GMLAN
Abstract: TLE 4209A tle 8209 TLE8718SA BTS6143D smd code 724g 742T BTS50080-1TMA TLE7240SL tle 7718
Text: Ultimate Power–Perfect Control Vehicle Safety, Body and Power Applications [ www.infineon.com/automotivepower ] For a comprehensive and reliable portfolio of products for automotive and other applications, look no further than the product range from Infineon. We have used our
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12F-1,
B124-H9343-G1-X-7600
GMLAN
TLE 4209A
tle 8209
TLE8718SA
BTS6143D
smd code 724g
742T
BTS50080-1TMA
TLE7240SL
tle 7718
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infineon absolute pressure sensor ic DSOF sp37
Abstract: infineon TPMS sp37 application note TLE 4984 AK-LV29-compliant tda 5340 RXN7740 TLE 5025 sp37 infineon absolute pressure sensor ic DSO sp37 77GHz Radar
Text: Sensor Solutions for Automotive Applications Vehicle Safety, Body and Powertrain Applications [ www.infineon.com/sensors ] Nowadays, semiconductor sensors in cars are widely deployed in safety applications such as Anti Blocking System/Vehicle Stability Control, Radar, Airbag or Tire Pressure
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AK-LV29-compliant
Abstract: 77GHz Radar TLE 4984 RXN7740 sp37 TLE5027 TLE5041 TLE 5025 TLE 4983 PG-DSOSP-14-6
Text: Sensor Solutions for Automotive Applications Vehicle Safety, Body and Powertrain Applications [ www.infineon.com/sensors ] Nowadays, semiconductor sensors in cars are widely deployed in safety applications such as Anti Blocking System/Vehicle Stability Control, Radar, Airbag or Tire Pressure
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pressure sensor interface with 8051
Abstract: gas sensor using 8051 IC RECEIVER ASK/FSK 4 Pin SMD Hall sensors SMD Hall sensors linear TLE 5011 Angle Sensor pressure measurement with 8051 4946k 125khz tssop 14 receiver tda 5110
Text: Sensor & Wireless Control Solutions for Industrial and Consumer Applications [ www.infineon.com/sensors ] Equipment that is becoming increasingly powerful and specifications that are ever more complex in industrial and consumer applications call for more intelligent sensors with a
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infineon TPMS sp37
Abstract: ISO106 smd diode A82 PG-DSOSP-14
Text: Sensor Solutions for Automotive Applications Vehicle Safety, Body and Powertrain Applications [ www.infineon.com/sensors ] Today semiconductor sensors in cars are widely deployed in safety applications e.g. Anti Blocking System/Vehicle Stability Control, Radar, Airbag or Tire Pressure Monitoring
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BCM 4336
Abstract: 2A0565 C2335 2A280Z C1740 bipolar transistor transistor A1267 a1273 transistor c2335 r 2B0565 2b265
Text: 01.07.2005 11:10 Uhr Seite 2 Shor t Form Catalog for Distribution 2005/06 w w w. i n f i n e o n . c o m / d i s t r i b u t i o n Published by Infineon Technologies AG Ordering No. B192-H6780-G9-X-7600 Printed in Germany LM 060550. Shor t Form Catalog Distribution 2005/06
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B192-H6780-G9-X-7600
D-81669
VDSL5100i-E
VDSL6100i-E
BCM 4336
2A0565
C2335
2A280Z
C1740 bipolar transistor
transistor A1267
a1273 transistor
c2335 r
2B0565
2b265
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infineon TPMS sp37
Abstract: infineon sp37 infineon TPMS sp37 application note Germanium Power Devices Corp sp37 tle4984c B7HF200 infineon absolute pressure sensor ic DSOF sp37 77GHz Radar TPMS MEMS BASED PRESSURE SENSORS
Text: Sensor Solutions for Automotive Applications Vehicle Safety, Body and Powertrain Applications [ www.infineon.com/sensors ] Today semiconductor sensors in cars are widely deployed in safety applications e.g. Anti Blocking System/Vehicle Stability Control, Radar, Airbag or Tire Pressure Monitoring
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B142-H9281-X-X-7600
infineon TPMS sp37
infineon sp37
infineon TPMS sp37 application note
Germanium Power Devices Corp
sp37
tle4984c
B7HF200
infineon absolute pressure sensor ic DSOF sp37
77GHz Radar
TPMS MEMS BASED PRESSURE SENSORS
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PEF 24628
Abstract: PSB 21493 siemens PMB 6610 47n60c3 psb 21553 Pmb7725 PEF 22628 PMB6610 psb 50505 PMB 6819
