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    TSOP 14L Search Results

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    am29ma16

    Abstract: AM29M16 AM29M16 PLD atmel 404 93c46 29f512 gal18v8 ATMEL 24C32A COP8622C atmel 93C46 AT27040
    Text: Ironwood Electronics Programming Adapters PR.1 Programming Adapters allow the programming of PROM, PLD, EPROM, EEPROM or PAL devices on programmers or ATE equipment with DIP sockets. We support PLCC, LCC, PGA, SOIC including TSOP , FP, BGA and QFP packages.


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    0555B

    Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
    Text: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7


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    44-Lead, 48-Lead, 64-Lead 100-Lead, 144-Lead, 24-Lead, 20-Lead, 0555B footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238 PDF

    EIA and EIAJ tape standards

    Abstract: EIA-481-3 EIA-481-1A Package Dimensions EIAJ SOIC 8 XICOR DATE CODE EIA and EIAJ standards EIA and EIAJ standards for marking mark code t4 diode 56mm carrier tape EIA-481-1A tsop
    Text: TAPE AND REEL REFERENCE GUIDE TABLE OF CONTENTS Section Page 1.0 Purpose 1 2.0 Scope 1 3.0 Requirements 2-3 Figure One: Embossed Carrier Dimensions for SOIC 8mm & 12mm tapes Embossed Tapes Only 4 Table One: Embossed Carrier Tape Dimensions for 8mm & 12mm tapes Embossed Tapes Only


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    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


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    32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint PDF

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


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    32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545 PDF

    atmel 0328

    Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
    Text: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


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    120C1 32-lead, 44-lead, 48-lead, 0555H 08/00/xM atmel 0328 jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB PDF

    q406 transistor

    Abstract: 8S2 EIAJ SOIC q406 footprint 8M1-A equivalent q406 TSOP 28 SPI memory Package flash 8S1 EIAJ SOIC q206 transistor 8cn3 AT45DB1282D
    Text: Serial DataFlash Density Mbits Part Number Page-Erase, Byte-Alterable Serial Flash Memory VCC Min (V) Interface Architecture Speed (MHz) SRAM Buffers OTP Sec. S/N Packages (Note 1) (Note 2) Availability Battery Voltage (2.7 to 3.6V) - Commercial/Industrial Temperature Grades


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    AT45DB011B AT45DB021B AT45DB041B AT45DB041D 24-ball, 28-lead, 40-lead, 14-lead, q406 transistor 8S2 EIAJ SOIC q406 footprint 8M1-A equivalent q406 TSOP 28 SPI memory Package flash 8S1 EIAJ SOIC q206 transistor 8cn3 AT45DB1282D PDF

    16MM TAPE PACKAGE

    Abstract: tape and reel part rotation
    Text: Packaging Information TAPE AND REEL Catalyst surface mount devices, which are normally shipped in antistatic plastic tubes, are also available mounted on embossed tape for customers using automatic placement systems. The tape is wound on 178mm 7 inch or 330mm (13 inch) reels and individually packaged for shipment.


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    178mm 330mm 100mm 250mm 1mm/100mm 16MM TAPE PACKAGE tape and reel part rotation PDF

    PICSTART 16b firmware

    Abstract: PIC16 example code i2c slave PIC16 example codes TECH C compiler interrupt PIC16 external interrupt PIC16 example codes TECH C compiler pwm PIC controller FUZZY LOGIC MICROCONTROLLER battery charging 16C621 PIC16C74 Free Projects i2c PIC16 example codes spi slave pic 16c57 28pin
    Text: Table of Contents PRODUCT SELECTION GUIDE INTRODUCTION The Embedded Control Solutions Company .1 PIC16/17 8-BIT MICROCONTROLLERS PIC16C5X Family: Base-Line Cost Effectiveness .9


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    PIC16/17 PIC16C5X PIC16CXX PIC16C6X PIC16C62X PIC16C7X DS00031J-page PICSTART 16b firmware PIC16 example code i2c slave PIC16 example codes TECH C compiler interrupt PIC16 external interrupt PIC16 example codes TECH C compiler pwm PIC controller FUZZY LOGIC MICROCONTROLLER battery charging 16C621 PIC16C74 Free Projects i2c PIC16 example codes spi slave pic 16c57 28pin PDF

