through-Hole Network Packaging

    Abstract: No abstract text available
    Text: Through-Hole Network Packaging Vishay Network Packaging NETWORK FILM TUBE PACKAGING SIP C DIP D A B D B Typ. A Typ. PACKAGING CODE MODEL SIZE DIMENSIONS IN INCHES mm LEAD (Pb)BEARING LEAD (Pb)-FREE TYPE A B C D PACKAGING UNIT (Pieces) MDM (Military M83401)


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    PDF M83401) 09-Mar-11 Through-Hole Network Packaging

    rn01

    Abstract: No abstract text available
    Text: Precision Resistor Network RN01 Series This is a precision resistor network that includes 2 resistors in a 3-pin through hole package. This resistor network is designed to provide excellent resistance ratio and TCR tracking. dimensions in mm Resistance range:


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    PDF RN02M701 RN01TQ1001/2001YRA RN01QQ50R0/1001EM5 rn01

    vishay packaging codes

    Abstract: CS201 CS206 M83401
    Text: Through-Hole Network Packaging Vishay Network Packaging NETWORK FILM TUBE PACKAGING SIP C DIP D A B D B Typ. A Typ. PACKAGING CODE MODEL SIZE DIMENSIONS IN INCHES mm LEAD (Pb)BEARING LEAD (Pb)-FREE TYPE A B C D PACKAGING UNIT (Pieces) MDM (Military M83401)


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    PDF M83401) 15-Feb-10 vishay packaging codes CS201 CS206 M83401

    rn01

    Abstract: No abstract text available
    Text: Thin Film Precision Resistor Network RN01 Series Specification subject to change - Please call factory. 1.0 Description This is a precision resistor network that includes 2 resistors in a 3-pin through hole package. This resistor network is designed to provide excellent resistance ratio and TCR tracking.


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    rn01

    Abstract: No abstract text available
    Text: Thin Film Precision Resistor Network RN01 Series Specification subject to change - Please call factory. 1.0 Description This is a precision resistor network that includes 2 resistors in a 3-pin through hole package. This resistor network is designed to provide excellent resistance ratio and TCR tracking.


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: Bothhandusa.com 10 BASE-T NETWORK COMPONENTS P/N:TS7022DM DATA SHEET Feature ! ! ! ! ! ! Designed for use with 10 Base-T PHY transceivers. Conforms to IEEE 802.3 standards. Single port designs available with and without common mode chokes. Through-hole and surface mount packaging.


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    PDF TS7022DM TS7022DM 1-10MHz 5-10MHz 10-30MHzceivers.

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    Abstract: No abstract text available
    Text: defining a degree of excellence 10BASE-T NETWORK COMPONENTS 960061B • Designed for use with National Semiconductor DP83907 Atlantic II 10Base-T PHY transceiver • Available in both surface mount and through-hole packaging • Conforms to IEEE 802.3 10Base-T specifications


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    PDF 10BASE-T 960061B DP83907 1-10MHz 5MHz-10MHz 1MHz-10MHz 10-30MHz 100MHz

    Untitled

    Abstract: No abstract text available
    Text: Leaded Resistor Networks THROUGH-HOLE Conformal Coated SIP 770 SERIES Termination Leads/Pins Type Dimensions: Inches mm Center Length Width Height Resistance: Range, Ohms Tolerance Temperature Coefficient,ppm/°C Maximum Operating Voltage Power Rating (Total Network Power)


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    PDF 100ppm/Â 770103103P

    Untitled

    Abstract: No abstract text available
    Text: TSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Standard FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) Actual Size Available


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    PDF MIL-PRF-83401 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    resistivity wire nichrome

    Abstract: tantalum nitride
    Text: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line Resistor, Through Hole Network Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)


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    PDF 2002/95/EC 18-Jul-08 resistivity wire nichrome tantalum nitride

    VTF215BX

    Abstract: resistor through hole vtf220bx VTF225BX
    Text: VTF Standard www.vishay.com Vishay Dale Thin Film Conformal, Single In-Line Thin Film Resistor, Through Hole Network (Standard) FEATURES • Off-the-shelf delivery Actual Size • Wide variety of standards • Small size (SIP) • Standard designs - no NRE


