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    TQFP 7X7 TRAY Search Results

    TQFP 7X7 TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ELANSC300-33VC Rochester Electronics LLC Microcontroller, 32-Bit, 33MHz, CMOS, PQFP208, TQFP-208 Visit Rochester Electronics LLC Buy
    CY7C4285-15ASC Rochester Electronics LLC FIFO, 64KX18, 10ns, Synchronous, CMOS, PQFP64, 10 X 10 MM, TQFP-64 Visit Rochester Electronics LLC Buy
    ML6431CH Rochester Electronics LLC Consumer Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, TQFP-32 Visit Rochester Electronics LLC Buy
    ML6430CH Rochester Electronics LLC Consumer Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, TQFP-32 Visit Rochester Electronics LLC Buy
    RAA230403GFT Renesas Electronics Corporation ICs for Microcontroller Power Supply System, TQFP-32, /Tray Visit Renesas Electronics Corporation

    TQFP 7X7 TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MLX81207

    Abstract: 008MIN JESD22-B102 tray drawing tqfp 5x5 tray drawing tqfp 7x7
    Text: MLX81205/07/10/15 Features Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:


    Original     		PDF MLX81205/07/10/15 MLX16-FX 20DMIPS ISO/TS16949 ISO14001 10-May-2012 MLX81207 008MIN JESD22-B102 tray drawing tqfp 5x5 tray drawing tqfp 7x7

    QFN47

    Abstract: MLX81207 melexis hall current sensor MLX16-FX QFN48 5x5 package JEDEC TRAY DIMENSIONS QFN 5x5 sensorless bldc driver
    Text: MLX81205/07/10/15 Features Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:


    Original     		PDF MLX81205/07/10/15 MLX16-FX 20DMIPS ISO/TS16949 ISO14001 04-April-2012 QFN47 MLX81207 melexis hall current sensor QFN48 5x5 package JEDEC TRAY DIMENSIONS QFN 5x5 sensorless bldc driver

    MLX81207

    Abstract: MLX81215 PEAK TRAY QFN 5X5 JEDEC TRAY DIMENSIONS QFN 5x5 MLX81205 Melexis LIN tray drawing tqfp 5x5 MLX16 TRANSISTOR SMD MARKING CODE BLDC tray drawing tqfp 7x7
    Text: MLX81205/07/10/15 Features Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:


    Original     		PDF MLX81205/07/10/15 MLX16-FX 20DMIPS ISO/TS16949 ISO14001 11-May-2012 MLX81207 MLX81215 PEAK TRAY QFN 5X5 JEDEC TRAY DIMENSIONS QFN 5x5 MLX81205 Melexis LIN tray drawing tqfp 5x5 MLX16 TRANSISTOR SMD MARKING CODE BLDC tray drawing tqfp 7x7

    tqfp 7x7

    Abstract: MLX16-FX
    Text: MLX81205/07/10/15 Features Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:


    Original     		PDF MLX81205/07/10/15 MLX16-FX 20DMIPS ISO/TS16949 ISO14001 04-April-2012 tqfp 7x7

    QFN48 5x5 package

    Abstract: No abstract text available
    Text: MLX81205/07/10/15 123456278 Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:


    Original     		PDF MLX81205/07/10/15 MLX16-FX 20DMIPS ISO/TS16949 ISO14001 11-May-2012 QFN48 5x5 package

    TQFP 100 pin ic

    Abstract: tqfp 7x7 1.4 tray tqfp 7x7 tray MS-026 JEDEC tray standard 17 x 17 tqfp 64 thermal resistance MS-026 TQFP TQFP Package 44 lead tqfp 32 thermal resistance CO-124
    Text: LEADFRAME data sheet TQFP Features: Thin Quad Flat Pack TQFP Packages: Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink


    Original     		PDF MS-026 TQFP 100 pin ic tqfp 7x7 1.4 tray tqfp 7x7 tray MS-026 JEDEC tray standard 17 x 17 tqfp 64 thermal resistance MS-026 TQFP TQFP Package 44 lead tqfp 32 thermal resistance CO-124

    S1L50552

    Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
    Text: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells


    Original     		PDF S1L60173F00A000 S1L50552 tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon

    tray 20 x 14

    Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
    Text: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type


