Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    TRAY 23X23 Search Results

    TRAY 23X23 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    DF38122WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation

    TRAY 23X23 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9 PDF

    nec 575

    Abstract: 484-pin BGA NEC C 324 C jedec tray BGA 324-PIN tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER
    Text: TRAY CONTAINER UNIT : mm 5x12=60 PPE 135°C MAX. 16.95 25.50 23.25 BGA23×23ESP NEC 102.0 A' 25.50 135.9 A 23.25 17.25 280.5 315.0 322.6 Section A – A' 23.25 (6.07) (6.35) 7.62 23.00 Applied Package Quantity (pcs) 324-pin Plastic BGA (23×23) 352-pin Plastic BGA (23×23)


    Original     		BGA23 23ESP 324-pin 352-pin 484-pin 575-pin SSD-A-H7317-4 nec 575 484-pin BGA NEC C 324 C jedec tray BGA tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER PDF

    PEAK TRAY bga

    Abstract: No abstract text available
    Text: Search by Part Number Search Site by k eyword Contact IDT | Investors | Press Calculators | Cross Reference | Green Initiative | Military | Parametric Search | Search by Part Number, Keyw ord, Document, Green/Pb-Free, Package Home > Products > PCI Express Switches > System Interconnect Switches > 89HPES22H16 > 89HPES22H16ZABC8


    Original     		89HPES22H16 89HPES22H16ZABC8 89HPES22H16 22-LANE BC484) 23X23MM 168hrs 30C/60 48hrs PEAK TRAY bga PDF

    BC484

    Abstract: No abstract text available
    Text: Search by Part Number Search Site by k eyword Contact IDT | Investors | Press Calculators | Cross Reference | Green Initiative | Military | Parametric Search | Search by Part Number, Keyw ord, Document, Green/Pb-Free, Package Home > Products > PCI Express Switches > System Interconnect Switches > 89HPES22H16 > 89HPES22H16ZABC


    Original     		89HPES22H16 89HPES22H16ZABC 89HPES22H16 22-LANE BC484) 23X23MM 168hrs 30C/60 48hrs BC484 PDF

    Untitled

    Abstract: No abstract text available
    Text: Search by Part Number Search Site by k eyword Contact IDT | Investors | Press Calculators | Cross Reference | Green Initiative | Military | Parametric Search | Search by Part Number, Keyw ord, Document, Green/Pb-Free, Package Home > Products > PCI Express Switches > System Interconnect Switches > 89HPES22H16 > 89HPES22H16ZABCI8


    Original     		89HPES22H16 89HPES22H16ZABCI8 89HPES22H16 22-LANE BC484) 23X23MM 168hrs 30C/60 48hrs PDF

    AN571

    Abstract: No abstract text available
    Text: Search by Part Number Search Site by k eyword Contact IDT | Investors | Press Calculators | Cross Reference | Green Initiative | Military | Parametric Search | Search by Part Number, Keyw ord, Document, Green/Pb-Free, Package Home > Products > PCI Express Switches > System Interconnect Switches > 89HPES22H16 > 89HPES22H16ZABCI


    Original     		89HPES22H16 89HPES22H16ZABCI 89HPES22H16 22-LANE BC484) 23X23MM 168hrs 30C/60 48hrs AN571 PDF

    208z

    Abstract: SSZA002 Texas Instruments Philippines PBGA 23X23 0.8 pitch tray 23X23 376ZDW high current pogo pin shape 23x23 tray 27X27
    Text: Application Report SSZA002 – August 2009 Plastic Ball Grid Array PBGA . SSZA002 – August 2009 Submit Documentation Feedback


    Original     		SSZA002 208z SSZA002 Texas Instruments Philippines PBGA 23X23 0.8 pitch tray 23X23 376ZDW high current pogo pin shape 23x23 tray 27X27 PDF

    JESD51-9

    Abstract: VFBGA package tray AN 7823 JESD51-2 vFBGA* 96 bALL WFBGA lfbga Encapsulation thermal resistance TRAY 15X15 tfBGA PACKAGE thermal resistance tray vfbga
    Text: FBGA Fine Pitch Ball Grid Array • Array molded, cost effective, space saving package solution • Available in 1.40mm LFBGA , 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness • Laminate substrate based package which enables 2 and 4 layers of


    Original     		PDF

    VFBGA 120

    Abstract: VFBGA package tray tray 23X23 10x14 239.2 AN 7823 chippac tray 8X14 vFBGA* 96 bALL
    Text: FBGA-SD Fine Pitch Ball Grid Array - Stacked Die • FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing flexibility • FBGA-T-SD: Single metal layer tape based substrate with dense routing & good electrical performance • Available in 1.4mm LFBGA-SD , 1.2mm (TFBGASD/TFBGA-T-SD), 1.0mm (VFBGA-SD/VFBGA-TSD) & 0.80mm (WFBGA-SD) maximum package


