A2 diode
Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Text: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5
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S176GM-50-3EU,
S176GM-50-8EU-2
S208GD-50-5ML-2
S208GD-50-5EL-1
P208GD-50-LML,
S208GD-50-8EU-2
S216GM-40-8EV
P240GN-50-LMU,
S256GD-40-LMV,
S272GP-50-LMU,
A2 diode
transistor A2
3eb data
lmu a2
TQFP 32 PACKAGE
272-pin
TQFP 100 Pitch 0,4
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PDF
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tqfp 100 LAND PATTERN
Abstract: TQFP64 land package Ablestik TQFP100 82V3280EQG JESD22-A104 TQFP-100 TQFP-64 tQFP100 package
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA 96138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0902-04R1 DATE: September 24, 2009 14 mm x 14 mm x 1.4 mm TQFP-100 & Product Affected: 10 mm x 10 mm x 1.4 mm TQFP-64 (RoHS) Date Effective:
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A0902-04R1
TQFP-100
TQFP-64
J-STD-020
A0902-04
82V3202DKG
82V3202DKG8
82V3255DKG
82V3255DKG8
82V3280DQG
tqfp 100 LAND PATTERN
TQFP64 land package
Ablestik
TQFP100
82V3280EQG
JESD22-A104
TQFP-100
TQFP-64
tQFP100 package
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PDF
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82V3380EQG8
Abstract: tqfp-64 G700 TQFP100 TQFP-100 TQFP64 land package 82v3202 tqfp 100 LAND PATTERN 82V3380DQG8 PSC-4140
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA 96138 PRODUCT/PROCESS CHANGE NOTICE PCN March 18, 2009 PCN #: A0902-04 DATE: 14 mm x 14 mm x 1.4 mm TQFP-100 & Product Affected: 10 mm x 10 mm x 1.4 mm TQFP-64 (RoHS) Date Effective:
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A0902-04
TQFP-100
TQFP-64
J-STD-020
82V3202DKG
82V3202DKG8
82V3255DKG
82V3255DKG8
82V3280DQG
82V3380EQG8
tqfp-64
G700
TQFP100
TQFP-100
TQFP64 land package
82v3202
tqfp 100 LAND PATTERN
82V3380DQG8
PSC-4140
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PDF
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TQ144
Abstract: TQ176 TQ-144 HT176 TQ100 HT100 HT144 HT-100 package drawings
Text: Package Drawings TQFP/HTQFP Packages - TQ100, TQ144, TQ176, HT100, HT144, HT176 10-28 November 13, 1997 Version 1.2
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TQ100,
TQ144,
TQ176,
HT100,
HT144,
HT176
TQ144
TQ176
TQ-144
HT176
TQ100
HT100
HT144
HT-100
package drawings
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PDF
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Untitled
Abstract: No abstract text available
Text: SmartV.XX Modem with 128-Pin TQFP V.90+/V.34/V.32bis CX81801 Smart Modem with CX20463/CX20493 SmartDAA and Optional CX20437 Voice Codec Data Sheet Doc. No. 101898E December 10, 2002 SmartV.XX Modem with 128-Pin TQFP Data Sheet Revision Record Revision E
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Original
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128-Pin
32bis
CX81801
CX20463/CX20493
CX20437
101898E
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PDF
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TRAY DIMENSIONS TQFP 64
Abstract: No abstract text available
Text: TRAY CONTAINER 150°C MAX 12.60 A' 10x25=250 11.25 A 12.20 11.10 9.1 113.4 TQFP7×7×1.0mm 135.9 UNIT : mm 9.1 292.8 315.0 322.6 SECTION A – A' Applied Package 48-pin Plastic TQFP (Fine Pitch)(1.0mm thick) 64-pin Plastic TQFP (Fine Pitch)(1.0mm thick)
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48-pin
64-pin
SSD-A-H6413-2
TRAY DIMENSIONS TQFP 64
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PDF
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MAX11811
Abstract: MAX1180 MAX1181 MAX1181ECM MAX1182 MAX1183 MAX1184 MAX1185 MAX4108
Text: 19-2093; Rev 1; 2/07 KIT ATION EVALU E L B AVAILA Dual 10-Bit, 80Msps, 3V, Low-Power ADC with Internal Reference and Parallel Outputs Video Application 48 TQFP-EP* MAX1181ECM+ -40°C to +85°C 48 TQFP-EP* *EP = Exposed paddle. +Denotes a lead-free package.
