Thermistor 44007
Abstract: 44031
Text: OMEGA’s Precision Interchangeable Thermistors Construction - Thermistors are manufactured from oxides of nickel, manganese, iron, cobalt, magnesium, titanium and other metals. All are available epoxy encapsulated and color coded, with two 3" leads. 1.2 12
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E10 varistor
Abstract: A170300 A0200-4 SrTiO3 oxide
Text: STRONTIUM TITANATE RING VARISTOR FEATURES Conductor ceramic is made of titanium oxide and strontium. Used in the range of low voltage E10=1.5~60V. E 10 =1.5~60V Wide capacitance ,absorb the noise in a wide frequency range. Excellent non-linearity voltage;
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rateE10
E10 varistor
A170300
A0200-4
SrTiO3 oxide
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03787
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material # CMF-SDP Product Line PTC resistors Date 1/6/2009 Version A/0 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] Materials CAS if applicable Barium oxide 1304-28-5 50 Titanium
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carbon monoxide detector
Abstract: electrochemical sensor CO gas sensor CO "Co Sensor" carbon monoxide sensor carbon monoxide sensor electrochemical NGL07 D3162 Capteur Sensors NGL07 electrochemical gas sensors datasheet
Text: General information on the Capteur NGL07 Carbon Monoxide sensors Principle of Operation The Capteur ‘G’ series sensor is a Mixed Metal Oxide semiconductor based on Chromium Titanium Oxide. When heated to a high temperature the material behaves towards reducing gases as a p-type semiconductor and increases in
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NGL07
carbon monoxide detector
electrochemical sensor CO
gas sensor CO
"Co Sensor"
carbon monoxide sensor
carbon monoxide sensor electrochemical
D3162
Capteur Sensors NGL07
electrochemical gas sensors datasheet
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Untitled
Abstract: No abstract text available
Text: リングバリスタ RING VARISTORS OPERATING TEMP. K25VJ120C 特長 FEATURES YConductor ceramic is made of titanium oxide and strontium. YLarge net voltage non-linear coefficient α of 3 to 7, and large electrostatic capacitance of 10 to 150 nF. Noise can thus be absorbed over a wide
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K25VJ120C
Yfg3V710V150nF
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Titanium dioxide
Abstract: copper wire datasheet cas number epoxy resin datasheet IMDS copper wire composition 31.5 1344-28-1 7631-86-9 49R9
Text: IMDS Declaration Film Resistors MFR4 (1R0-49R9) Pb free terminations Component Name Ceramic Rod Mullite Weight Constituent (g) 0.036 Aluminium oxide Silicon dioxide Other oxides End Caps Steel 0.030 Iron Other metals 7439-89-6 99 1 Plating 0.001 Copper Tin
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1R0-49R9)
Titanium dioxide
copper wire datasheet
cas number
epoxy resin datasheet
IMDS
copper wire composition
31.5
1344-28-1
7631-86-9
49R9
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bottle filling circuit diagram
Abstract: ARALDITE standard epoxy adhesive 503-357 araldite RS Cyanoacrylate activator ARALDITE rapid neoprene primer bottle filling circuit diagram free Polydimethylsiloxane TOUGHENED
Text: Data Pack K Data Sheet The use of adhesives in industry today covers a very broad range of applications. When engineers are contemplating the use of adhesives for a specific project, they have to consider which type is most appropriate, then they have to ensure that
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d 9329
Abstract: MARKING Scw SOT23 gus-ss cel-9220 cel9220 scw marking code sot 23 PFC-W0805LF SCW-SC3LF WCA0804 PWC2512L
Text: Surface Mount QSOP Resistor Networks IRC Advanced Film Division QSOP Series • Reliable, no internal cavity • High resistor density - .025” lead spacing • Standard JEDEC 16, 20, and 24 pin packages • Ultra-stable TaNSil resistors on silicon substrates
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environment-57-5
CEL9220
30248E-05
2562E-05
d 9329
MARKING Scw SOT23
gus-ss
cel-9220
cel9220
scw marking code sot 23
PFC-W0805LF
SCW-SC3LF
WCA0804
PWC2512L
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ptc thermistor level sensors
Abstract: ptc thermistor level sensor circuit schematic level water PTC Thermistor siemens PTC thermistor Petrol pump oil metering SENSING CIRCUIT air flow thermistors PTC sensor liquid level sensor circuit thermistor siemens thermistor
Text: PTC thermistors as level sensors Rugged and reliable Author: Philipp Roth, Dipl.-Phys., Dipl.-Ing. Ceramic PTC thermistors are a way of measuring the level of fluids. Their resistance depends very much on the thermal conductance of the medium surrounding them, like air or oil,
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Untitled
Abstract: No abstract text available
Text: Model BPC5 *J Weight 1.2843 gms Breakdown of component e.g. Material Name. chassis, transformer, lead (e.g. Sn alloy frame, encapsulation, etc. ) Substance Name (e.g. Copper (Cu) Alumina Substrate Aluminum Oxide Alumina Silica Magnesium Oxide Calcium Oxide
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744020