    Original     		PDF E04102 tray 20 x 14 BGA 31 x 31 tray bga trays tray bga 17 bga tray

    tray qfn 6x6

    Abstract: tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5
    Text: Supertex Packaging Specifications Suffix Package Type B1 B2 FB FG FG FG FG GA GA K1 K1 K2 K4 K4 K5 K6 K6 K6 K6 K6 K6 K6 K6 K6 K6 K7 K7 K7 K7 K7 K7 LG L / LL MG MG N2 N3 N3 N5 N8 NG NG P P P P PG PG PG PG PJ PJ PJ SG T TG WG WG WG WG 26L BCC 84L BCC+ 64B FCBGA


    Original     		PDF O-236AB OT-23) OT-23 O-220 O-252 OT-223 QFN00/Reel 490/Tray tray qfn 6x6 tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5

    AD5820

    Abstract: ad6548
    Text: Tape and Reel Packaging Introduction Specifications The electronics industry is making a tremendous investment in surfacemount technology. The reasons for this investment include cost savings resulting from automated component placement and increased density


    Original     		PDF T03762-0-1/13 AD5820 ad6548

    100L

    Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
    Text: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP


    Original     		PDF

    peak tray qfn 6x6

    Abstract: tqfp 6X6 tray 6x6 TRAY tqfp
    Text: MLX81100 DC-Motor Controller Features CPU o o MelexCM CPU Dual RISC CPU – 5MIPS o LIN protocol controller o 16-bit application CPU90 Internal RC-Oscillator Memories o o 2kbyte RAM, 30kbyte Flash, 128 byte EEPROM Flash for series production Periphery o


    Original     		PDF MLX81100 16-bit CPU90 30kbyte 100-kBaud 100Hz 100kHz 16-channel 10-bit peak tray qfn 6x6 tqfp 6X6 tray 6x6 TRAY tqfp

    tqfp 7x7 tray

    Abstract: Handsfree receiver sat tqfp 7x7 SUMI
    Text: ACE9040 Audio Processor Advance Information FEATURES • Low Power and Low Voltage 3•6 to 5·0 V Operation ■ ■ ■ ■ ■ ■ ■ ■ ■ Power Down Modes Direct Connections to Microphone and Earpiece Compander with wide operating range: Compressor 74 db typ., Expander 36 dB typ.


    Original     		PDF ACE9040 10X10 ACE9040 ACE9020 ACE9030 ACE9040K/IW/FP1N ACE9040K/IW/FP1Q ACE9040K/IW/FP2N ACE9040K/IW/FP2Q tqfp 7x7 tray Handsfree receiver sat tqfp 7x7 SUMI

    LQFP-48 thermal pad

    Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
    Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /


    Original     		PDF

    Full Bridge N-Channel FET driver IC

    Abstract: No abstract text available
    Text: MLX81100 DC-Motor Controller Features CPU o o MelexCM CPU Dual RISC CPU – 5MIPS o LIN protocol controller o 16-bit application CPU90 Internal RC-Oscillator Memories o o 2kbyte RAM, 30kbyte Flash, 128 byte EEPROM Flash for series production Periphery o


    Original     		PDF MLX81100 16-bit CPU90 30kbyte 100-kBaud 100Hz 100kHz 16-channel 10-bit Full Bridge N-Channel FET driver IC

    MLX81150

    Abstract: transistor smd code marking KEY marking code E2 p SMD Transistor ISO-7637-2 pulse 5 high voltage adc QFN32 pad SMD TRANSISTOR MARKING 3B 12v 4-pin DC MOTOR SPEED CONtrol ic 7637-2 pulse 1 jedec MS-026 ABA
    Text: MLX81150 LIN-Slave for relay and DC motor control Features Microcontroller: MLX16x8 RISC CPU o o o 16 bit RISC-CPU Co-processor for fast multiplication and division In-circuit debug and emulation Memories o o o 32 kByte Flash with ECC 2 kByte RAM 384 Byte EEPROM with ECC for customer purpose


    Original     		PDF MLX81150 MLX16x8 J2602, ISO/TS16949 ISO14001 MLX81150 transistor smd code marking KEY marking code E2 p SMD Transistor ISO-7637-2 pulse 5 high voltage adc QFN32 pad SMD TRANSISTOR MARKING 3B 12v 4-pin DC MOTOR SPEED CONtrol ic 7637-2 pulse 1 jedec MS-026 ABA

