ICC1-100
Abstract: ICC150
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Add device type 02. Inactivate device type 01 (no approved source of supply). Add device types 03 through 07. Add vendors CAGE 32116, 5Y243, 57363, and 88379. Changed to reflect MIL-H-38534 processing. Editorial changes throughout.
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5Y243,
MIL-H-38534
8K957.
5962-R189-92.
5962-R110-94.
5962-R013-96.
5962-R110-94
5962ents
U4388
ICC1-100
ICC150
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INCOMING RAW MATERIAL INSPECTION chart
Abstract: INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL flowchart LINEAR TECHNOLOGY mark code INCOMING MATERIAL FLOW PROCESS INCOMING RAW MATERIAL aql incoming inspection mil-std-883 2015 Gold Ball Bond Shear
Text: Pg. 1 of 3 ATTACHMENT 2. ASSEMBLY FLOWCHART INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology BIPOLAR PROCESS TO-92 Linear Technology Carsem Maylasia Linear Technology
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MIL-STD-883
INCOMING RAW MATERIAL INSPECTION chart
INCOMING RAW MATERIAL INSPECTION form
INCOMING RAW MATERIAL INSPECTION
INCOMING RAW MATERIAL INSPECTION method
INCOMING RAW MATERIAL flowchart
LINEAR TECHNOLOGY mark code
INCOMING MATERIAL FLOW PROCESS
INCOMING RAW MATERIAL
aql incoming inspection
mil-std-883 2015 Gold Ball Bond Shear
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sdram controller
Abstract: sdram Dynamic RAM Controller controller sdram free
Text: 1 SDRAM Controller SDRAM Controller VENDOR QuickLogic Corp 1277 Orleans Drive Sunnyvale, CA 94089 USA Tel. 408 990 4000 Fax (408) 990 4040 Email [email protected] WWW http://www.quicklogic.com December 1999 OVERVIEW The SDRAM Controller bridges between standard bus
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PC100
112/100MHz
sdram controller
sdram
Dynamic RAM Controller
controller
sdram free
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INCOMING RAW MATERIAL INSPECTION
Abstract: INCOMING RAW MATERIAL INSPECTION method INCOMING Plate INSPECTION INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL flowchart INCOMING RAW MATERIAL LINEAR TECHNOLOGY mark code inspection sampling plan INCOMING RAW MATERIAL INSPECTION chart mil-std-883 2015 Gold Ball Bond Shear
Text: Pg. 1 of 3 ATTACHMENT 2. ASSEMBLY FLOWCHART INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology Corporation Bipolar Process 3 Lead SOT-223 Linear Technology Corp., Milpitas,
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OT-223
MIL-STD-883
INCOMING RAW MATERIAL INSPECTION
INCOMING RAW MATERIAL INSPECTION method
INCOMING Plate INSPECTION
INCOMING RAW MATERIAL INSPECTION form
INCOMING RAW MATERIAL flowchart
INCOMING RAW MATERIAL
LINEAR TECHNOLOGY mark code
inspection sampling plan
INCOMING RAW MATERIAL INSPECTION chart
mil-std-883 2015 Gold Ball Bond Shear
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T60407
Abstract: Pulse Transformer T60407 ST5481 TQFP48 LINE FEED ISDN RJ45 plug dimension spec "Hot Plug and Play"
Text: ST5481 L.O.U.I.S - LOW COST USB ISDN SOLUTION PRODUCT PREVIEW • COMMUNICATION DEVICE CLASS AND HARDWARE FEATURES VENDOR REQUESTS S/T ISDN Interface ■ SUPPORTS OSI LEVEL 1 IN CONFOR- ■ BUS OR SELF POWERED APPLICATION PIN PROGRAMMABLE MANCE WITH UIT-T I.430 FOR BASIC
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ST5481
300012/ANSI
192KBps
64KBps
16KBps
ST5481
T60407
Pulse Transformer T60407
TQFP48
LINE FEED ISDN
RJ45 plug dimension spec
"Hot Plug and Play"
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29LV800
Abstract: 29f016 29f400 29F040
Text: Common Flash Interface Version 1.4 Vendor Specific Extensions Application Note Introduction This application note provides an overview of the changes implemented between versions 1.3 and 1.4 of the SpansionTM Flash memory Common Flash Interface CFI implementation.
