tqfp 44 thermal resistance
Abstract: tqfp 64 thermal resistance CPGA MQUAD PQFP-128 TQFP 132 PACKAGE Package 48 LCC CQFP 240
Text: Thermal Resistance of Packages 4401035 NC Thermal Resistance of Packages Similarly, thermal resistance from junction to case is denoted by θ JC , and defined by θ JC = T j – T c ⁄ P d ; here, T c is the case temperature (˚C) at the external surface of the package.
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ep600i
Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Text: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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208 pin rqfp drawing
Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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transistors BC 458
Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Text: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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EP20K100E
Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Text: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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49-pin
169-pin
EP20K100E
EP20K160E
EP20K200
EP20K200E
EP20K300E
EP20K60E
EP20K100
0245 TQFP-208
208RQFP
280-PGA
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BC 1098
Abstract: EPM7384 ALTERA 68 PLCC t187
Text: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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232-pin
240-pin
100-pin
256-pin
484-pin
672-pin
BC 1098
EPM7384
ALTERA 68 PLCC
t187
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bd248
Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)
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ep600i
Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)
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240 pin rqfp drawing
Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)
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7000B,
7000AE,
240 pin rqfp drawing
BGA sumitomo
724p
EP1C12
Altera pdip top mark
epm7032 plcc
FBGA672
192 BGA PACKAGE thermal resistance
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100 PIN "PGA" ALTERA DIMENSION
Abstract: No abstract text available
Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.
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altera ep610
Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance
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AN1902
QFN 76 9x9 footprint
QFN 64 8x8 footprint
QFN PACKAGE thermal resistance
JEDEC JESD51-8 BGA
4914 smd
qfn 32 land pattern
QFN 64 9x9 footprint
QFN 9X9
AN1902
MO-220
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BD 4914
Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.
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AN1902/D
BD 4914
QFN 76 9x9 footprint
qfn 48 7x7 stencil
QFN 64 8x8 footprint
QFN 64 9x9 footprint
land pattern BGA 0.75 freescale
QFN 56 7x7 footprint
QFN PCB Layout guide
Motorola MAP QFN
MO-220 8x8
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EP4CE15
Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE15
MS 034
BGA and QFP Altera Package mounting
Altera pdip top mark
jedec package MO-247
SOIC 20 pin package datasheet
QFN "100 pin" PACKAGE thermal resistance
Theta JC of FBGA
QFN148
EP4CE22
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EP4CE6 package
Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE6 package
EP4CE40
Altera EP4CE6
EP4CE55
5M240Z
5M1270Z
QFN148
5m570z
5M40
5M80
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PCMCIA Design
Abstract: TQFP 132 PACKAGE SN74ACT3641 tqfp 64 thermal resistance
Text: FIFO Surface-Mount Packages for PCMCIA Applications Tom Jackson Advanced System Logic – Semiconductor Group SDMA001A 69 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information
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SDMA001A
36-bit
PCMCIA Design
TQFP 132 PACKAGE
SN74ACT3641
tqfp 64 thermal resistance
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LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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TQFP 100 pin ic
Abstract: 208ld
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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Abstract: No abstract text available
Text: Preliminary GS880F18/36T-10/11/11.5/12/14 100 Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 36 8Mb Sync Burst SRAMs Features • Flow through mode operation. • 3.3V +10%/-5% Core power supply. • 2.5V or 3.3V I/O supply. • LBO pin for linear or interleaved burst mode.
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GS880F18/36T-10/11/11
100-lead
GS880F18/36T1
K880F18/36T1
1/2000L
GS880F1836T
1/2000L;
3/2000N
-10Mhz
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Abstract: No abstract text available
Text: Preliminary GS880F18/36T-10/11/11.5/12/14 100 Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 36 8Mb Sync Burst SRAMs Features 10ns - 14ns 3.3V VDD 3.3V & 2.5V I/O broadest access to multiple vendor sources. Boards designed with FT pin pads tied low may be stuffed with GSI’s Pipeline/Flow through
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GS880F18/36T-10/11/11
GS880F1836T
1/2000L;
3/2000N
-10Mhz
1/2000N;
3/2000O
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GS880F18B
Abstract: GS880F32B GS880F36B
Text: GS880F18/32/36BT-5.5/6/6.5/7/7.5/8.5 100-Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • Flow Through mode operation; Pin 14 = No Connect • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply
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GS880F18/32/36BT-5
100-Pin
100-lead
GS880F18B
GS880F32B
GS880F36B
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TQFP 132 PACKAGE
Abstract: PCMCIA CARD, Static Memory, dual battery TQFP-120 SN74ACT3641
Text: FIFO Surface-Mount Packages for PCMCIA Applications Tom Jackson Advanced System Logic – Semiconductor Group SDMA001A 69 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information
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SDMA001A
TQFP 132 PACKAGE
PCMCIA CARD, Static Memory, dual battery
TQFP-120
SN74ACT3641
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GS840F18A
Abstract: GS840F32A GS840F36A
Text: Preliminary GS840F18/32/36AT-7.5/8/8.5/10/12 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features Designing For Compatibility • Flow Through mode operation • 3.3 V +10%/–5% core power supply • 2.5 V or 3.3 V I/O supply
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GS840F18/32/36AT-7
100-lead
840F18A
GS840F18A
GS840F32A
GS840F36A
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4572 IC 8PIN
Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
Text: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines
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503-Pin
4572 IC 8PIN
epx780
TQFP 144 PACKAGE DIMENSION
ALTERA EP610
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