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    TQFP100 PACKAGE Search Results

    TQFP100 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    TQFP100 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    9536XL

    Abstract: 9572XL xc9572xl vqfp64 XC9500XL XC9500XL csp48 xc95144xl tq144 b12108 95144XL
    Text: XILINX PROGRAMMER QUALIFICATION SPECIFICATION XC9500XL FAMILY 1. Introduction This document pertains to the following devices and packages: 9536XL - PLCC44, CSP48, and VQFP64 9572XL - PLCC44, CSP48, VQFP64, and TQFP100 95144XL - TQFP100, TQFP144, and CSP144


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    PDF XC9500XL 9536XL PLCC44, CSP48, VQFP64 9572XL VQFP64, TQFP100 xc9572xl vqfp64 XC9500XL csp48 xc95144xl tq144 b12108 95144XL

    ADSTB xilinx

    Abstract: Add.dat XILINX/TSOP 137
    Text: XILINX PROGRAMMER QUALIFICATION SPECIFICATION XC9500XL FAMILY 1. Introduction This document pertains to the following devices and packages: 9536XL - PLCC44, CSP48, and VQFP64 9572XL - PLCC44, CSP48, VQFP64, and TQFP100 95144XL - TQFP100, TQFP144, and CSP144


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    PDF XC9500XL 9536XL PLCC44, CSP48, VQFP64 9572XL VQFP64, TQFP100 ADSTB xilinx Add.dat XILINX/TSOP 137

    tQFP100 package

    Abstract: Atmel STK600 schematic STK600 SC03 New products 1
    Text: Products: 0 Home / Starter kits Subtotal: $0 Shopping List Search / Atmel STK600 -TQFP100 Starter kits Home Store Search Starter kits Select Device Select Category Enter Keywords: Debuggers Starter kits Programmers Atmel STK600 -TQFP100 ATSTK600 -SC03 Touch kits


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    PDF STK600 -TQFP100 ATSTK600 -SC03) -SC03 TQFP100 14x14 tQFP100 package Atmel STK600 schematic SC03 New products 1

    TQFP100

    Abstract: TQFP-100
    Text: Philips Semiconductors Package outlines TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm 1997 Aug 04 639 SOT386-1


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    PDF TQFP100: OT386-1 TQFP100 TQFP-100

    Untitled

    Abstract: No abstract text available
    Text: TQFP100-P-1414-0.50-K 0.125t Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.55 TYP. 1/Mar. 30, 2000


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    PDF TQFP100-P-1414-0

    TQFP100-P-1414-0

    Abstract: TQFP100-P
    Text: TQFP100-P-1414-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.55 TYP. 4/Oct. 28, 1996


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    PDF TQFP100-P-1414-0 TQFP100-P

    P-TQFP100-12x12-0

    Abstract: TQFP100 100GV
    Text: JEITA Package Code P-TQFP100-12x12-0.40 RENESAS Code PTQP0100LC-A Previous Code TFP-100G/TFP-100GV MASS[Typ.] 0.4g HD *1 NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. D 75 51 76 50 HE b1 26 Terminal cross section


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    PDF P-TQFP100-12x12-0 PTQP0100LC-A TFP-100G/TFP-100GV TQFP100 100GV

    Untitled

    Abstract: No abstract text available
    Text: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C 32 K 48 K 1.5 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E *Pb free (under planning) Minimum Instruction Execution Time


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    PDF MN101C56A MN101C56C MN101C56C TQFP100-P-1414E KEY10 PX-ICE101C PX-PRB101C56-TQFP100-P-1414E MN101CP56C

    MN101C56A

    Abstract: MN101C56C
    Text: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C (under development) 32 K 48 K 1.79 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E Minimum Instruction Execution Time


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    PDF MN101C56A MN101C56C TQFP100-P-1414E PX-ICE101C PX-PRB101C56-C MN101CP56C MN101C56A MN101C56C

    TQFP100

    Abstract: tQFP100 package TQFP100-P-1414-0
    Text: TQFP100-P-1414-0.50-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


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    PDF TQFP100-P-1414-0 TQFP100 tQFP100 package

    tQFP pitch

    Abstract: TQFP100
    Text: THIN QUAD FLAT L-LEADED PACKAGE 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14x14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09 100-pin plastic TQFP (FPT-100P-M09)