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10-Bit,
80Msps,
MAX1181ECM+
MAX1181
MAX11811
MAX1180
MAX1181
MAX1181ECM
MAX1182
MAX1183
MAX1184
MAX1185
MAX4108
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PDF
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Untitled
Abstract: No abstract text available
Text: 125°C BAKE/140°C MAX 109.9 13.00 15.70 TQFP 10x10 1.0T 135.9 UNIT : mm 12.37 A A' 15.20 12.37 288.8 13.1 315.0 322.6 SECTION A-A' 6.35 7.62 12.37 6.401 Applied Package Quantity (pcs) 64-pin Plastic TQFP (Fine Pitch)(1.0mm thick) MAX. 160 Tray Material
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BAKE/140
64-pin
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PDF
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Untitled
Abstract: No abstract text available
Text: 19-2094; Rev 1; 4/06 Dual 10-Bit, 65Msps, 3V, Low-Power ADC with Internal Reference and Parallel Outputs Applications Ordering Information PART TEMP RANGE PINPACKAGE PKG CODE MAX1182ECM -40°C to +85°C 48 TQFP-EP* C48E-7 MAX1182ECM+ -40°C to +85°C 48 TQFP-EP*
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10-Bit,
65Msps,
MAX1182
MAX1182
10-bit
195mW
20MHz
65Msps.
400MHz
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PDF
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Untitled
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE 64 PIN PLASTIC FPT-64P-M04 EIAJ code : ∗TQFP064-P-1010-1 64-pin plastic TQFP Lead pitch 0.50mm Package width x package length 10 × 10mm Lead shape Gullwing Sealing method Plastic mold FPT-64P-M04 64-pin plastic TQFP (FPT-64P-M04)
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FPT-64P-M04
TQFP064-P-1010-1
64-pin
FPT-64P-M04)
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PDF
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JEDEC TQFP 10*10 1.0 MM
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A73B-1 TQFP 10x10 1.0T 64 pin TQFP 10 × 10 Terminal Spacing Linear = 0.5 A B 48 33 32 49 F 64 R Q S D C detail of lead end 17 16 1 G H I M J M P K N L NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3A73B-1
S64GB-50-9EU-1
JEDEC TQFP 10*10 1.0 MM
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PDF
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Untitled
Abstract: No abstract text available
Text: 19-2094; Rev 1; 4/06 Dual 10-Bit, 65Msps, 3V, Low-Power ADC with Internal Reference and Parallel Outputs Applications Ordering Information PART TEMP RANGE PINPACKAGE PKG CODE MAX1182ECM -40°C to +85°C 48 TQFP-EP* C48E-7 MAX1182ECM+ -40°C to +85°C 48 TQFP-EP*
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10-Bit,
65Msps,
MAX1182
MAX1182
10-bit
195mW
20MHz
65Msps.
400MHz
|
PDF
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N2926
Abstract: No abstract text available
Text: 19-2094; Rev 1; 4/06 Dual 10-Bit, 65Msps, 3V, Low-Power ADC with Internal Reference and Parallel Outputs Applications Ordering Information PART TEMP RANGE PINPACKAGE PKG CODE MAX1182ECM -40°C to +85°C 48 TQFP-EP* C48E-7 MAX1182ECM+ -40°C to +85°C 48 TQFP-EP*
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Original
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10-Bit,
65Msps,
MAX1182
MAX1182
10-bit
195mW
20MHz
65Msps.
400MHz
N2926
|
PDF
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qfn 44 PACKAGE footprint
Abstract: qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH ML6652 LPCC44 eco solder paste
Text: AN-002 - ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE AN-002 ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE Introduction In November 2003, the ML6652CM/EM package version of the ML6652 10/100 Mb/s Ethernet Media Converter was introduced. The ML6652CM/EM is the QFN/LPCC44 package version of the ML6652. The
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AN-002
ML6652
AN-002
ML6652CM/EM
QFN/LPCC44
ML6652.
ML6652CH/EH
qfn 44 PACKAGE footprint
qfn 76 PACKAGE footprint
ML6652CM
qfn 48 PACKAGE footprint
QFN 36 footprint
qfn 64 pcb layout
ML6652CH
LPCC44
eco solder paste
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PDF
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|
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Untitled
Abstract: No abstract text available
Text: 19-2093; Rev 1; 2/07 Dual 10-Bit, 80Msps, 3V, Low-Power ADC with Internal Reference and Parallel Outputs Video Application 48 TQFP-EP* MAX1181ECM+ -40°C to +85°C 48 TQFP-EP* *EP = Exposed paddle. +Denotes a lead-free package. 37 38 39 40 41 42 43 44 45 46
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10-Bit,
80Msps,
MAX1181
246mW,
20MHz
80Msps.
400MHz
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 19-2093; Rev 1; 2/07 Dual 10-Bit, 80Msps, 3V, Low-Power ADC with Internal Reference and Parallel Outputs Video Application 48 TQFP-EP* MAX1181ECM+ -40°C to +85°C 48 TQFP-EP* *EP = Exposed paddle. +Denotes a lead-free package. 37 38 39 40 41 42 43 44 45 46
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Original
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10-Bit,
80Msps,
MAX1181
246mW,
20MHz
80Msps.