    Untitled

    Abstract: No abstract text available
    Text: Package Diagram Thin Small Outline Packages 8-Lead Thin Shrunk Small Outline Package 4.40 MM Body Z8 51-85093 1 Package Diagram 14-Lead Thin Shrunk Small Outline Package (4.40-mm Body) Z14 51-85117 2 Package Diagram 16-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z16


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    14-Lead 40-mm 16-Lead 20-Lead 24-Lead 28-Lead 51-85071-F PDF

    54-LEAD

    Abstract: 173e
    Text: Package Diagram Thin Small Outline Packages 8-Lead Thin Shrunk Small Outline Package 4.40 MM Body Z8 51-85093 1 Package Diagram 14-Lead Thin Shrunk Small Outline Package (4.40-mm Body) Z14 51-85117 2 Package Diagram 16-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z16


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    14-Lead 40-mm 16-Lead 20-Lead 24-Lead 28-Lead 54-LEAD 173e PDF

    A12L

    Abstract: A13L A14L CY7C007 CY7C017 IDT7007
    Text: 51 CY7C007 CY7C017 PRELIMINARY 32K x 8/9 Dual-Port Static RAM • Fully asynchronous operation • Automatic power-down • Expandable data bus to 16/18 bits or more using Master/Slave chip select when using more than one device • On-chip arbitration logic


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    CY7C007 CY7C017 68-pin IDT7007 CY7C007) CY7C017) 35-micron A12L A13L A14L CY7C007 CY7C017 IDT7007 PDF

    Untitled

    Abstract: No abstract text available
    Text: CYDM256B16 CYDM128B16 CYDM064B16 1.8V 4K/8K/16K x 16 MoBL Dual-Port Static RAM Features • Full asynchronous operation • True dual-ported memory cells that allow simultaneous access of the same memory location • Automatic power-down • Pin select for Master or Slave


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    CYDM256B16 CYDM128B16 CYDM064B16 4K/8K/16K 4/8/16K 100-pin softwar423 CYDM128B08 CYDM064B08 PDF

    A14L

    Abstract: CY7C007 CY7C007-12AC CY7C017 IDT7007 CY7C007 idt7007
    Text: fax id: 5222 51 CY7C007 CY7C017 PRELIMINARY 32K x 8/9 Dual-Port Static RAM Features • Fully asynchronous operation • Automatic power-down • Expandable data bus to 16/18 bits or more using Master/Slave chip select when using more than one device • On-chip arbitration logic


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    CY7C007 CY7C017 80-pin 68-pin 7C007) IDT7007 CY7C007) A14L CY7C007 CY7C007-12AC CY7C017 IDT7007 CY7C007 idt7007 PDF

    Untitled

    Abstract: No abstract text available
    Text: AT27C516 Features • • Fast Read Access Time - 45 ns Low Power CMOS Operation 100 nA max. Standby 30 mA max. Active at 5 MHz JEDEC Standard Packages 44-Lead PLCC 40-Lead TSOP 10mm x 14mm 5 V ± 10% Power Supply High Reliability CMOS Technology 2000V ESD Protection


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    AT27C516 44-Lead 40-Lead AT27C516 AT27C516-55VI AT27C516-70JC AT27C516-70VC AT27C516-70JI AT27C516-70VI AT27C516-85JC PDF

    TSOP 14l

    Abstract: am29f016b-90 A20-A11
    Text: PRFUivllNAR AMD£1 A m 2 9 F 0 1 6 B 16 Megabit 2 M x 8-Bit CMOS 5.0 Volt-only, Uniform Sector Flash Memory DISTINCTIVE CHARACTERISTICS • 5.0 V ± 10%, single power supply operation — Minimizes system level power requirements ■ Manufactured on 0.35|im process technology


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    Am29F016 AM29F016B Am29F016B TSOP 14l am29f016b-90 A20-A11 PDF

