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    TRAY 8X14 Search Results

    TRAY 8X14 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    DF38122WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation

    TRAY 8X14 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    JEDEC TRAY DIMENSIONS ssop

    Abstract: H649 JEDEC TRAY DIMENSIONS JEDEC TRAY ssop SOP JEDEC tray JEDEC tray standard
    Text: TRAY CONTAINER UNIT : mm HEAT PROOF PPE 7 105.0 NEC 10.3 135°C MAX. 15.00 15.45 375mil48p SSOP A' 15.75 22.00 14.50 286.0 315.0 322.6 SECTION A – A' 5.27 (6.35) 15.75 7.62 135.9 8x14=112 A Applied Package Quantity (pcs) 48-pin • Plastic Shrink SOP (1.7 mm thick)


    Original     		375mil48p 48-pin 375mil48pSSOP SSD-A-H6495-1 JEDEC TRAY DIMENSIONS ssop H649 JEDEC TRAY DIMENSIONS JEDEC TRAY ssop SOP JEDEC tray JEDEC tray standard PDF

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9 PDF

    LGA 1155 Socket PIN diagram

    Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    IC Package Names and Code Designations

    Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
    Text: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages


    Original     		10-001A IC Package Names and Code Designations data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408 PDF

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo PDF

    daewon

    Abstract: TRAY MPPO DAEWON tray 48 33 x 33 DAEWON tray FBD63 tray 8X14 FBC 30 A DAEWON 64 8X14 12b-0809-f19
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: FBC 048, VBD 064 322.6 REF. 2.54 R. 4 PLACES 6.35* 315.0* VACUUM PICKUP CELLS 18 PLACES 16 CENTER CELLS, 2 SIDE CELLS SEE DETAIL "D" X Y CLOSED CELLS 8 PLACES 7.62 Z SEE DETAIL "E" X X 119.9 ±0.25 135.9* 92.1


    Original     		26048i 3412-2a 26396f FBD63 12F-0814-D19 3412-2b daewon TRAY MPPO DAEWON tray 48 33 x 33 DAEWON tray FBD63 tray 8X14 FBC 30 A DAEWON 64 8X14 12b-0809-f19 PDF

    JEDEC TRAY DIMENSIONS ssop

    Abstract: SOP JEDEC tray
    Text: UNIT : mm PPE 7 HEAT PROOF NEC 135°C MAX. 10.3 105.0 15.00 15.45 375mil48p SSOP A' 15.75 22.00 14.50 286.0 315.0 322.6 SECTION A – A' 5.27 (6.35) 15.75 7.62 135.9 8x14=112 A Applied Package Quantity (pcs) 48-pin • Plastic Shrink SOP (375mil)(1.7mm thick)


    Original     		375mil48p 48-pin 375mil) 375mil48pSSOP JEDEC TRAY DIMENSIONS ssop SOP JEDEC tray PDF

    JESD51-9

    Abstract: VFBGA package tray AN 7823 JESD51-2 vFBGA* 96 bALL WFBGA lfbga Encapsulation thermal resistance TRAY 15X15 tfBGA PACKAGE thermal resistance tray vfbga
    Text: FBGA Fine Pitch Ball Grid Array • Array molded, cost effective, space saving package solution • Available in 1.40mm LFBGA , 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness • Laminate substrate based package which enables 2 and 4 layers of


    Original     		PDF

    VFBGA 120

    Abstract: VFBGA package tray tray 23X23 10x14 239.2 AN 7823 chippac tray 8X14 vFBGA* 96 bALL
    Text: FBGA-SD Fine Pitch Ball Grid Array - Stacked Die • FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing flexibility • FBGA-T-SD: Single metal layer tape based substrate with dense routing & good electrical performance • Available in 1.4mm LFBGA-SD , 1.2mm (TFBGASD/TFBGA-T-SD), 1.0mm (VFBGA-SD/VFBGA-TSD) & 0.80mm (WFBGA-SD) maximum package


    Original     		PDF

    IS43LR32640

    Abstract: is61wv5128 Product Selector Guide is42s86400 IS46R16160B IS25LD010 IS25LD025 IS25LQ IS62WV5128DALL BGA 168
    Text: To our valued customers, At ISSI we design, develop and market high performance integrated circuits for the following key markets: i automotive, (ii) communications, (iii) digital consumer, and (iv) industrial/medical/military. These key markets all require high quality and reliability, extended temperature ranges, and long-term support. Our primary products are high speed and


    Original     		i1-44-42218428 IS43LR32640 is61wv5128 Product Selector Guide is42s86400 IS46R16160B IS25LD010 IS25LD025 IS25LQ IS62WV5128DALL BGA 168 PDF

    Catalog

    Abstract: 100352 IEC 158-1 VDE 0660
    Text: PRODUCT SELECTION GUIDE CUSTOM ROPE-LAY CABLESTOLL BRAIDING FLAT WIRE BRAIDING RANDS G BRAID-REINFORCED CAPILLARY TUBING G SINGLE-THICKNESS BRAIDS SCOPE BRAIDS AIDING BRAID-REINFORCED TUBING AIDS SINGLE-THICKNESS BRAIDS BRAID-REINFORCED TUBING BRAIDS REINFORCED CABLES AND STRANDS


    Original     		PDF

    JEDEC TRAY DIMENSIONS

    Abstract: TSOP 8x14 TSOP 48 package tray TSOP 32ld tray JEDEC TRAY 10 X 10 shipping tray jedec tray scale TSOP package tray
    Text: _L _L _L 001IHAL RELEASE. NOTE : 1. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY BAKED FOR 48 HOURS AT THE BAKE TEMPERATURE AS SPECIFIED. 2. TOTAL USABLE CELL COUNT IS 208. 3. TRAY VACUUM PICKUP METHOD REQUIRES A 28m m SQUARE MINIMUM WALLED PICKUP AREA , LOCATED AS CLOSE TO


    OCR Scan     		001IHAL 1X105 1X1012 JEDEC TRAY DIMENSIONS TSOP 8x14 TSOP 48 package tray TSOP 32ld tray JEDEC TRAY 10 X 10 shipping tray jedec tray scale TSOP package tray PDF

    thyristor TAG 8506

    Abstract: nais inverter vf 7f operation manual 922AA1Y-A4P optek A400 817 Sprague 513D sprague 926c Sprague 195P Rapa relay 12vdc triac tag 8948 Mascot 719
    Text: TABLE OF CONTENTS Catalog Number 11Q New For 1989! • Over 7,900 New Products • 13 New M anufacturers PRODUCT INDICES tiamp*,'fminei forskSockets ' Solder Equipment endTtfob ] vriHp\< lint Equipment, Panel Meters, Aejulpmant, i A P R E M IE R C o m p an y


    OCR Scan     		11PM104 thyristor TAG 8506 nais inverter vf 7f operation manual 922AA1Y-A4P optek A400 817 Sprague 513D sprague 926c Sprague 195P Rapa relay 12vdc triac tag 8948 Mascot 719 PDF

    EATON CM20A

    Abstract: A5 GNE mosfet Hall sensor 44e 402 2N8491 FTG 1087 S TRIAC BCR 10km FEB3T smd transistor marking 352a sharp EIA 577 sharp color tv schematic diagram MP-130 M mh-ce 10268
    Text: Table of Contents N E W A R K E L E C T R O N IC S “Where serving you begins even before you call” Newark Electronics is a UNIQUE broadline distributor of electronic components, dedicated to provid­ ing complete service, fast delivery and in-depth inventory. Our main


    OCR Scan     		PDF