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    TSOP 32 THERMAL RESISTANCE Search Results

    TSOP 32 THERMAL RESISTANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    TSOP 32 THERMAL RESISTANCE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    QFP160-P-2828-0

    Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
    Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: NVGS3130N Product Preview Power MOSFET 20 V, 5.9 A, Single N−Channel, TSOP−6 Features • • • • • Leading Edge Trench Technology for Low On Resistance Low Gate Charge for Fast Switching Small Size 3 x 2.75 mm TSOP−6 Package AEC−Q101 Qualified and PPAP Capable


    Original     		PDF NVGS3130N NVGS3130N/D

    Untitled

    Abstract: No abstract text available
    Text: NTGS3130N, NVGS3130N Power MOSFET 20 V, 5.6 A Single N-Channel, TSOP-6 Features • • • • • Leading Edge Trench Technology for Low On Resistance Low Gate Charge for Fast Switching Small Size 3 x 2.75 mm TSOP−6 Package NV Prefix for Automotive and Other Applications Requiring Unique


    Original     		PDF NTGS3130N, NVGS3130N NTGS3130N/D

    TSOP 48 thermal resistance

    Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
    Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead


    Original     		PDF 12x20 TSOP 48 thermal resistance TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48

    Untitled

    Abstract: No abstract text available
    Text: CY62128DV30 1-Mb 128K x 8 Static RAM Features also has an automatic power-down feature that significantly reduces power consumption by 90% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected Chip


    Original     		PDF CY62128DV30 CY62128V 32-lead

    TSOP 32 thermal resistance

    Abstract: CY62128DV cy62128dv30ll-55ZXI SOIC-32L
    Text: CY62128DV30 1-Mb 128K x 8 Static RAM Features also has an automatic power-down feature that significantly reduces power consumption by 90% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected Chip


    Original     		PDF CY62128DV30 CY62128V 32-lead TSOP 32 thermal resistance CY62128DV cy62128dv30ll-55ZXI SOIC-32L

    land pattern for TSOP 2-44

    Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


    Original     		PDF

    TSOP-48 pcb LAYOUT

    Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


    Original     		PDF

    70241k

    Abstract: d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P
    Text: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Reliability Report 1997-1998 An ISO 9001 Company 1997 Integrated Silicon Solution, Inc. Integrated Silicon Solution, Inc. • 2231 Lawson Lane • Santa Clara, CA 95054


    Original     		PDF R-118 70241k d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P

    c9013

    Abstract: 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638
    Text: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Quality System Manual QUALITY Reliabilty Report 1997-1998 RELIABILITY Integrated Silicon Solution, Inc. An ISO 9001 Company 1997 Integrated Silicon Solution, Inc.


    Original     		PDF R-118 c9013 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638

    CY62128DV30LL-55ZI

    Abstract: CY62128DV30LL-70SXI CY62128DV30LL-70ZXI CY62128DV30 CY62128DV30L-55SI CY62128V CY62128DV30LL-70ZAXI
    Text: CY62128DV30 1-Mb 128K x 8 Static RAM Features also has an automatic power-down feature that significantly reduces power consumption by 90% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected Chip


    Original     		PDF CY62128DV30 CY62128V CY62128DV30LL-55ZI CY62128DV30LL-70SXI CY62128DV30LL-70ZXI CY62128DV30 CY62128DV30L-55SI CY62128V CY62128DV30LL-70ZAXI

    CY62128DV30

    Abstract: CY62128DV30L-55SI CY62128V TSOP 32 thermal resistance
    Text: CY62128DV30 1-Mb 128K x 8 Static RAM Features also has an automatic power-down feature that significantly reduces power consumption by 90% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected Chip


    Original     		PDF CY62128DV30 CY62128V CY62128DV30 CY62128DV30L-55SI CY62128V TSOP 32 thermal resistance

    PAL 007 pioneer

    Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


    Original     		PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    TSOP 48 thermal resistance

    Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
    Text: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate


    Original     		PDF MS-024 TSOP 48 thermal resistance TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024

    Untitled

    Abstract: No abstract text available
    Text: CY62128DV30 MoBL 1-Mb 128K x 8 Static RAM Features • • • • • • • • • an automatic power-down feature that significantly reduces power consumption by 90% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected Chip Enable 1


    Original     		PDF CY62128DV30 CY62128V 32-lead

    05300

    Abstract: CY62128BLL-55SXI A5 GNC CY62128BLL-55SXC TSOP 87 CY62128B CY62128BLL-55ZXI
    Text: CY62128B MoBL 128K x 8 Static RAM Functional Description[1] Features • Temperature Ranges The CY62128B is a high-performance CMOS static RAM organized as 131,072 words by 8 bits. Easy memory expansion is provided by an active LOW Chip Enable CE1 , an active HIGH Chip Enable (CE2), an active LOW Output