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    Abstract: No abstract text available
    Text: $ 28C64A M ic r o c h ip 64K 8K x 8 CMOS EEPROM FEATURES BLOCK DIAGRAM • Fast Read Access Time—150 ns • CMOS Technology for Low Power Dissipation — 30 mA Active — 100nA Standby • Fast Byte Write Time—200 (is or 1 ms • Data Retention >10 years


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    28C64A 100nA 28-pin 28-Lead, 44-Lead, 10x10mm) bl03201 001DS11 DS00049E PDF

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    Abstract: No abstract text available
    Text: 27C64 M ic r o c h ip 64K 8K x 8 CMOS EPROM FEATURES DESCRIPTION • High speed performance —120 ns access time available • CMOS Technology for low power consumption —20 mA Active current — 100 nA Standby current • Factory programming available


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    27C64 27C64 28-Lead, 44-Lead, 10x10mm) bl03201 001DS11 DS00049E PDF

    mouse CMOS

    Abstract: No abstract text available
    Text: MTA41600 M ic r o c h ip UniMouse Mouse and Trackball Controller I.C. FEATURES DESCRIPTION • Selectable for most popular communication formats The MTA41600 is the heart of a simple, low-cost, univer­ sal mouse solution. By combining the four most popular


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    MTA41600 MTA41600 28-Lead, 44-Lead, 10x10mm) bl03201 001DS11 DS00049E mouse CMOS PDF

    Untitled

    Abstract: No abstract text available
    Text: $ M 27C512 ic r o c h ip 512K 64K x 8 CMOS EPROM FEATURES DESCRIPTION • High speed performance — 90 ns access time available • CMOS Technology for low power consumption — 35 mA Active current — 100 |iA Standby current • Factory programming available


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    27C512 28-pin 32-pin 28-Lead, 44-Lead, 10x10mm) DS00049E PDF

    AY0438/P001

    Abstract: No abstract text available
    Text: AY0438 M ic r o c h ip 32-Segment CMOS LCD Driver FEATURES PIN CONFIGURATION 40-LEAD DUAL INLINE • Drives up to 32 LCD segments of arbitrary configuration • CMOS process for: wide supply voltage range, lowpower operation, high-noise immunity, wide temperature range


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    AY0438 32-Segment 40-LEAD 28-Lead, 44-Lead, 10x10mm) bl03201 001DS11 DS00049E AY0438/P001 PDF

    Untitled

    Abstract: No abstract text available
    Text: PRFI ¡YliNARV AMDB A m 2 9 F 0 1 7 B 16 Megabit 2 M x 8-Bit CMOS 5.0 Volt-only, Uniform Sector Flash Memory DISTINCTIVE CHARACTERISTICS • Optimized for memory card applications — Backwards-compatible with the Am29F016C ■ 5.0 V ± 10%, single power supply operation


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    Am29F016C AM29F017B Am29F017B PDF

    Untitled

    Abstract: No abstract text available
    Text: M $ EPROMs ic r o c h ip EPROM Selection Guide CMOS EPROMs TEMP RANGE STANDBY CURRENT J,K,L,P,SO,TS C,l 2mA/100nA J,K,L.P,SO C,l 2mA/100nA +5V J,K,L,P,SO,TS,VS C,I,E 2mA/100jiA 90-200 +5V J,K,L,P,SO,TS,VS C,I,E 2mA/100|iA 70-150 +5V J,K,L,P,SO,TS,VS C,I,E


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    2mA/100nA 2mA/100jiA 2mA/100 2mA/30 1mA/100 2mA/100tiA 27C64 PDF

    Untitled

    Abstract: No abstract text available
    Text: PSTSIIgI EEPROMS M ic r o c h ip Parallel EEPROM Selection Guide CMOS Parallel EEPROMs Access Time ns Icc (Active/ Standby) 4K bits (512x8) 150/200/250 30mA/100nA 16K bits (2K X 8) 150/200/250 30 mAflOO nA Device Density/ Organization 28C04A 28C16A Byte


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    30mA/100nA A/100 A/100 28C04A 28C16A PDF