Text: 2006/2007 Published by Infineon Technologies AG Ordering No. B192-H6780-G10-X-7600 Printed in Germany PS 080648. nb Infineon Product Catalog for Distribution 2006/2007 Product Catalog for Distribution www.infineon.com/distribution Edition July 2006 Published by
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B192-H6780-G10-X-7600
SP000012954
SP000013610
SP000017969
SP000014627
SP000018085
SP000018086
PEF 24628
PSB 21493
siemens PMB 6610
47n60c3
psb 21553
Pmb7725
PEF 22628
PMB6610
psb 50505
PMB 6819
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DAEWON tray drawing
Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
Text: Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect
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F14E
Abstract: F12E Sakata F13E LE28BW168T 2596H
Text: 16 Megabit FlashBank Memory FEATURES: • Single 3.0-Volt Read and Write Operations Sp ec ifi ca tio ns LE28BW168T • • Separate Memory Banks by Address Space – Simultaneous Read and Write Capability • Superior Reliability – Endurance: 10,000 Cycles
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LE28BW168T
16141\168T\
xxxx-20/20
F14E
F12E
Sakata
F13E
LE28BW168T
2596H
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LE28DW3215AT-80
Abstract: flash "simultaneous read write" 198 DQ15-DQ0 A20-A0
Text: 32 Megabit FlashBank Memory LE28DW3215AT-80 1 FEATURES: Single 3.0-Volt Read and Write Operations Separate Memory Banks by Address Space − Bank1: 16Mbit 1024K x 16 Flash − Bank2: 16Mbit(1024K x 16) Flash − Simultaneous Read and Write Capability Superior Reliability
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LE28DW3215AT-80
16Mbit
1024K
000Cycles
000Cycies
10years
15sec
500ms
LE28DW3215AT-80
flash "simultaneous read write" 198
DQ15-DQ0
A20-A0
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f16e
Abstract: No abstract text available
Text: 8 Megabit FlashBank Memory FEATURES: • Single 3.0-Volt Read and Write Operations Sp ec ifi ca tio ns LE28DW8102T • • Separate Memory Banks by Address Space – Simultaneous Read and Write Capability • Superior Reliability – Endurance: 10,000 Cycles
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LE28DW8102T
16141\168T\
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f16e
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Untitled
Abstract: No abstract text available
Text: 8 Megabit FlashBank Memory FEATURES: • Single 3.0-Volt Read and Write Operations • Separate Memory Banks by Address Space • Superior Reliability – Endurance: Pr el im in ar y – Bank1: 6Mbit 384K x 16 / 768K x 8 Flash – Bank2: 2Mbit (128K x 16 / 256K x 8) Flash
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LE28DW8163T-80T
xxxx-19/20
xxxx-20/20
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bax 50
Abstract: No abstract text available
Text: 16 Megabit FlashBank Memory FEATURES: • Single 3.0-Volt Read and Write Operations • Separate Memory Banks by Address Space • Superior Reliability – Endurance: Pr el im in ar y – Bank1: 4Mbit 256K x 16 / 512K x 8 Flash – Bank2: 12Mbit (768K x 16 / 1536K x 8) Flash
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12Mbit
1536K
LE28DW1621T-80T
xxxx-19/20
xxxx-20/20
bax 50
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TSG 3255
Abstract: ALLOY leadframe C7025 leadframe C7025 tsg 271 C7025 certificate c7025
Text: Index INDEX A alloy 42 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10 B boxes intermediate see Q-PACK boxes outer (see outer container boxes) tubes, protection from . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2
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TLC 1050
Abstract: FAA064 spansion Packing and Packaging Handbook DATE CODE Transistor Bo 17 Datasheet spansion Packing and Packaging Handbook WNF008
Text: Chapter 6 Tape and Reel CHAPTER 6 TAPE AND REEL Introduction Design and Materials Device Count per Reel Reel Dimensions and Labels Tape Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 6-1 Chapter 6 Tape and Reel INTRODUCTION A tape-and-reel packing container is available for shipment of the following Spansion products: single-chip FBGA packages
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56-Lead
25917b
TLC 1050
FAA064