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    PDF FPT-100P-M09 TQFP100-P-1414-1 100-pin FPT-100P-M09) F100011S-1C-2 tQFP pitch TQFP100

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TQFP100 package SOT386-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land


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    PDF TQFP100 OT386-1 OT386-1

    MN101C56A

    Abstract: MN101C56C
    Text: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C 32 K 48 K 1.5 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E *Pb free Minimum Instruction Execution Time 0.1 µs (at 4.5 V to 5.5 V, 20 MHz)


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    PDF MN101C56A MN101C56C TQFP100-P-1414E MN101C56A MN101C56C

    PTQP0100KA-A

    Abstract: TQFP100
    Text: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KA-A Previous Code TFP-100B/TFP-100BV MASS[Typ.] 0.5g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 75 51 76 50 bp c c1 HE Reference


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    PDF P-TQFP100-14x14-0 PTQP0100KA-A TFP-100B/TFP-100BV PTQP0100KA-A TQFP100

    Untitled

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape


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    PDF FPT-100P-M09 TQFP100-P-1414-1 100-pin FPT-100P-M09) F100011S-1C-2

    Untitled

    Abstract: No abstract text available
    Text: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C 32 K 48 K 1.5 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E *Pb free (under planning) Minimum Instruction Execution Time


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    PDF MN101C56A MN101C56C MN101C56C TQFP100-P-1414E

    TQFP100

    Abstract: No abstract text available
    Text: JEITA Package Code P-TQFP100-12x12-0.40 RENESAS Code PTQP0100LB-A Previous Code 100PFB-A MASS[Typ.] 0.4g HD *1 D 75 51 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. *2 HE 50 E 76 26 1 25 ZD Reference


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    PDF P-TQFP100-12x12-0 PTQP0100LB-A 100PFB-A TQFP100

    TQFP100

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09


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    PDF FPT-100P-M09 TQFP100-P-1414-1 100-pin FPT-100P-M09) F100011S-1C-2 TQFP100

    TQFP100

    Abstract: No abstract text available
    Text: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KB-D Previous Code TFP-100JV MASS[Typ.] 0.5g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 75 51 76 50 HE c Reference Symbol *2 E


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    PDF P-TQFP100-14x14-0 PTQP0100KB-D TFP-100JV 4x14-0 TQFP100

    Untitled

    Abstract: No abstract text available
    Text: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KA-A Previous Code TFP-100B/TFP-100BV MASS[Typ.] 0.5g HD *1 D 75 51 76 NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 50 bp c c1 HE *2 E b1


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    PDF P-TQFP100-14x14-0 PTQP0100KA-A TFP-100B/TFP-100BV 00QFP100-14x14-0

    TQFP100-P-1212-0

    Abstract: 100PFB-A
    Text: 100PFB-A Plastic 100pin 12✕12mm body TQFP EIAJ Package Code TQFP100-P-1212-0.40 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD Under Development 76 b2 100 ME D 1 75 l2 25 HE E Recommended Mount Pad Symbol 51 26 50 A L1 e b y A1 c A2 F L Detail F


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    PDF 100PFB-A 100pin TQFP100-P-1212-0 100PFB-A

    TQFP100

    Abstract: No abstract text available
    Text: 100P6V-A Plastic 100pin 12✕12mm body TQFP EIAJ Package Code TQFP100-P-1212-0.40 Weight g JEDEC Code – Lead Material Alloy 42 HD D 100 76 1 HE E 75 Symbol 25 51 26 50 A L1 F y A1 b c A2 e L Detail F A A1 A2 b c D E e HD HE L L1 y Dimension in Millimeters


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    PDF 100P6V-A 100pin TQFP100-P-1212-0 TQFP100

    MS-026

    Abstract: 137e20 TQFP100 MS-026 tqfp100
    Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD v M B


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    PDF TQFP100: OT386-1 137E20 MS-026 MS-026 137e20 TQFP100 MS-026 tqfp100

    Untitled

    Abstract: No abstract text available
    Text: 100PFD-B Plastic 100pin 14 ✕20mm body TQFP Weight g JEDEC Code – Lead Material Cu Alloy MD e EIAJ Package Code TQFP100-P-1420-0.65 HD 100 ME D 1 b2 76 75 l2 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 51 25 26 A 50 L1 F b y A1 c A2


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    PDF 100PFD-B 100pin TQFP100-P-1420-0