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H7137NL
Abstract: H7029NL HX7028NL H7137NLT H7019NL MX4C H7037NL H7028NL H7137 HX7028
Text: 10GBase-T Magnetics Modules Designed to Support 10GBase-T Transceivers Compliant with IEEE 802.3 standard Qualified with top 10Gig PHY Manufacturer RoHS peak reflow temperature rating: 245°C Low profile package for PCI Express Fine-tune magnetics to specific PHY vendors
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10GBase-T
10Gig
H7137NL
H7029NL
HX7028NL
H7137NLT
H7019NL
MX4C
H7037NL
H7028NL
H7137
HX7028
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PLCC32
Abstract: PLCC32 SOCKET AE-P32U-Z PLCC-32
Text: AE-P32U-Z Page 1 of 2 AE-P32U-Z DIP32/PLCC32 universal adapter with clam shell socket. Click the programmer model below to get an appropriate list of the devices supported by the adapter: z z z ChipProg+ ChipProg-40 ChipProg-48, ChipProg-G4 Adapter analogues supplied by third-party vendors:
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AE-P32U-Z
DIP32/PLCC32
ChipProg-40
ChipProg-48,
PA32-32Z
DIP-32
PLCC-32
com/downloads/adp/HTML/ae-p32u-z
PLCC32
PLCC32 SOCKET
AE-P32U-Z
PLCC-32
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FLASH370I
Abstract: ORCAD CY3140 CY3144 vector generator PLD386 Cypress Programmable Logic schematic sim vhdl code for 555
Text: Third-Party Tool Support PRELIMINARY Support for Cypress programmable logic devices is available in many software products from third-party vendors. Some companies include support for the entire design process in products that they sell. Others provide software for a portion of
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5503 dm
Abstract: RS232 STAG 300 interface mhw 602 smd DAL PS-10 cable converter DriveWay COP8-PM-00 Metalink 40 pin ide to 44 pin ide adapter cable
Text: COP8SG Family . COP8 Tools Overview National is engaged with an international community of independent 3rd party vendors who provide hardware and software development tool support. Through National’s interaction and guidance, these tools cooperate to form a choice
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Untitled
Abstract: No abstract text available
Text: POE-D08-00-E-06 Y5V Hi-K CERAMIC CAPACITOR Ver: 6 PRODUCT: CERAMIC DISC CAPACITOR TYPE P/N: Y5V Hi-K CERAMIC CAPACITOR CUSTOMER: DOC. NO.: POE-D08-00-E-06 Ver.: 6 APPROVED BY CUSTOMER VENDOR： ： □ WALSIN TECHNOLOGY CORPORATION 566-1, KAO SHI ROAD,YANG-MEI
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POE-D08-00-E-06
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AN1773
Abstract: MCM63Z736 MCM63Z737 MCM63Z818 MCM63Z819 signal path designer "network interface cards"
Text: MOTOROLA Order this document by AN1773/D SEMICONDUCTOR TECHNICAL DATA AN1773 ZBT Primer Prepared by: Don Taylor, Benjie Zeller, and Andrea Crocker The emergence of higher bandwidth networking systems and infrastructures has driven SRAM vendors to search for
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AN1773/D
AN1773
AN1773
MCM63Z736
MCM63Z737
MCM63Z818
MCM63Z819
signal path designer
"network interface cards"
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ah681k
Abstract: AH102K AH152M ah101k AH222M AH332M ah102m AH472M130 Pan Overseas walsin capacitor
Text: POE-D10-00-E-10 SAFETY STANDARDS REGULATED, REINFORCED INSULATION TYPE, AH SERIES PRODUCT: Ver: 10 CERAMIC DISC CAPACITOR SAFETY RECOGNIZED TYPE: AH SERIES CUSTOMER: DOC. NO.: POE-D10-00-E-10 Ver.: 10 APPROVED BY CUSTOMER VENDOR： ： □ WALSIN TECHNOLOGY CORPORATION
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POE-D10-00-E-10
POE-D10-00-E-10
EF-150C
EF-150
PCE-210
PCE-300
SP-160PL
SP-260PL
ah681k
AH102K
AH152M
ah101k
AH222M
AH332M
ah102m
AH472M130
Pan Overseas
walsin capacitor
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8708ELP
Abstract: 8704ELP 8708EM2 8888ELP 8880EM2 8704EM2
Text: The MegaRAID SAS 3Gb/s OS Support Matrix This represents the available drivers and Operating Systems are supported for MegaRAID SATA+SAS controllers. Updated 09/15/10 MegaRAID SAS 87xx and 88xx Series This table lists the Operating Systems vendors are supported for MegaRAID controllers such as 8704ELP, 8708ELP,
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8704ELP,
8708ELP,
8704EM2,
8708EM2,
8880EM2,
8888ELP.
64bits
8708ELP
8708EM2
8704ELP
8708ELP
8704ELP
8708EM2
8888ELP
8880EM2
8704EM2
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HI1-201hs
Abstract: 5962-8671601EA 5962-8671602EA 5962-8671603ea HI1-201 5962-86716012A qml-38535 ADG201HST CQCC1-N20 DG271
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Add two vendors, CAGE 24355 and CAGE 17856. Add device type 02. Make changes to 1.2.1, 1.3, 1.4, and table I, figure 1, and figure 3. Editorial changes throughout. 89-11-09 M. A. Frye B Remove vendor, CAGE 24355 from device types 01 and 02. Add device type 03.
