401F
Abstract: 403F 413F 421F 401k 413K 413-F
Text: Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 401 AND 403 SERIES Double-Surface Heat Sinks for TO-3 Case Styles TO-3; Stud-Mount Standard P/N Width in. mm Overall Dimensions in. (mm) Height in. (mm) Semiconductor Mounting Hole Pattem 401A ̆
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Untitled
Abstract: No abstract text available
Text: 50 w atts at 25° C case temperature heat sink mounted TO-220 style pow er package Single screw mounting to heat sink Improved heat dissipation through direct substrate mounting RoHS compliant -3 - 10 10 0.63 0.65" 16.00 16.52mm 0.115 0.135" (2.92 3.44mm)
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O-220
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6399B
Abstract: 6400B-G 6381B 6400B-P2G 6396B-P2G 6399BG 6396BG 6396b 6400BG 6399B-P2G
Text: TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks Grease & Epoxy page112 High power extruded heat sink with large radial fins Mounting Surface Temp Rise Above Ambient—°C 5 80 4 60 3 40 2 20 1 High power extruded heat sink with large radial fins and solderable shoulder pins allows vertical
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O-220
O-218
O-247
page112
O-220,
O-218,
O-247and
6399B
6400B-G
6381B
6400B-P2G
6396B-P2G
6399BG
6396BG
6396b
6400BG
6399B-P2G
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Untitled
Abstract: No abstract text available
Text: presented in Figures 4 and 5 [3]. Figure 4 shows the temperature difference between evaporator and condenser at different power levels when the heat pipes are vertical. Compared to small diameter heat pipes, large diameter heat pipes transport more heat with
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8340TRT00000
Abstract: No abstract text available
Text: Board Level Heat Sinks P/N: 834000T00000 & 8340TRT00000 • No Hardware Device Attachment • Direct SMT Contact to PCB • Solderable Legs • RoHS Compliant 200 400 600 80 4 60 3 40 2 20 1 1 2 3 Heat Dissipated - Watts • Specialized Body Configurations
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834000T00000
8340TRT00000
Wat00
O-263
8340TRT00000
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raspberry pi 3
Abstract: No abstract text available
Text: Raspberry PI Heat Sink Kit The Farnell Raspberry PI heat sink kit will ensure your Raspberry PI remains cool with no need for Fans. They will also help extend the life of your Raspberry PI and thereby reduce hardware failures. The heat sink kit comprises of 3 high quality Pressfin heat sinks which are designed to fit
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element14
raspberry pi 3
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TO-268
Abstract: No abstract text available
Text: • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets • Unique aluminum extrusion
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O-263)
O-268)
O-263
O-268
1-866-9-OHMITE
TO-268
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Untitled
Abstract: No abstract text available
Text: | | | Search Products Documentation Resources My Account Home > Products > By Type > Heat Sinks & Thermal Solutions 6 - 1542003 Customer Support > Product Feature Selector > Product Details - 3 Product Details Quick Links Heat Sink Assemblies Converted to EU RoHS/ELV Compliant
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HTS611
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semiconductor packages
Abstract: No abstract text available
Text: | | | Search Products Documentation Resources My Account Home > Products > By Type > Heat Sinks & Thermal Solutions 7 - 1542004 Customer Support > Product Feature Selector > Product Details - 3 Product Details Quick Links Heat Sink Assemblies Converted to EU RoHS/ELV Compliant
