ULTRASONIC bath CLEANER CIRCUIT
Abstract: induction furnace circuit
Text: Tantalum Solid Electrolytic Capacitor Application Guidelines 1.2 Reverse voltage 1. Circuit Design About 90 % or more of failures of the tantalum solid electrolytic capacitor is short circuit and increase of leakage current. Design the circuits by taking redundancy into consideration to prepare for short
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RCR-2368
EE214
ULTRASONIC bath CLEANER CIRCUIT
induction furnace circuit
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induction melting furnace
Abstract: induction furnace ecss1 ECSS1VF685 ECSS1CF225 ECSS1VF225S ECSS1CF226 ECSS1CF106 ECSS1VF105 ECSS1EF155
Text: Tantalum Solid Electrolytic Capacitors/FS Resin Molded Type Tantalum Solid Electrolytic Capacitors Discontinued FS Type: S Resin Molded Type Series: Japan • Features ● Built-in fuse to avoid catastrophic failure due to over current ● Superior impedance characteristics
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RCR-2368
EE214
induction melting furnace
induction furnace
ecss1
ECSS1VF685
ECSS1CF225
ECSS1VF225S
ECSS1CF226
ECSS1CF106
ECSS1VF105
ECSS1EF155
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Untitled
Abstract: No abstract text available
Text: Surface Mount Soldering Recommendations The most important consideration in reliability is achieving a good solder bond between a surface mount device SMD and substrate since the solder provides the thermal path from the chip. A good bond is less subject to thermal fatiguing and
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circuit of "ultrasonic cleaner"
Abstract: No abstract text available
Text: Surface Mount Soldering Recommendations The most important consideration in reliability is achieving a good solder bond between a surface mount device SMD and substrate since the solder provides the thermal path from the chip. A good bond is less subject to thermal fatiguing and
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400kPa
Abstract: Pressure sensor air pressure sensor tube ADP1101 ADP1111 ADP1121 ADP1181 ADP1191 ADP1131 ADP1132
Text: PF PRESSURE SENSOR 2002.10.23 7:58 PM Page 27 PF ADP1 • A wide range of rated pressure, including a minute pressure There are 10 types of sensors covering a wide range of rated pressure from a minute pressure between 4.9 kPa {0.05 kgf/cm2}, to a maximum pressure of
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Pressure sensor
Abstract: ADP11A23 9807 ADP1161 air pressure sensor tube Ultrasonic cleaner piezo ADP1101 ADP1111 ADP1121 ADP112
Text: PF PRESSURE SENSOR 04.11.10 11:32 AM Page 38 PF ADP1 PF PRESSURE SENSOR PRECISION SEMICONDUCTOR PRESSURE SENSOR <Cross-section of Sensor Chip> Silicon Piezo resistance strain gauge Anode junction Pressure Glass base Highly reliable wire bonding technology
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40KHZ ULTRASONIC CLEANER CIRCUIT
Abstract: BGA reflow guide 1mm pitch zif BGA socket pogo pin cleaning "ultrasonic cleaner" 1mm pitch BGA socket 40KHz ultrasonic interface maintenance program ULTRASONIC bath CLEANER CIRCUIT ultrasonic probe
Text: Stamped Spring Pin Socket for Burn-in & Test Applications User Manual Tel: 800 404-0204 www.ironwoodelectronics.com STAMPED SPRING PIN SOCKET USER MANUAL Table of Contents Socket Mechanics . 2
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ADP5101
Abstract: ADP51A11 pressure sensors used four measuring blood pressure MEDICAL PRESSURE SENSOR Ultrasonic cleaner piezo ADP5150 ADP1101 consumer LOW PRESSURE SENSOR fluid PRESSURE SENSOR full bridge strain gage pressure sensor
Text: Build_Sensors.book Seite 34 Mittwoch, 5. März 2008 4:18 16 PS-A ADP5 Pressure sensor with built-in amplification and temperature compensation circuit. Low pressure type ideal for water level (built-in amplification and detection applications added to lineup. temperature compensating circuit)
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do214 smd dimensions
