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    VO3062/3063 Search Results

    VO3062/3063 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    RJP3063DPP-00#T2 Renesas Electronics Corporation Insulated-Gate Bipolar Transistors (IGBT) Visit Renesas Electronics Corporation
    75168-306-36LF Amphenol Communications Solutions BergStikĀ®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    61083-063409LF Amphenol Communications Solutions BergStakĀ® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 60 Positions. Visit Amphenol Communications Solutions
    65863-063LF Amphenol Communications Solutions Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 0.76 um (30 u\\.) Gold Mating Plating. Visit Amphenol Communications Solutions
    61083-063422PLF Amphenol Communications Solutions BergStakĀ® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 60 Positions. Visit Amphenol Communications Solutions