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HTS99
semiconductor packages
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7141DG
Abstract: 504102B00000G 50410-2 507302B00000
Text: TO-220 Heat Sinks Copper narrow channel style heat sink with integrated clip 80 8 60 6 40 4 Case Temp Rise Above Ambient—°C 2 1 2 3 Heat Dissipated—Watts 4 16.51 0.650 3.05 (0.120) 5.72 (0.225) 5 Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION
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7141DG
7141DG
504102B00000G
50410-2
507302B00000
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austerlitz
Abstract: transistor k42 Layouts
Text: austerlitz electronic Kühlkörper für Plastik- und TO 3 - Transistoren Heat sinks for plastic and TO 3 transistors. Dissipateurs pour des transistors plastiques et les types TO 3 Höhe mm : 13/20/26/32 (Toleranz-1) Material: AL 1,5 Oberfläche: schwarz eloxiert
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Test
Abstract: thermal analysis of heat sink WV-T220-101
Text: WV series Heat Sink Thermal Performance Analysis/Test Air Direction Options: 1 parallel with the fins (2) from side to side of the heat sink (3) perpendicular to device, from the front (4) perpendicular to device, from the back The Analyses/Tests below using Option (1) and (2) plus free convection (no forced air)
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O-247
Test
thermal analysis of heat sink
WV-T220-101
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Untitled
Abstract: No abstract text available
Text: 501603B00100G - Board level heatsinks Page 1 of 2 Tel toll-free : +1-855-32-AAVID Search Heat sinks 501603B00100G By Device TO-3 Board Level Related Information Building a Part Number Download Catalog Low cost diamond shaped basket heat sink with solderable mounts
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501603B00100G
1-855-32-AAVID
501603B00100G
10/17/20me
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435B
Abstract: diagram 3 phase heater diagram 3 phase heater control CSA22 G3PB-215B-2-VD G3PB-215B-3-VD G3PB-225B-2-VD G3PB-225B-3-VD G3PB-235B-2-VD G3PB-235B-3-VD
Text: Solid State Contactors Three-phase G3PB-2/-3 Refer to Safety Precautions for All Solid State Relays. Compact, Low-cost Solid State Contactors of an Innovative Construction Ideal for Three-phase Heaters • Slim Units with three-phase output. • Optimum heat sinks attach to models without built-in heat sinks.
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Y92B-P50
EN60947-4-3
IEC947-4-3)
UL508,
CSA22
435B
diagram 3 phase heater
diagram 3 phase heater control
G3PB-215B-2-VD
G3PB-215B-3-VD
G3PB-225B-2-VD
G3PB-225B-3-VD
G3PB-235B-2-VD
G3PB-235B-3-VD
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G3PB-225B-3-VD
Abstract: G3PB-415B-2 G3PB-415B-3-VD
Text: Solid State Contactors Three-phase G3PB-2/-3 CSM_G3PB-2_-3_DS_E_2_1 Compact, Low-cost Solid State Contactors of an Innovative Construction Ideal for Three-phase Heaters • Slim Units with three-phase output. • Optimum heat sinks attach to models without built-in heat sinks.
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Y92B-P50
EN60947-4-3
IEC947-4-3)
UL508,
CSA22
G3PB-225B-3-VD
G3PB-415B-2
G3PB-415B-3-VD
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PF523
Abstract: PF523G
Text: Standard Board Level Heat Sinks Page 1 of 2 Home | Contact Us | About Aavid -Useful Links- Part Number: PF523G Search by part # PF523G Check distributor part inventory Diamond shaped heat sink. For use with TO-3 packages. Order this part through an Authorized Distributor
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PF523G