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Untitled
Abstract: No abstract text available
Text: SALES CONDITIONS CONDITIONS OF SALE 1. GENERAL. 7.7 The terms and conditions contained herein shall apply, unless otherw ise stated in a written agreement, lo both export sales and sales m France made by our Company hereinafter called th e "Vendor". The sending o f an order by the Buyer constitutes his acceptance in their entirety of the
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WM Mark code
Abstract: MIL-STD-10
Text: DATA C O N T A IN E D IN THIS DOCUMENT R EVISIO NS IS RE V A ND S H A L L N O T BE D I S C L O S E D , C O P I E D OR USE D FOR P R O C U R E M E N T OR M A N U F A C T U R E W I T H O U T EXPRESS WRITTEN PERM ISSIO N. PART NO. CACE CODE VENDOR P /N NAME AND ADDRESS
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054SHEET
WM Mark code
MIL-STD-10
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7901001QX
Abstract: M38510 2ch H military MANUFACTURER LOCATION AND symbols 7901001 8-22-8C 8228c 5962-E871 79010
Text: R E V IS IO N S DATe DESCRIPTION LTR A APPROVED | Pg. 2 - VIH Correction 8-22-8C Pg. 4 - I IH> I IL conditions Pg. 8 - Add note 4/ Pg. 13 - Table I I I subgroups Pg. 18 - Vendor type corrected REV I 1 Convert to approved source format. Complete document revision.
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8-22-8C
MIL-STD-100
59ave
7901001QX
IMD8085AH/B
IAM8085/BQA
M38510
2ch H
military MANUFACTURER LOCATION AND symbols
7901001
8228c
5962-E871
79010
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sm 4109 smd
Abstract: smd fuse marking code 01X SMD ic 431c 8200902 8200902JX 93Z665DMQB45 94Q3
Text: i l AMD REVISIONS LTR H DATE DESCRIPTION Redrawn with changes. Delete vendor CAGE 27014 for PINs O U , 01L, 013, Q2J, 02L, 023, 03J, 03L, and 033. Add vendor CAGE 07933 for PINs 0 1 J, 01X , and 011. Change vendor CAGE 18324 similar PIN for devices 03J and 033.
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94Q39-701<
27S49A
sm 4109 smd
smd fuse marking code 01X
SMD ic 431c
8200902
8200902JX
93Z665DMQB45
94Q3
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intel 29F
Abstract: T7164 28F Intel LV6416 4c4007 5B810 32kxS 62832 dram cross reference T5C2568
Text: A Fast SRAM cross reference Vendor Cypress Hitachi Code ASCCode Description Code ASC Code CY 7C 185 A S7C 164 81x8 M C M 6264C AS7C164 8Kx8 CY 7C 199 A 57C 256 32K x8 M C M 6206D A S7C2S6 32K x8 C Y 7 C J3 9 9 A S7C 32S6 3 2 K * 8 3V M CM 62V06D A S7C 3256
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628127H
T7164
712S6
DT71Q08
1S61C64AH
LS61C2S6AH
IS61LV3216
S61C512
IS61C64
S61LV256
intel 29F
T7164
28F Intel
LV6416
4c4007
5B810
32kxS
62832
dram cross reference
T5C2568
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Untitled
Abstract: No abstract text available
Text: Q uality & Reliability Q uality Strategy Quality by Design Vendor Management Alliance’s quality strategy begins with design. Our memories are built in simpler process technology than competing parts. Fewer processing steps means fewer parameters to control,
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MIL-STD883D,
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UX31
Abstract: No abstract text available
Text: 4 2 3 NOTE: [TjM a rkin g i The Supplier ID format is C C C 2 Y W W . X X X Vendor tracking nunber Work week “the product was nomufactured Year the product was manufactured 2 ] M a r k in g : B B In te l P a r t Number 3, C LIP MUST STAY ATTACHED TD HEATSINK
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351830301A
334C846101A
335I830302A
D2/16/'
D2/16/
UX31
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EPROM 2732B
Abstract: 2732B 8001204JX 4Kx8 bit 8001203JX
Text: REVISIONS LTR DATE YR-MO-DA DESCRIPTION F Add margin t e s t . Delete one vendor, CAGE 01295. Delete reprogrammability of EPROMS. Add device types 07, 08, 09, 10, and 11. Add program method C and c h a r a c t e r is t ic s . Minor changes to tab le I , tab le I I , and tab le I I I . Change to
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ICF CP 1005
Abstract: 8103907Jx 8103906JX AM9128-20 1S16 S005 ccez
Text: REV ISIO N S DATE DESCRIPTION LTR A Add types 04, 05; Delete type 01. 30 Ju ly 83 B Remove 2 vendors FSCM 01295, FSCM 50088. Add 1 vendor FSCM 34335 with device types 06, 07, 08. 23 Jan C 8U Add block diagram, and timing diagram for device types 06, 07, and 08.
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DOO-STD-109
8103902ZX
8103903J
8103903ZX
8103904JX
8103904ZX
8103905JX
8103905ZX
8103906JX
8103907JX
ICF CP 1005
AM9128-20
1S16
S005
ccez
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