spansion Packing and Packaging Handbook DATE CODE
Transistor Bo 17 Datasheet
spansion Packing and Packaging Handbook
WNF008
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igbt welding machine scheme
Abstract: ikw40n120h3 aircon l1 smd diode schottky code marking SJ transistor marking code 12W SOT-23 24V application with ice3ar0680jz induction cooker FAULT FINDING IPW65R041 IGW40N60H3 SPW55N80C3
Text: Power Management Selection Guide 2012 [ www.infineon.com/powermanagement ] [ www.infineon.com/PowerManagementICs ] We create Power Management We live Energy Efficiency Infineon, an innovation leader for Power Semiconductor and Energy Efficiency technologies is continually developing and
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fee 210
Abstract: FBC048
Text: Chapter 4 Summary of Packing Quantities CHAPTER 4 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Methodologies Handbook 17 Oct 2008 4-1 Chapter 4 Summary of Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package ball/lead count. The data is sorted
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Ree10
fee 210
FBC048
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Untitled
Abstract: No abstract text available
Text: S98WS256PD0-003 Stacked Multi-chip Product MCP 256 Mbit (16 M x 16-Bit) 1.8 V Burst Mode Flash Memory 128 Mb (8M x 16-Bit) 1.8 V CellularRAM Type 2, Burst Mode Data Sheet S98WS256PD0-003 Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion
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S98WS256PD0-003
16-Bit)
S98WS256PD0-003
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M5M44800ART
Abstract: M5M44800AL
Text: TARGET S P E C nITSUBISHI nEf10RY/ASI<: tlE Preliminary DQiasflb sm M5M44800AJ,L,TP,RT-6,-7,-8,-10,-6S,-7S,-8S,-10S f a s t p a g e m ode 4,194,304-bit(524,288- w o r d b y 8-bit) d y n a m ic ram PIN CONFIGURATION (TOP VIEW) DESCRIPTION vss This is a family o f 524288-word by 8-bit dynamic
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nEf10RY/ASI<
524288-word
M5M44800AXX-6
M5M44800AXX-7
M5M44800AXX-8
U80UXX-10
M5M44800ART
M5M44800AL
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Untitled
Abstract: No abstract text available
Text: M K32VT1664A-8YC 98.07.17 Semiconductor M K 3 2 V T 1 6 6 4 A - 8 Y C 16,777,216 Word x 64 Bit SYNCHRONOUS DYNAMIC RAM MODULE (2BANK):_ DESCRIPTION The Oki MK32VT1664A-8YC is a fully decoded, 16,777,216 x 64bit synchronous dynamic random access memory composed of sixteen 64Mb DRAMs (8Mx8) in TSOP
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K32VT1664A-8YC
MK32VT1664A-8YC
64bit
168-pin
16-Meg
64-bit
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Am29f
Abstract: No abstract text available
Text: I/VHITE /M ICROELECTRONICS ç a 2x2Mx32 5V FLASH SIMM WPF4M32XA-90PSC5 P R ELIM IN A R Y * FEATURES • A ccess Tim e o f 90ns ■ 100,000 Erase/Program Cycles ■ Packaging: ■ Organized as tw o banks o f 2 M x 3 2 • 80-pin S IM M ■ C om m ercial Te m p e ra tu re Range
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WPF4M32XA-90PSC5
2x2Mx32
80-pin
Am29f
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MR27V3255D
Abstract: PA10
Text: O K I Semiconductor MR27V3255D_ Preliminary 1,048,576-Double Word x 32-Bit or 2,097,152-Word x 16-Bit 4-Double Word x 32-Bit or 8-Word x 16-Bit Page Mode One Time PROM DESCRIPTION T he M R 2 7 V 3 2 5 5 D is a 3 2 M b it e le c tric a lly P ro g ra m m a b le R e a d -O n ly M e m o ry w ith p a ge m ode. Its
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MR27V3255D
576-Double
32-Bit
152-Word
16-Bit
16bit.
SSOP70-P-500-0
D0E45fl0
MR27V3255D
PA10
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Untitled
Abstract: No abstract text available
Text: O K I Semiconductor MSM51V16160A 1,048,576-Word x 16-Bit D Y N A M IC R A M : FA ST P A G E M O D E T Y P E DESCRIPTION The MSM51V16160A is a 1,048,576-word x 16-bit dynamic RAM fabricated in OKI's CMOS silicon gate technology. The MSM51V16160A achieves high integration, high-speed operation, and lowpower consumption due to quadruple polysilicon double metal CMOS. The MSM51V16160A is
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MSM51V16160A
576-Word
16-Bit
MSM51V16160A
42-pin
50/44-pin
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