400MHz
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 19-2093; Rev 1; 2/07 Dual 10-Bit, 80Msps, 3V, Low-Power ADC with Internal Reference and Parallel Outputs Video Application 48 TQFP-EP* MAX1181ECM+ -40°C to +85°C 48 TQFP-EP* *EP = Exposed paddle. +Denotes a lead-free package. 37 38 39 40 41 42 43 44 45 46
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Original
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10-Bit,
80Msps,
MAX1181
246mW,
20MHz
80Msps.
400MHz
|
PDF
|
Untitled
Abstract: No abstract text available
Text: KIT ATION EVALU E L B AVAILA 19-2097; Rev 1; 2/07 Dual 10-Bit, 105Msps, 3.3V, Low-Power ADC with Internal Reference and Parallel Outputs PIN-PACKAGE -40°C to +85°C 48 TQFP-EP* MAX1180ECM+ -40°C to +85°C 48 TQFP-EP* +Denotes a lead-free and RoHS-compliant package.
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10-Bit,
105Msps,
MAX1180
413mW,
20MHz
105Msps.
400MHz
|
PDF
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Untitled
Abstract: No abstract text available
Text: KIT ATION EVALU E L B AVAILA 19-2097; Rev 1; 2/07 Dual 10-Bit, 105Msps, 3.3V, Low-Power ADC with Internal Reference and Parallel Outputs PIN-PACKAGE -40°C to +85°C 48 TQFP-EP* MAX1180ECM+ -40°C to +85°C 48 TQFP-EP* +Denotes a lead-free and RoHS-compliant package.
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10-Bit,
105Msps,
MAX1180
413mW,
20MHz
105Msps.
400MHz
|
PDF
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MAX1180
Abstract: MAX1180ECM MAX1181 MAX1182 MAX1183 MAX1184 MAX1185 MAX2451 MAX4108
Text: KIT ATION EVALU E L B AVAILA 19-2097; Rev 1; 2/07 Dual 10-Bit, 105Msps, 3.3V, Low-Power ADC with Internal Reference and Parallel Outputs PIN-PACKAGE -40°C to +85°C 48 TQFP-EP* MAX1180ECM+ -40°C to +85°C 48 TQFP-EP* +Denotes a lead-free and RoHS-compliant package.
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10-Bit,
105Msps,
MAX1180ECM+
MAX1180
MAX1180
MAX1180ECM
MAX1181
MAX1182
MAX1183
MAX1184
MAX1185
MAX2451
MAX4108
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PDF
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Untitled
Abstract: No abstract text available
Text: 19-2094; Rev 1; 4/06 KIT ATION EVALU E L B AVAILA Dual 10-Bit, 65Msps, 3V, Low-Power ADC with Internal Reference and Parallel Outputs 48 TQFP-EP* C48E-7 MAX1182ECM+ -40°C to +85°C 48 TQFP-EP* C48E-7 +Denotes lead-free package. *EP = Exposed paddle. Pin-Compatible Versions table at end of data sheet.
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10-Bit,
65Msps,
C48E-7
MAX1182ECM+
MAX1182
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PDF
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EPM3064A
Abstract: No abstract text available
Text: EPM3064A Dedicated Pin-Outs ver. 1.0 Dedicated Pin 44-Pin PLCC 44-Pin TQFP 100-Pin TQFP INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI 1 TMS (1) TCK (1) TDO (1) GNDINT GNDIO 43 1 44 2 7 13 32 38 22, 42 10, 17, 30, 36 37 39 38 40 1 7 26 32 16, 36 4, 11, 24, 30
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EPM3064A
44-Pin
100-Pin
100-Pin
|
PDF
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THE OLDEST motorola handbook
Abstract: HYC9088 COM20022 RG62
Text: COM20022 10 Mbps ARCNET ANSI 878.1 Controller with 2Kx8 On-Board RAM FEATURES !" !" !" !" !" !" !" !" !" !" New Features Data Rates up to 10 Mbps Selectable 8/16 Bit Wide Bus With Data Swapper Programmable DMA Channel Programmable Reconfiguration Times 48 Pin TQFP Package
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COM20022
COM20022
THE OLDEST motorola handbook
HYC9088
RG62
|
PDF
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D12 000R
Abstract: HYC9088 micro-programmed control-unit COM20022 RG62
Text: COM20022 10 Mbps ARCNET ANSI 878.1 Controller with 2Kx8 On-Board RAM FEATURES !" !" !" !" !" !" !" !" !" !" New Features Data Rates up to 10 Mbps Selectable 8/16 Bit Wide Bus With Data Swapper Programmable DMA Channel Programmable Reconfiguration Times 48 Pin TQFP Package
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COM20022
COM20022
D12 000R
HYC9088
micro-programmed control-unit
RG62
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PDF
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