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: SPEAR-09-H020 SPEAr Head ARM 926, 200K customizable eASIC™ gates, large IP portfolio SoC DATA BRIEF Features • ARM926EJ-S - fMAX 266 MHz, 32 KI - 16 KD cache, 8 KI - KD tcm, ETM9 and JTAG interfaces ■ 200K customizable equivalent ASIC gates with 8 channels internal DMA high speed


    Original     		SPEAR-09-H020 ARM926EJ-S PBGA420 PDF

    Untitled

    Abstract: No abstract text available
    Text: SPEAR-09-H022 SPEAr Head ARM 926, 200K customizable eASIC™ gates, large IP portfolio SoC DATA BRIEF Features • ARM926EJ-S - fMAX 266 MHz, 32 KI - 16 KD cache, 8 KI - KD tcm, ETM9 and JTAG interfaces ■ 200K customizable equivalent ASIC gates 16K LUT equivalent with 8 channels internal


    Original     		SPEAR-09-H022 ARM926EJ-S PBGA420 PDF

    ph6n

    Abstract: transistor PH6n SPEAR-09-P022 TA 8268 analog ta 8268 transistor ph0n p022 UART TTL buffer ARM926EJ-S electrical characteristic PH5N
    Text: SPEAR-09-P022 SPEAr Plus600 dual processor cores Preliminary Data Features • Dual ARM926EJ-S core @333MHz. ■ 600KByte reconfigurable logic array with 88 dedicated General purposes I/Os, 9 LVDS channels and 128KByte configurable internal memory pool.


    Original     		SPEAR-09-P022 Plus600 ARM926EJ-S 333MHz. 600KByte 128KByte 166MHz 32KByte 8/16bit 200MHz) ph6n transistor PH6n SPEAR-09-P022 TA 8268 analog ta 8268 transistor ph0n p022 UART TTL buffer ARM926EJ-S electrical characteristic PH5N PDF

    H122

    Abstract: ph6n PH5N ph8n transistor PH6n ph7n ph4n ARMv5TEJ 0xE12 E31821
    Text: SPEAR-09-H122 SPEAr Head600 Preliminary Data Features • ARM926EJ-S core @333MHz. ■ 600KByte reconfigurable logic array with 88 dedicated General purposes I/Os, 9 LVDS channels and 128KByte configurable internal memory pool. ■ Multilayer AMBA 2.0 compliant Bus with fMAX


    Original     		SPEAR-09-H122 Head600 ARM926EJ-S 333MHz. 600KByte 128KByte 166MHz 32KByte 8/16bit 200MHz) H122 ph6n PH5N ph8n transistor PH6n ph7n ph4n ARMv5TEJ 0xE12 E31821 PDF

    PH6n

    Abstract: ph5n ph8n
    Text: SPEAR-09-P022 SPEAr Plus600 dual processor cores Preliminary Data Features • Dual ARM926EJ-S core @333MHz. ■ 600KByte reconfigurable logic array with 88 dedicated General purposes I/Os, 9 LVDS channels and 128KByte configurable internal memory pool.


    Original     		SPEAR-09-P022 Plus600 ARM926EJ-S 333MHz. 600KByte 128KByte 166MHz 32KByte 8/16bit 200MHz) PH6n ph5n ph8n PDF

    ph4n

    Abstract: PH5N ph6n transistor PH6n DDR2-333 H122 ph8n transistor PH7n tms1040 V/transistor ph4n
    Text: SPEAR-09-H122 SPEAr Head600 Preliminary Data Features • ARM926EJ-S core @333 MHz ■ 600 Kbyte reconfigurable logic array with 88 dedicated general purposes I/Os, 9 LVDS channels and 128 Kbyte configurable internal memory pool ■ Multilayer AMBA 2.0 compliant bus with fMAX


    Original     		SPEAR-09-H122 Head600 ARM926EJ-S 8/16-bit ph4n PH5N ph6n transistor PH6n DDR2-333 H122 ph8n transistor PH7n tms1040 V/transistor ph4n PDF

    transistor PH6n

    Abstract: PH6N SPEAR-09-P022 ph5n ph4n ph8n Plus600 TA 8268 analog ARM926EJS ARM926EJ-S
    Text: SPEAR-09-P022 SPEAr Plus600 dual processor cores Preliminary Data Features • Dual ARM926EJ-S core @333 MHz ■ 600 Kbyte reconfigurable logic array with 88 dedicated general purposes I/Os, 9 LVDS channels and 128 Kbyte configurable internal memory pool