    Untitled

    Abstract: No abstract text available
    Text: MLX81150 LIN-Slave for relay and DC motor control Features Microcontroller: MLX16x8 RISC CPU o o o 16 bit RISC-CPU Co-processor for fast multiplication and division In-circuit debug and emulation Memories o o o 32 kByte Flash with ECC 2 kByte RAM 384 Byte EEPROM with ECC for customer purpose


    Original     		PDF MLX81150 MLX16x8 J2602, ISO/TS16949 ISO14001

    Untitled

    Abstract: No abstract text available
    Text: MLX81150 LIN-Slave for relay and DC motor control Features Microcontroller: MLX16x8 RISC CPU o o o 16 bit RISC-CPU Co-processor for fast multiplication and division In-circuit debug and emulation Memories o o o 32 kByte Flash with ECC 2 kByte RAM 384 Byte EEPROM with ECC for customer purpose


    Original     		PDF MLX81150 MLX16x8 J2602, ISO/TS16949 ISO14001

    transistor D613 equivalent

    Abstract: TRANSISTOR D613 41e hall sensor transistor marking 9D transistor bc 567
    Text: 123455678 LIN-Slave for relay and DC motor control 9ABCDEAF8 Microcontroller: MLX16x8 RISC CPU o o o 16 bit RISC-CPU Co-processor for fast multiplication and division In-circuit debug and emulation Memories o o o 32 kByte Flash with ECC 2 kByte RAM 384 Byte EEPROM with ECC for customer purpose


    Original     		PDF MLX16x8 J2602, ISO/TS16949 ISO14001 MLX81150 transistor D613 equivalent TRANSISTOR D613 41e hall sensor transistor marking 9D transistor bc 567

    tqfp 7x7 tray

    Abstract: AND8020 MC100E164 MC100LVE164 MC100LVE164FA MC100LVE164FAR2
    Text: MC100LVE164 3.3VĄECL 16:1 Multiplexer The MC100LVE164 is a 16:1 multiplexer with a differential output. The select inputs SEL0, 1, 2, 3 control which one of the sixteen data inputs (A0 – A15) is propragated to the output. The device is functionally equivalent to the MC100E164 except it operates from a 3.3 V supply. The


    Original     		PDF MC100LVE164 MC100LVE164 MC100E164 MC100LVE r14525 MC100LVE164/D tqfp 7x7 tray AND8020 MC100LVE164FA MC100LVE164FAR2

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		PDF 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9

    PD720114GA-9EU-A

    Abstract: PD720114 PD720114GA-YEU-A uPD720114GA-9EU-A S17463E 1002 SQUELCH
    Text: DATA SHEET MOS INTEGRATED CIRCUIT PD720114 ECOUSBTM Series USB 2.0 HUB CONTROLLER The μPD720114 is a USB 2.0 hub device that complies with the Universal Serial Bus USB Specification Revision 2.0 and works up to 480 Mbps. USB 2.0 compliant transceivers are integrated for upstream and all downstream ports.


    Original     		PDF PD720114 PD720114 S17463E PD720114GA-9EU-A PD720114GA-YEU-A uPD720114GA-9EU-A S17463E 1002 SQUELCH

    MIL-I-8835A

    Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
    Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from


    Original     		PDF

    tqfp 7x7 tray

    Abstract: DAEWON tray drawing DAEWON JEDEC TRAY tray drawing tqfp 7x7 daewon 7x7 DAEWON JEDEC TRAY 10 X 10 TQFP Shipping Trays shipping tray daewon 7x7 1.0T JEDEC TRAY 10 X 10
    Text: 12_ I_ y _ I_ 10_ I_9_ I_ 8_ I_7_ I_ 6_ I_ 5_ I_4_ I_ 3_ I_2_ I_1


    OCR Scan     		PDF A40553. A40626. tqfp 7x7 tray DAEWON tray drawing DAEWON JEDEC TRAY tray drawing tqfp 7x7 daewon 7x7 DAEWON JEDEC TRAY 10 X 10 TQFP Shipping Trays shipping tray daewon 7x7 1.0T JEDEC TRAY 10 X 10