PF523
PF523G
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Untitled
Abstract: No abstract text available
Text: Board Level Heat Sinks P/N: 832202B00000 TO-220 PRODUCT SPECIFICATIONS CUSTOMIZED HEATSINKS • Specialized Plating • Specialized Body Configurations • Contact Applications Engineering 200 400 600 800 1000 100 20 80 16 60 12 40 8 20 4 1 2 3 Heat Dissipated - Watts
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832202B00000
O-220
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Untitled
Abstract: No abstract text available
Text: TD62308AP IL08 LOW INPUT ACTIVE 1.5 A DRIVER —TOP VIEW— COM 16 04 15 I4 14 1 VCC1 2 01 3 I1 +4.5 to +5.5 V HEAT SINK & GND 13 12 4 5 HEAT SINK & GND I3 11 03 10 COM 9 6 I2 7 02 8 VCC2 (+4.5 to +5.5 V)
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TD62308AP
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OMS32F60ML
Abstract: OMS38L60ML OMS60N10ML OMS75N06ML
Text: OMS38L60ML Preliminary Data Sheet OMS75N06ML OMS60N10ML OMS32F60ML 3-PHASE BRIDGE, MULTI-CHIP MODULES IN AN INDUSTRIAL ISOLATED PACKAGE 60 To 600 Volt, 25 To 75 Amp Modules, 3-Phase Bridge Configuration FEATURES • • • • • Isolated Heat Sink Low Inductance Design
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OMS75N06ML
OMS38L60ML
OMS60N10ML
OMS32F60ML
OMS32F60ML
OMS38L60ML
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2-64A2A
Abstract: 2-94D1A T03PN
Text: T0-3P N TQ-220SM 15 9MAX * 3 2± 0 . } 1. Gate 2. Collector (Heat Sink) 3. Emitter 1. Gate 2. Collector (Heat Sink) 3. Emitter TO-3P(LH) T0-220(IS) 1. Gate 2. Collector 3. Emitter 1. Gate 2. Collector (Heat Sink) 3. Emitter 19 T0-3P(L) 2-109A4A 3±0 5 24± 0 5
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TQ-220SM
T0-220
2-109A4A
2-109E1A
2-94D1A
2-109C1A
2-109D1A
2-95A1A
2-64A2A
2-64A2A
2-94D1A
T03PN
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heat sink
Abstract: No abstract text available
Text: > HEAT SINK TEMPERATURE RISE ABOVE AMBIENT - °C § 3 HEAT SINK TEMPERATURE 3 3 AIR VELOCITY THERMAL RESISTANCE FROM HEAT SINK TO AMBIENT - “C/WAH l\9 SINK TO AMBIENT - °C/WATT PO ro ro t o CO ro co ro ro I M i c r o p r o c e s s o r H eat S in k s N N> Nr o) C~>
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1020239
Abstract: DES285
Text: £> 5 1 Ì ^ * ^ ^ ^ S £ I f S? 1 | ä ? 1 1 1 ro o. co «B. CD i i ¡ 1^.1 HEAT SINK TEMPERATURE RISE ABOVE A M BIENT-°C 3 4 *. ._ _ ei to o ° 3 ^CD e* no o - co 03 THERMAL RESISTANCE FROM HEAT SINK TO AMBIENT - °C/WATT 2. o o Tolerances are ±28 Oil} unless otherwise specified
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PF184
PF184.
O-220
PF185,
PF187
PF185
7023B-
1020239
DES285
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Untitled
Abstract: No abstract text available
Text: TRANSISTOR/TO SOCKETS TO SERIES TO-3 Power Transistor Sockets SPECIFY TO-3 PART NUMBER FROM THE CHART BELOW Quality sockets simplify transistor mounting, uses chassis as a heat sink. Integral mounting saddle is tapped for 6-32 NC screws. Body will not crack/chip during handling
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O-340-T
O-340-G
O-34O0-T
T0-360-T
852-26904858-Fax:
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qe rts diode
Abstract: 60N10
Text: Preliminary Data Sheet OMS75N06ML OMS38L60ML OMS6ONIOML OMS32F6QML 3-PHASE BRIDGE, MULTI-CHIP MODULES IN AN INDUSTRIAL ISOLATED PACKAGE 60 To 600 Volt. 25 To 75 Amp Modules. 3-Phase Bridge Configuration FEATURES • • • • • Isolated Heat Sink Low Inductance Design
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OMS75N06ML
OMS38L60ML
OMS32F6QML
OMS75N06M
0MS32F6QML
75N06ML
60N10ML
38L60ML
32F60ML
qe rts diode
60N10
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