    Original     		SPEAR-09-P022 Plus600 ARM926EJ-S 8/16-bit transistor PH6n PH6N SPEAR-09-P022 ph5n ph4n ph8n TA 8268 analog ARM926EJS PDF

    PXA270 jtag flash programming

    Abstract: PXA270 BGA 23X23 blackberry LCD h3 0925 pxa270c motorola MCX 90 radio Intel pxa270 63 ball Vfbga thermal resistance MCX 90 motorola
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PXA270 PXA270 jtag flash programming BGA 23X23 blackberry LCD h3 0925 pxa270c motorola MCX 90 radio Intel pxa270 63 ball Vfbga thermal resistance MCX 90 motorola PDF

    pxa270

    Abstract: PXA270 instruction set BGA 23X23 fnd display h3 0925 motorola MCX 90 radio MCX 90 motorola xscale PXA270 PXA27x core developers guide PXA27x Processor Family
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet n n n n n n n n n n High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PXA270 PXA270 instruction set BGA 23X23 fnd display h3 0925 motorola MCX 90 radio MCX 90 motorola xscale PXA270 PXA27x core developers guide PXA27x Processor Family PDF

    Untitled

    Abstract: No abstract text available
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PXA270 PDF

    pxa270c

    Abstract: tray bga 23x23 blackberry LCD PXA270C0C416 PXA270 jtag flash programming 63 ball Vfbga thermal resistance rtpxa270c0c520 356-ball Universal Subscriber Identity Module pxa25
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PXA270 RCPXA270C0C312 RCPXA270C0C416 RCPXA270C0C520 RCPXA270C0C624 RTPXA270C0C312 RTPXA270C0C416 RTPXA270C0C520 RTPXA270C0C624 13x13x1 pxa270c tray bga 23x23 blackberry LCD PXA270C0C416 PXA270 jtag flash programming 63 ball Vfbga thermal resistance 356-ball Universal Subscriber Identity Module pxa25 PDF

    MS 7541 MOTHERBOARD SERVICE MANUAL

    Abstract: 3x4 keypad Encoder IC data circuit schematics satellite connector on line ups circuit schematic diagram working and block diagram of ups blackberry LCD schematic diagram inverter lcd monitor television internal parts block diagram schematic diagram lcd monitor advance 17 PXA27x core developers guide
    Text: Intel PXA27x Processor Family Design Guide May 2005 Order No. 280001-002 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S


    Original     		PXA27x MS 7541 MOTHERBOARD SERVICE MANUAL 3x4 keypad Encoder IC data circuit schematics satellite connector on line ups circuit schematic diagram working and block diagram of ups blackberry LCD schematic diagram inverter lcd monitor television internal parts block diagram schematic diagram lcd monitor advance 17 PXA27x core developers guide PDF

    Untitled

    Abstract: No abstract text available
    Text: SPEAr1310 Dual-core Cortex A9 embedded MPU for communications Data brief Features • CPU subsystem: – 2x ARM Cortex A9 cores, up to 600 MHz – Supporting both symmetric SMP and asymmetric (AMP) multiprocessing – 32+32 KB L1 Instructions/Data cache per


    Original     		SPEAr1310 64-bit DDR2-800/DDR3-1066 16/32y PDF

    Untitled

    Abstract: No abstract text available
    Text: SPEAr1310 Dual-core Cortex A9 embedded MPU for communications Data brief Features • CPU subsystem: – 2x ARM Cortex A9 cores, up to 600 MHz – Supporting both symmetric SMP and asymmetric (AMP) multiprocessing – 32+32 KB L1 Instructions/Data cache per


    Original     		SPEAr1310 64-bit DDR2-800/DDR3-1066 16/32y PDF

    PH6N

    Abstract: ph4n PH5N h122 transistor PH7n ph8n E31821 transistor PH6n "ph4n" ARMv5TEJ
    Text: SPEAR-09-H122 SPEAr Head600 Preliminary Data Features • ARM926EJ-S core @333 MHz ■ 600 Kbyte reconfigurable logic array with 88 dedicated general purposes I/Os, 9 LVDS channels and 128 Kbyte configurable internal memory pool ■ Multilayer AMBA 2.0 compliant bus with fMAX


    Original     		SPEAR-09-H122 Head600 ARM926EJ-S 8/16-bit PH6N ph4n PH5N h122 transistor PH7n ph8n E31821 transistor PH6n "ph4n" ARMv5TEJ PDF