9536XL
Abstract: 9572XL xc9572xl vqfp64 XC9500XL XC9500XL csp48 xc95144xl tq144 b12108 95144XL
Text: XILINX PROGRAMMER QUALIFICATION SPECIFICATION XC9500XL FAMILY 1. Introduction This document pertains to the following devices and packages: 9536XL - PLCC44, CSP48, and VQFP64 9572XL - PLCC44, CSP48, VQFP64, and TQFP100 95144XL - TQFP100, TQFP144, and CSP144
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XC9500XL
9536XL
PLCC44,
CSP48,
VQFP64
9572XL
VQFP64,
TQFP100
xc9572xl vqfp64
XC9500XL csp48
xc95144xl tq144
b12108
95144XL
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ADSTB xilinx
Abstract: Add.dat XILINX/TSOP 137
Text: XILINX PROGRAMMER QUALIFICATION SPECIFICATION XC9500XL FAMILY 1. Introduction This document pertains to the following devices and packages: 9536XL - PLCC44, CSP48, and VQFP64 9572XL - PLCC44, CSP48, VQFP64, and TQFP100 95144XL - TQFP100, TQFP144, and CSP144
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XC9500XL
9536XL
PLCC44,
CSP48,
VQFP64
9572XL
VQFP64,
TQFP100
ADSTB xilinx
Add.dat
XILINX/TSOP 137
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tQFP100 package
Abstract: Atmel STK600 schematic STK600 SC03 New products 1
Text: Products: 0 Home / Starter kits Subtotal: $0 Shopping List Search / Atmel STK600 -TQFP100 Starter kits Home Store Search Starter kits Select Device Select Category Enter Keywords: Debuggers Starter kits Programmers Atmel STK600 -TQFP100 ATSTK600 -SC03 Touch kits
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STK600
-TQFP100
ATSTK600
-SC03)
-SC03
TQFP100
14x14
tQFP100 package
Atmel STK600 schematic
SC03 New products 1
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TQFP100
Abstract: TQFP-100
Text: Philips Semiconductors Package outlines TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm 1997 Aug 04 639 SOT386-1
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TQFP100:
OT386-1
TQFP100
TQFP-100
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Untitled
Abstract: No abstract text available
Text: TQFP100-P-1414-0.50-K 0.125t Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.55 TYP. 1/Mar. 30, 2000
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TQFP100-P-1414-0
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TQFP100-P-1414-0
Abstract: TQFP100-P
Text: TQFP100-P-1414-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.55 TYP. 4/Oct. 28, 1996
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TQFP100-P-1414-0
TQFP100-P
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P-TQFP100-12x12-0
Abstract: TQFP100 100GV
Text: JEITA Package Code P-TQFP100-12x12-0.40 RENESAS Code PTQP0100LC-A Previous Code TFP-100G/TFP-100GV MASS[Typ.] 0.4g HD *1 NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. D 75 51 76 50 HE b1 26 Terminal cross section
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P-TQFP100-12x12-0
PTQP0100LC-A
TFP-100G/TFP-100GV
TQFP100
100GV
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Untitled
Abstract: No abstract text available
Text: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C 32 K 48 K 1.5 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E *Pb free (under planning) Minimum Instruction Execution Time
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MN101C56A
MN101C56C
MN101C56C
TQFP100-P-1414E
KEY10
PX-ICE101C
PX-PRB101C56-TQFP100-P-1414E
MN101CP56C
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MN101C56A
Abstract: MN101C56C
Text: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C (under development) 32 K 48 K 1.79 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E Minimum Instruction Execution Time
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MN101C56A
MN101C56C
TQFP100-P-1414E
PX-ICE101C
PX-PRB101C56-C
MN101CP56C
MN101C56A
MN101C56C
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TQFP100
Abstract: tQFP100 package TQFP100-P-1414-0
Text: TQFP100-P-1414-0.50-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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TQFP100-P-1414-0
TQFP100
tQFP100 package
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tQFP pitch
Abstract: TQFP100
Text: THIN QUAD FLAT L-LEADED PACKAGE 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14x14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09 100-pin plastic TQFP (FPT-100P-M09)
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FPT-100P-M09
TQFP100-P-1414-1
100-pin
FPT-100P-M09)
F100011S-1C-2
tQFP pitch
TQFP100
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TQFP100 package SOT386-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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TQFP100