    Original     		PDF CY62128B CY62128B CY62128BLL-55ZC, CY62128BLL-55ZAC, CY62128BLL-55ZRC, CY62128BLL-70ZAC, CY62128BLL-70ZRI, CY62128BLL-70ZRC 05300 CY62128BLL-55SXI A5 GNC CY62128BLL-55SXC TSOP 87 CY62128BLL-55ZXI

    Untitled

    Abstract: No abstract text available
    Text: CY62128DV30 1-Mb 128K x 8 Static RAM Features also has an automatic power-down feature that significantly reduces power consumption by 90% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected Chip


    Original     		PDF CY62128DV30 CY62128V 32-lead 70-ns

    a5 gnc

    Abstract: CY62128BLL-55SXC CY62128B CY62128BLL-55SC cy62128bll-55zc cy62128bll
    Text: CY62128B MoBL 1-Mbit 128K x 8 Static RAM Functional Description[1] Features • Temperature Ranges — Commercial: 0°C to 70°C The CY62128B is a high-performance CMOS static RAM organized as 131,072 words by 8 bits. Easy memory expansion is provided by an active LOW Chip Enable (CE1),


    Original     		PDF CY62128B CY62128B CY62128BLL-55ZC, CY62128BLL-55ZAC, CY62128BLL-55ZRC, CY62128BLL-70ZAC, CY62128BLL-70ZRI, CY62128BLL-70ZRC a5 gnc CY62128BLL-55SXC CY62128BLL-55SC cy62128bll-55zc cy62128bll

    A5 GNC

    Abstract: CY62128B
    Text: CY62128B MoBL 1-Mbit 128K x 8 Static RAM Functional Description[1] Features • Temperature Ranges — Commercial: 0°C to 70°C The CY62128B is a high-performance CMOS static RAM organized as 131,072 words by 8 bits. Easy memory expansion is provided by an active LOW Chip Enable (CE1),


    Original     		PDF CY62128B CY62128B sta128K CY62128BLL-55ZC, CY62128BLL-55ZAC, CY62128BLL-55ZRC, CY62128BLL-70ZAC, CY62128BLL-70ZRI, CY62128BLL-70ZRC A5 GNC

    Untitled

    Abstract: No abstract text available
    Text: CY14B116L/CY14B116N/CY14B116S CY14E116L/CY14E116N/CY14E116S PRELIMINARY 16-Mbit 2048 K x 8/1024 K × 16/512 K × 32 nvSRAM Features • ■ 16-Mbit nonvolatile static random access memory (nvSRAM) ❐ 25-ns, 30-ns and 45-ns access times ❐ Internally organized as 2048 K × 8 (CY14X116L),


    Original     		PDF CY14B116L/CY14B116N/CY14B116S CY14E116L/CY14E116N/CY14E116S 16-Mbit 16-Mbit 25-ns, 30-ns 45-ns CY14X116L) CY14X116N) CY14X116S)

    Untitled

    Abstract: No abstract text available
    Text: CY14B116L/CY14B116N/CY14B116S CY14E116L/CY14E116N/CY14E116S PRELIMINARY 16-Mbit 2048 K x 8/1024 K × 16/512 K × 32 nvSRAM Features • 16-Mbit nonvolatile static random access memory (nvSRAM) ❐ 25-ns, 30-ns and 45-ns access times ❐ Internally organized as 2048 K × 8 (CY14X116L),


    Original     		PDF CY14B116L/CY14B116N/CY14B116S CY14E116L/CY14E116N/CY14E116S 16-Mbit 16-Mbit 25-ns, 30-ns 45-ns CY14X116L) CY14X116N) CY14X116S)

    Untitled

    Abstract: No abstract text available
    Text: CY14B116L/CY14B116N/CY14B116S CY14E116L/CY14E116N/CY14E116S PRELIMINARY 16-Mbit 2048 K x 8/1024 K × 16/512 K × 32 nvSRAM Features • 16-Mbit nonvolatile static random access memory (nvSRAM) ❐ 25-ns, 30-ns and 45-ns access times ❐ Internally organized as 2048 K × 8 (CY14X116L),


    Original     		PDF CY14B116L/CY14B116N/CY14B116S CY14E116L/CY14E116N/CY14E116S 16-Mbit 16-Mbit 25-ns, 30-ns 45-ns CY14X116L) CY14X116N) CY14X116S)

    Untitled

    Abstract: No abstract text available
    Text: RN ICPAK N uaant Specifications for TSOP Sockets MATERIALS Body: Liquid crystal polymer Plating: TT = 2.03 pm 80 pinch Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. Frame: Glass-filled PPS Contact: Copper alloy Holder: Copper alloy Flammability: UL 94V-0


    OCR Scan     		PDF 490m/s2 98m/s2 TSOP-4050XX-SMT-TT S13N30S TSOP-28XX-SMT-TT TSOP-32XX-SMT-TT TSOP-40XX-SMT-TT