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    X-GOLD 613 Search Results

    X-GOLD 613 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-ACPRREDAA0 Amphenol Cables on Demand RCA Male Plug Cable Connector (Red) - Amphenol ACPR-RED - Gold Plated Diecast Shell Datasheet
    AV-3.5MINYRCA-015 Amphenol Cables on Demand Amphenol AV-3.5MINYRCA-015 Stereo Y Adapter Cable - Premium Gold Stereo 3.5mm (Headphone Plug) to Dual RCA Y Adapter Cable - 3.5mm Mini-Stereo Male to Dual RCA Male 15ft Datasheet
    101015147502A Amphenol Communications Solutions T-flash Card Hingd With 15u\\ Gold Visit Amphenol Communications Solutions
    GTFP08121YHR Amphenol Communications Solutions MICRO SD,P/P,10U GOLD Visit Amphenol Communications Solutions

    X-GOLD 613 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    X-GOLD613 Infineon Technologies X-GOLD 613 - PMB 9802 Original PDF

    X-GOLD 613 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    infineon x-gold

    Abstract: MIPI csi-2 x-gold eMMC X-GOLD613 MIPI CSI-2 Parallel MIPI csi ARM11 infineon gold arm1176 lpddr1
    Text: Product Brief X-GOLD 613 TM 3G Low-Cost Solution for Mobile Internet Browsing & Messaging Main Features The Infineon X-GOLD 613 is a cellular System-on-Chip comprising of 2G/3G digital and analog baseband plus power management functionality, all monolithically integrated in 65nm CMOS technology. It is Infineon’s 3rd


    Original     		PDF X-GOLDTM213, X-GOLDTM613 B153-H9352-X-X-7600 NB08-1348 infineon x-gold MIPI csi-2 x-gold eMMC X-GOLD613 MIPI CSI-2 Parallel MIPI csi ARM11 infineon gold arm1176 lpddr1

    Ultem1000

    Abstract: No abstract text available
    Text: DESCRIPTION BY APPD DATE C REVISED PER ER042797 CY REV TZ 07/06/12 NOTES: UNLESS OTHERWISE SPECIFIED 1. MATERIAL SPECIFICATIONS: BODY: BRASS PER ASTM B16 CONTACT: BERYLLIUM COPPER PER ASTM B196 INSULATOR: TEFLON PER ASTM D1710 CE INSULATOR: ULTEM1000 OR LCP PER ZENITE 6130L X BK010


    Original     		PDF D1710 ULTEM1000 6130L BK010 AMS-QQ-N-290 ER042797 034G-034-00003H

    Ultem1000

    Abstract: ultem1000 parts
    Text: BY APPD DATE REVISED PER ER042797 CY B DESCRIPTION TZ 07/06/12 REV NOTES: UNLESS OTHERWISE SPECIFIED 1. MATERIAL SPECIFICATIONS: BODY, NUT, BKHD BUSHING: BRASS PER ASTM B16 CONTACT: BERYLLIUM COPPER PER ASTM B196 INSULATOR: TEFLON PER ASTM D1710 CE INSULATOR: ULTEM1000 OR LCP ZENITE 6130L X BK010


    Original     		PDF D1710 ULTEM1000 6130L BK010 AMS-QQ-N-290 000100MIN AMS-QQ-N-290 AMS-QQ-N290 206G-034-00003N ultem1000 parts

    Brass QQ-B-626

    Abstract: 11C2 919-102P-51AX MIL-P-19468 QQ-B-613 qq-b-626
    Text: 9 1 9 - 1 0 2P -5 1A X NDTESi REVISIONS DRAWING NO. 1. 2. 3. MATERIALS OF CONSTRUCTI ON: HDUSING = BRASS Q Q -B -6 2 6 , GOLD PLATED. BODY = BERYLLIUM COPPER, GUILD PLATED. CONTACT P IN = BRASS (Q Q -B -6 2 6 ), GOLD PLATED. COVER = BRASS <Q Q -B -613>, GOLD PLATED.


    OCR Scan     		PDF QQ-B-626) QQ-B-613) MIL-P-19468. 919-102P-51AX \PETE\MCX\91 02PX51AX000C 919-102P-51AX Brass QQ-B-626 11C2 MIL-P-19468 QQ-B-613 qq-b-626

    Untitled

    Abstract: No abstract text available
    Text: Tin IDM ^ -C = 10m" 0,25pm Gold IDS (-T End Assembly Required) A -S T “ X” - S “ XX” : Stripped & Tinned : Daisy Chain Single Specify Suffix from table. All dimensions are ± 1/16". Not available in 28 positions and higher. “XX” ± 10p" (0,25pm) Gold IDM


    OCR Scan     		PDF

    Transistor S 40443

    Abstract: No abstract text available
    Text: bbS3T31 0024T37 flOO « A P X Philips Semiconductors NPN 7 GHz wideband transistor £ BFG197; BFG197/X; BFG197/XR AMER PHILIPS/ DIS CRETE FEATURES Product specification b?E D PINNING PIN • High power gain • Low noise figure • Gold metallization ensures


    OCR Scan     		PDF bbS3T31 0024T37 BFG197; BFG197/X; BFG197/XR BFG197 BFG197 OT143 BFG197/X Transistor S 40443

    Untitled

    Abstract: No abstract text available
    Text: r 1 I P R O D U C T N U M BER 2 9 3 9 2 2 -X 1 Y 8 3 .9 5 REF. i % Id sL a y PLATING IN CONTACT AREA THICKNESS PLATING CODE -1 Y Y 0 .8 um GOLD 2 .0 um GOLD —2YY —3YY 1.3 um GXT -9 Y Y 0 .8 um GXT UNDERPLATING 1.3 um Ni MIN. 2 .0 um Ni MIN. 2 .0 um Ni MIN.