Abstract: AN1005 to252 footprint wave soldering "ultrasonic cleaner" AN10053 wave footprint AN10055 teccor
Text: Teccor brand Thyristors Surface Mount Soldering Recommendations Introduction The most important consideration in reliability is achieving a good solder bond between surface mount device SMD and substrate since the solder provides the thermal path from
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DO-214,
O-252
OT-223
AN10058
do214 smd dimensions
AN1005
to252 footprint wave soldering
"ultrasonic cleaner"
AN10053
wave footprint
AN10055
teccor
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ADP41410
Abstract: PRESSURE SENSOR Ultrasonic cleaner piezo ADP41320 air pressure sensor tube atmospheric pressure sensor circuit Gas Meter glass break sensor diagram hydrogen gas sensor Ultrasonic cleaner circuit diagram
Text: PS ADP4 ULTRA SMALL HIGHLY SEMICONDUCTOR PRESSURE SENSOR FEATURES mall Ultra-sture minia 1. Ultra-miniature size: much more compact than the PF pressure sensors offered in the past • Base area: 7.2(W) x 7.2(D) mm .283(W) x .283(D) inch • Only 60% in mounting area and 91% in
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nais pressure sensor
Abstract: ADP41320 nais sensor gas pressure sensor ADP41010 ADP41110 ADP41210 ADP41310 ADP41410 ADP41510
Text: PS PRESSURE SENSOR 2002.10.23 7:58 PM Page 23 PS ADP4 ULTRA SMALL HIGHLY SEMICONDUCTOR PRESSURE SENSOR • Base area: 8.6 .339 7.2(W) x 7.2(D) mm 7.2 .283 .283(W) x .283(D) PS inch 7.2 • Only 60% in mounting .283 10.0 .394 area and 91% in overExisting products
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Untitled
Abstract: No abstract text available
Text: ULTRA SMALL HIGHLY SEMICONDUCTOR PRESSURE SENSOR FEATURES mall Ultra-sture minia 1. Ultra-miniature size: much more compact than the PF pressure sensors offered in the past • Base area: 7.2 W x 7.2(D) mm .283(W) x .283(D) inch • Only 60% in mounting area and 91% in
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ASCTB87E
201201-T
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ADP41320
Abstract: ADP41310 ADP41510 negative PRESSURE SENSOR gas pressure sensor Pressure sensor strain gage pressure sensor Ultrasonic cleaner piezo ADP41010 ADP41110
Text: PS PRESSURE SENSOR 04.11.10 11:31 AM Page 34 PS ADP4 PS PRESSURE SENSOR ULTRA SMALL HIGHLY SEMICONDUCTOR PRESSURE SENSOR • Ultra-miniature size: much more compact than the PF pressure sensors offered in the past Piezo resistance strain gauge Drive current: 1.5 mA rated current; ambient temperature: 25°C 77°F
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ADP1132
Abstract: air pressure sensor tube glass break sensor diagram Ultrasonic cleaner circuit diagram ADP1101 ADP1111 ADP1121 ADP1131 ADP1141 ADP1151
Text: PF ADP1 PF PRESSURE SENSOR PRECISION SEMICONDUCTOR PRESSURE SENSOR FEATURES Silicon Piezo resistance strain gauge Anode junction Pressure Glass base Highly reliable wire bonding technology Pressure High reliability die bonding technology Very strong, heat resistant body
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ADP1141)
ADP1132
air pressure sensor tube
glass break sensor diagram
Ultrasonic cleaner circuit diagram
ADP1101
ADP1111
ADP1121
ADP1131
ADP1141
ADP1151
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pressure sensor
Abstract: No abstract text available
Text: PF ADP1 PF PRESSURE SENSOR PRECISION SEMICONDUCTOR PRESSURE SENSOR FEATURES Silicon Piezo resistance strain gauge Anode junction Pressure Glass base Highly reliable wire bonding technology Pressure High reliability die bonding technology Very strong, heat resistant body
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ADP1141)
ASCTB88E
201201-T
pressure sensor
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Untitled
Abstract: No abstract text available
Text: NTC thermistors for temperature measurement Glass-encapsulated sensors for media contact Series/Type: B57565G1 Date: August 2014 EPCOS AG 2014. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
