U132B Search Results

U132B Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
U132B		National Semiconductor	132 Pin Ceramic Pin Grid Array		Original	PDF

U132B Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
U132B Abstract: No abstract text available Text: 132 Pin Ceramic Pin Grid Array NS Package Number U132B All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL	Original	PDF	U132B U132B
LM2671 Abstract: LMH6714 SD020EVK SD130EVK LME49600 TO263-7 3G-SDI serializer LM2674 lme49 LM34917A Text: ਿพʥᄤᅌ഼፼ଐ‫ۂ‬ ଐ‫ۂ‬㟱එ α ଱˫ ϻϷᅕΥઅɟ 6', ଐ‫ ۂ‬. 3-8 *ESV6', .3 6',ϻϷ໬ϻኂ . 4-6 6',яጫኂdࣂᘸన܎ኂʥ ཋ᜿ᚎ৽ኂ . 7-8	Original	PDF	LMH0344 LMH0346 LMH0356 LMH0302 LMH0340 LMH0341 LMH0044 LMH0046 LMH0056 LMH0002 LM2671 LMH6714 SD020EVK SD130EVK LME49600 TO263-7 3G-SDI serializer LM2674 lme49 LM34917A
LM285x Abstract: SD046EVK HD-SDI serializer 16 bit parallel 3G-SDI serializer SD020EVK SD130EVK N4903A LMH0046 LMH0302 LMH0341 Text: ਿพʥᄤᅌ഼፼ଐ‫ۂ‬ ଐ‫ۂ‬㟱එ α ଱տ ϻϷᅕΥઅɟ 6', ଐ‫ ۂ‬. 3-8 *ESV6', .3 ౣॶ‫ێ‬6',ϻϷ໬ϻኂ . 4-6 6',яጫኂdࣂᘸన܎ኂʥ ཋ᜿ᚎ৽ኂ . 7-8	Original	PDF	LMH0344 LMH0346 LMH0356 LMH0302 LMH0340 LMH0341 LLP-16) TSSOP-20) LLP-48) LMH0044 LM285x SD046EVK HD-SDI serializer 16 bit parallel 3G-SDI serializer SD020EVK SD130EVK N4903A LMH0046 LMH0302 LMH0341
transistor BC 458 Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and	Original	PDF	MS011795 transistor BC 458 transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
FCBGA-1299 Abstract: transistor c1394 Transistor C1390 U112D nvidia chip transistor C1740 CXD9872AK TRANSISTOR C1741 c1740 transistor C1399 transistor Text: 5 4 3 2 1 Schematics Page Index Title / Revision / Change Date D C B Page 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Rev. Title of Schematics Page Schematics Page Index Block Diagram Merom(HOST BUS) 1/3	Original	PDF	75ohm 120ohm C1400, C1399, C1401, C1402, C1403, C1404 PC214 MS90-1-01 FCBGA-1299 transistor c1394 Transistor C1390 U112D nvidia chip transistor C1740 CXD9872AK TRANSISTOR C1741 c1740 transistor C1399 transistor
iso 1043-1 Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container	Original	PDF	MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
CERAMIC PIN GRID ARRAY 120 pins Abstract: 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A Text: Ceramic Pin Grid Array CPGA 44 Pin Ceramic Pin Grid Array, Cavity Up NS Package Number U44A 2000 National Semiconductor Corporation MS101111 www.national.com Ceramic Pin Grid Array (CPGA) August 1999 Ceramic Pin Grid Array (CPGA) 65 Pin Ceramic Pin Grid Array	Original	PDF	MS101111 UA65A CERAMIC PIN GRID ARRAY 120 pins 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A
iso 1043-1 Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container	Original	PDF	MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
transistor BC 458 Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and	Original	PDF
b0806 Abstract: 1470 LM B0803 mops 686 tip 127 texas instruments SMJ320C30 SMJ320C31 SMQ320C32 D2399 Text: SMQ320C32 DIGITAL SIGNAL PROCESSOR S P R S 04 4- MAY 1996 Military Operating Temperature Range - 55°C to 125°C; QML Processing Eight Extended-Precisión Registers Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units ARAUs	OCR Scan	PDF	SMQ320C32 SPRS044- SMQ320C32-50 40-ns 32-Bit 16-/32-Bit 32-/40-Bit 24-Bit b0806 1470 LM B0803 mops 686 tip 127 texas instruments SMJ320C30 SMJ320C31 SMQ320C32 D2399