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material # Product Line Date RoHS Compliant 3260 series Trimmer 6/17/2004 Yes No. Construction element Material group 1 Contact Spring Pd/Ag 2 Housing Thermoset Material weight [g] 0.0029 0.0025 0.001 trace 0.174 0.0086 0.0039 0.0058
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diode marking 226
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material # CMF-RQ Product Line PTC resistors Date 01/13/2009 Version A/0 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] Materials CAS if applicable Average mass [%] Barium oxide
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Declaration
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material # CMF-SD Mid Product Line PTC resistors Date 1/6/2009 Version A/1 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] Materials CAS if applicable Average mass [%] Barium oxide
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encoder 9985
Abstract: 9985 encoder 112945-52-5 adhesive fr 309 92278 9985, encoder
Text: MATERIAL DECLARATION SHEET Material Number EMS22 – Dual Ball Bearing Product Line Magnetic Encoder Compliance Date Since inception RoHS Compliant Yes No. 1 Construction Element subpart C-Clip MSL Homogeneous Material Stainless Steel N/A Material weight
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EMS22
encoder 9985
9985 encoder
112945-52-5
adhesive
fr 309
92278
9985, encoder
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Untitled
Abstract: No abstract text available
Text: ASV,ASVK,ASL Ceramic Type List of main material declaration Item Weight(mg) 183.7 INFORMATION Material Package Base Process Name of the part Package Base Ceramic SMD Material Ceramics Item Name Lead Free Material Au / Ni Material Weight(mg) 156 Die Bonding
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C8-C12)
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Dupont 9476
Abstract: No abstract text available
Text: ASIC FLIP CHIPS Application Note ASIC Flip Chips: Manufacture and Use By Barbara L. Gibson, Applications Engineer plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or
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ABB TB556
Abstract: TB557 water ph sensor TB557 TB556 TB551 4TB5205-0119 4TB9515-0223 4TB5205-0174 TBX556 4TB5023-0088
Text: Data Sheet SS/TBX5_3 pH/Redox ORP Sensors for Process Monitoring TB(X)5 Series Next Step Solid State reference – eliminates poisoning, pumping and plugging Advantage™ Series with solution ground rod – permits continuous sensor diagnostics
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4 tinned copper wire
Abstract: 11314
Text: MATERIAL DECLARATION SHEET Material # CMF-RL BIG Product Line PTC resistors Date 1/6/2009 Version A/1 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] 0.8691 Materials CAS if applicable Average mass [%] Barium oxide
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diode marking 226
Abstract: BA9513 epoxy resin
Text: MATERIAL DECLARATION SHEET Material # CMF-SD Big Product Line PTC resistors Date 08/15/2008 Version A/1 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] Materials CAS if applicable Average mass [%] Barium oxide
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Untitled
Abstract: No abstract text available
Text: BSR1 100 GE Weight 0.044771 gms Breakdown of component e.g. chassis, transformer, lead frame, encapsulation, etc. Material Substance Name (e.g. Name. Copper (Cu) (e.g. Sn alloy) Alumina Substrate Alumina Thick Film Conductor Thick Film Resistor Thick Film
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7361E-05
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Untitled
Abstract: No abstract text available
Text: Isoplanar-Z Junction Fuse Principles and Programming Conventional fu sib le link bipolar PROM s and program m able logic devices are based upon tw o dim ensional m atrices o f e le ctrica lly conductive thin film fusible elem ents of m aterials such as nichrom e, titanium
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Untitled
Abstract: No abstract text available
Text: The MiniNet Manufacturing Process To define an electrical pattern on each silicon wafer, a series of steps must be taken. At each step, the work must be rigorously tested to ensure quality and cleanliness since the smallest impurity can lead to electronic leakage. The Bourns
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it1338
Abstract: Solder Paste Dupont
Text: ASIC Flip Chips: Manufacture and Use fôv H . i r b t i r a I . i i h s o n , A p p l i c a t i o n s F n i» i iu 't * i Introduction plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or
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Flip Chip Substrate
Abstract: Dupont 9476
Text: ASIC Flip Chips: Manufacture and Use ! ir i v i t : ì I>mmi . Introduction Application specific integrated circuits ASICs have been available and widely used for almost two decades. On the other hand, the surface mount technology known as "Flip Chip” has been available, but not widely known outside of
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17ces
Flip Chip Substrate
Dupont 9476
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