OT386-1
OT386-1
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MN101C56A
Abstract: MN101C56C
Text: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C 32 K 48 K 1.5 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E *Pb free Minimum Instruction Execution Time 0.1 µs (at 4.5 V to 5.5 V, 20 MHz)
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MN101C56A
MN101C56C
TQFP100-P-1414E
MN101C56A
MN101C56C
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PTQP0100KA-A
Abstract: TQFP100
Text: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KA-A Previous Code TFP-100B/TFP-100BV MASS[Typ.] 0.5g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 75 51 76 50 bp c c1 HE Reference
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P-TQFP100-14x14-0
PTQP0100KA-A
TFP-100B/TFP-100BV
PTQP0100KA-A
TQFP100
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Untitled
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape
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FPT-100P-M09
TQFP100-P-1414-1
100-pin
FPT-100P-M09)
F100011S-1C-2
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Untitled
Abstract: No abstract text available
Text: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C 32 K 48 K 1.5 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E *Pb free (under planning) Minimum Instruction Execution Time
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MN101C56A
MN101C56C
MN101C56C
TQFP100-P-1414E
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TQFP100
Abstract: No abstract text available
Text: JEITA Package Code P-TQFP100-12x12-0.40 RENESAS Code PTQP0100LB-A Previous Code 100PFB-A MASS[Typ.] 0.4g HD *1 D 75 51 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. *2 HE 50 E 76 26 1 25 ZD Reference
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P-TQFP100-12x12-0
PTQP0100LB-A
100PFB-A
TQFP100
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TQFP100
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09
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FPT-100P-M09
TQFP100-P-1414-1
100-pin
FPT-100P-M09)
F100011S-1C-2
TQFP100
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TQFP100
Abstract: No abstract text available
Text: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KB-D Previous Code TFP-100JV MASS[Typ.] 0.5g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 75 51 76 50 HE c Reference Symbol *2 E
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P-TQFP100-14x14-0
PTQP0100KB-D
TFP-100JV
4x14-0
TQFP100
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Untitled
Abstract: No abstract text available
Text: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KA-A Previous Code TFP-100B/TFP-100BV MASS[Typ.] 0.5g HD *1 D 75 51 76 NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 50 bp c c1 HE *2 E b1
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P-TQFP100-14x14-0
PTQP0100KA-A
TFP-100B/TFP-100BV
00QFP100-14x14-0
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TQFP100-P-1212-0
Abstract: 100PFB-A
Text: 100PFB-A Plastic 100pin 12✕12mm body TQFP EIAJ Package Code TQFP100-P-1212-0.40 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD Under Development 76 b2 100 ME D 1 75 l2 25 HE E Recommended Mount Pad Symbol 51 26 50 A L1 e b y A1 c A2 F L Detail F
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100PFB-A
100pin
TQFP100-P-1212-0
100PFB-A
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TQFP100
Abstract: No abstract text available
Text: 100P6V-A Plastic 100pin 12✕12mm body TQFP EIAJ Package Code TQFP100-P-1212-0.40 Weight g JEDEC Code – Lead Material Alloy 42 HD D 100 76 1 HE E 75 Symbol 25 51 26 50 A L1 F y A1 b c A2 e L Detail F A A1 A2 b c D E e HD HE L L1 y Dimension in Millimeters
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100P6V-A
100pin
TQFP100-P-1212-0
TQFP100
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MS-026
Abstract: 137e20 TQFP100 MS-026 tqfp100
Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD v M B
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TQFP100:
OT386-1
137E20
MS-026
MS-026
137e20
TQFP100
MS-026 tqfp100
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Untitled
Abstract: No abstract text available
Text: 100PFD-B Plastic 100pin 14 ✕20mm body TQFP Weight g JEDEC Code – Lead Material Cu Alloy MD e EIAJ Package Code TQFP100-P-1420-0.65 HD 100 ME D 1 b2 76 75 l2 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 51 25 26 A 50 L1 F b y A1 c A2
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100PFD-B
100pin
TQFP100-P-1420-0
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