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B57565G1
G1565
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Untitled
Abstract: No abstract text available
Text: NTC thermistors for temperature measurement Glass-encapsulated sensors for media contact Series/Type: B57565G1 Date: March 2013 EPCOS AG 2013. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
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B57565G1
G1565
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3M Touch Systems
Abstract: ECEA1ES
Text: Aluminum Electrolytic Capacitor/SS Radial lead type Series: NEW • Features Discontinued Type :A SS Endurance :85°C 2000 h ■ Specifications Operating temp. range Rated W.V. range -40 to + 85°C 6.3 to 50 V .DC Nominal cap. range Capacitance 47 to 4700 µ F
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120Hz/
03per
120Hz
2000hrs
RCR-2367
3M Touch Systems
ECEA1ES
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Ultrasonic S
Abstract: 3M Touch Systems SU SERIES CAPACITOR ALUMINIUM
Text: Aluminum Electrolytic Capacitor/SS Radial lead type Series: NEW • Features Discontinued Type :A SS Endurance :85°C 2000 h ■ Specifications Operating temp. range Rated W.V. range -40 to + 85°C 6.3 to 50 V .DC Nominal cap. range Capacitance 47 to 4700 µ F
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120Hz/
03per
120Hz
2000hrs
RCR-2367
Ultrasonic S
3M Touch Systems
SU SERIES CAPACITOR ALUMINIUM
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DC voltage meter
Abstract: No abstract text available
Text: KOA SPEER ELECTRONICS, INC. TN-194 R5 AHA 7/14/03 Chip Tantalum Solid Electrolytic Capacitor Type TMU CERTIFIED 1. General 1-1 Scope of Application This document applies to miniaturized chip tantalum solid electrolytic capacitors for applications in transistorized circuits of electronic devices.
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TN-194
DC voltage meter
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1D104
Abstract: No abstract text available
Text: TN-194 R1 Chip Tantalum Solid Electrolytic Capacitor Type TMU CERTIFIED 1. General 1-1 Scope of Application This document applies to miniaturized chip tantalum solid electrolytic capacitors for applications in transistorized circuits of electronic devices.
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TN-194
1D104
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capacitor x2 GMF 40/100/21
Abstract: dc1414 gmf mkt. 250v 40/100/21 csa c22.2 no8 DATASHEET Of c i 4046 barrister diode 10000v JIS C 5102-1994 english ecqul x2 dc1414v
Text: Page2of 28 TYPE:ECQUL ５．CONSTRUCTION 構造 The capacitor has a non-inductive construction, would with metallized polyester film and polyester film dielectric. The capacitor is enclosed in noncombustible plastic case, filled with noncombustible filling resin, and has
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UL94V-0)
UL94V-0
100pieces
capacitor x2 GMF 40/100/21
dc1414
gmf mkt. 250v 40/100/21
csa c22.2 no8
DATASHEET Of c i 4046
barrister
diode 10000v
JIS C 5102-1994 english
ecqul x2
dc1414v
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Untitled
Abstract: No abstract text available
Text: Tantalum Electrolytic Capacitors General Information Application Guidelines Application Guidelines [Notices] • Instantaneous voltage peak value is included in the operating voltage value. * • The specified range in low impedance circuit includes the case that the rush charging current
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Untitled
Abstract: No abstract text available
Text: 14. PRECAUTION FOR HANDLING SURFACE M O U N T DEVICES 14. PRECAUTION FOR HANDLING SURFACE MOUNT DEVICES 14.1 S o ld e r in g The m ost co m m o n ly used sold e rin g m e th o d s used for hybrid devices are re low so ld e rin g a n d flo w dip sold ering. These m ethods, their application and pre cautions are described below .
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