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    PDF 2002/95/EC 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 VTF215BX resistor through hole vtf220bx VTF225BX

    Untitled

    Abstract: No abstract text available
    Text: HVPS www.vishay.com Vishay Dale Thin Film High Value, High Voltage Precision SIP Thin Film Resistor, Through Hole Network FEATURES • High nominal precision resistors value range 50K to 10M Available • Highly accurate resistance tolerance (up to ± 0.01 %)


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    PDF 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    Untitled

    Abstract: No abstract text available
    Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor, Through Hole Network Low Profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no


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    PDF 2002/95/EC 11-Mar-11

    Untitled

    Abstract: No abstract text available
    Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor, Through Hole Network Low Profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no


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    PDF 18-Jul-08

    Untitled

    Abstract: No abstract text available
    Text: VTF Standard www.vishay.com Vishay Dale Thin Film Conformal, Single In-Line Thin Film Resistor, Through Hole Network (Standard) FEATURES • Off-the-shelf delivery Actual Size • Wide variety of standards • Small size (SIP) • Standard designs - no NRE


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    PDF 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    resistor through hole

    Abstract: vishay 108 resistor
    Text: VTF Custom Vishay Thin Film Conformal, Single In-Line Resistor, Through Hole Network (Custom) FEATURES • Minimal PC board space • Standard 100 mil centers • Exceptional ratio stability over time and temperature (ΔR ± 0.015 % at + 70 °C at 2000 h)


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    PDF 11-Mar-11 resistor through hole vishay 108 resistor

    Untitled

    Abstract: No abstract text available
    Text: CTSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Custom FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) • Exceptional ratio stability over time and


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    PDF 2002/95/EC MIL-PRF-83401 11-Mar-11

    VTF211BX

    Abstract: VTF Custom
    Text: VTF Custom Vishay Thin Film Conformal, Single In-Line Resistor, Through Hole Network (Custom) FEATURES • Minimal PC board space • Standard 100 mil centers • Exceptional ratio stability over time and temperature (ΔR ± 0.015 % at + 70 °C at 2000 h)


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    PDF 2002/95/EC 18-Jul-08 VTF211BX VTF Custom

    Untitled

    Abstract: No abstract text available
    Text: CTSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Custom FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) • Exceptional ratio stability over time and


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    PDF 2002/95/EC MIL-PRF-83401 MIL-PRF-83401 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    Untitled

    Abstract: No abstract text available
    Text: VTF Standard Vishay Thin Film Conformal, Single In-Line Resistor, Through Hole Network (Standard) FEATURES • Off-the-shelf delivery Actual Size • Wide variety of standards • Small size (SIP) • Standard designs - no NRE • Low capacitance < 0.1 pF/PIN


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    PDF 11-Mar-11

    Untitled

    Abstract: No abstract text available
    Text: CSD www.vishay.com Vishay Dale Thin Film Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network Custom FEATURES A dual-in-line monolithic ceramic package in a variety of sizes and configurations. A rugged, low cost packaging technique with 4 leads to 20 leads that allows higher


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    PDF 2002/95/EC 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    Untitled

    Abstract: No abstract text available
    Text: CTSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Custom FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) • Exceptional ratio stability over time and


    Original
    PDF 2002/95/EC MIL-PRF-83401 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12

    Untitled

    Abstract: No abstract text available
    Text: CSD www.vishay.com Vishay Dale Thin Film Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network Custom FEATURES A dual-in-line monolithic ceramic package in a variety of sizes and configurations. A rugged, low cost packaging technique with 4 leads to 20 leads that allows higher


    Original
    PDF 2002/95/EC 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12

    Untitled

    Abstract: No abstract text available
    Text: CSD www.vishay.com Vishay Dale Thin Film Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network Custom FEATURES A dual-in-line monolithic ceramic package in a variety of sizes and configurations. A rugged, low cost packaging technique with 4 leads to 20 leads that allows higher


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    PDF 2002/95/EC 11-Mar-11