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    11C2

    Abstract: 20C5 QQ-B-613 30C7 07c17 39C10
    Text: 9 1 9 - 1 0 4 P - 5 1 Al X NOTES; 2. 3. DRAWING NO. THIRD ANGLE PROJ. MATERIALS OF CONSTRUCTI DNi HOUSING = BRASS <Q Q -B-626>, NICKEL PLATED, BODY = BERYLLIUM COPPER, NICKEL PLATED. CONTACT P IN = BRASS Q Q -B -6 2 6 , GOLD PLATED. COVER = BRASS CQ Q -B-613 ), NICKEL PLATED.


    OCR Scan     		PDF QQ-B-626) QQ-B-613) 04P-51 28CAmphenol \PETE\MCX\919\ASSY\104P\51AlX00C 919-104P-51 11C2 20C5 QQ-B-613 30C7 07c17 39C10

    31-5136-RFX

    Abstract: QQ-B-613 RG-62
    Text: 3 1 -5 1 3 6 -R F X NOTES- REVISIONS REV DRAWING NO. 1. MATERIALS OF CONSTRUCTION: SHELL, HEX BIDDY, RETAINER RING = BRASS Q Q -B -6 26 , NICKEL PLATED C.000100 MIN) INSULATDRS (2 ) = DELRIN, COLOR NATURAL CONTACT PIN = BRASS (Q Q -B -6 2 6 ), GOLD PLATED (.000003 MIN)


    OCR Scan     		PDF QQ-B-626) QQ-B-626> QQ-B-613) RG-62 31-5136-RFX 250C6 1/4-28UNEF \DEPT611\BNC\031\ASSY\5136\RFXSHT2 QQ-B-613

    Untitled

    Abstract: No abstract text available
    Text: TM E X T E N D E D L IF E P R O D U C T 0,50mm .01969 ' Mixed Rowing Gas with 50p* Gold Call Samtec fo r maximum cycles BTH SERIES BASIC BLADE & BEAM HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?BTH Insulator Material


    OCR Scan     		PDF

    Transistor S 40443

    Abstract: C 5478 transistor msc 0645 MSC 1691 AI MSC 1691 Philips FA 291 msc 1699 msc 1697 MCD156 0280 130 085
    Text: ^53^31 Philips Semiconductors IAPX 0024=137 Û00 NPN 7 GHz wideband transistor ^ BFG197; BFG197/X; BFG197/XR N AMER P H I L I P S / D I S C R E T E FEATURES • Product specification b?E D PINNING High power gain PIN • Low noise figure • Gold metallization ensures


    OCR Scan     		PDF BFG197; BFG197/X; BFG197/XR BFG197 BFG197 BFG197/X OT143 Transistor S 40443 C 5478 transistor msc 0645 MSC 1691 AI MSC 1691 Philips FA 291 msc 1699 msc 1697 MCD156 0280 130 085

    Untitled

    Abstract: No abstract text available
    Text: iamteo B T S -07 5 -0 1 -L -D -A E X T E N D E D L IF E P R O D U C T 0,635mm .025" C l 10 year Mixed Flowing Gas with 50p’ Gold Call Samtec for maximum cycles BTS, BSS SERIES BASIC BLADE & BEAM HEADER & SOCKET SPECIFICATIONS For complete specifications and


    OCR Scan     		PDF 635mm)

    Untitled

    Abstract: No abstract text available
    Text: Cl E X T E N D E D L IF E P R O D U C T 0,80mm .0315" BTE, BSE SERIES B T E -0 6 0 -0 2 -F -D -A 10 year Mixed Flov/ing Gas with 50p* Gold Call Sam tec for m axim um cycles i _ BASIC BLADE & BEAM HEADER & SOCKET SPECIFICATIONS For complete specifications and


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Technical Specifications ELCO Technical Data B asic grid 100 2 54 x 100(2,54) In s e rtio n Force Series 8251 8352 8275 8281 8381 1-6 oz per contact W ith d ra w a l force 75 oz mm. per contact C o n ta c t re s is ta n c e 12 millohms max for gold plating


    OCR Scan     		PDF TDDS71S 0GGG223

    Untitled

    Abstract: No abstract text available
    Text: TM M -110-01-T-D-SM T M M -112-01-G -S -S M E X T E N D E D LIFE P R O D U C T 2,00mm .0787" 10 year Mixed Flowing Gas with 30p’ Gold 1.000 cycles v/hen mated with SMM T M M SERIES LOW PROFILE SMT HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts


    OCR Scan     		PDF -110-01-T-D-SM -112-01-G

    MTMM 105-02-T-S-095

    Abstract: No abstract text available
    Text: iam tec C L T -115-02-F -D -A -K -B E CLT-105-02-F-D C LT-125-02-L-D E X T E N D E D L IF E P R O D U C T 2,00m m .0787" CLT SERIES 10 year Mixed Flowing Gas with 30 m* Gold Call Samtec to r maximum cycles LOW PROFILE DUAL WIPE SOCKET SPECIFICATIONS For complete specifications and


    OCR Scan     		PDF -115-02-F CLT-105-02-F-D LT-125-02-L-D MTMM 105-02-T-S-095

    Marking W36

    Abstract: No abstract text available
    Text: _ PRODUCT il_zi_ 3_L NO. 61372-* 6 3 .0 0 3 1 .5 0 1.00 I II °s H LEFT PEG L /S E E RIGHT PEG MARKING NOTE 4 / •" SEE TABLE a oJ |f l l h * § 3 if lia; l l i l 7 2 .9 REF. LATCH OPENING iti! 6 7 .9 Ji! fi !


    OCR Scan     		PDF 150/i" 150/x" T80152 W34/16/98 T80222 W36/03/90 Marking W36

    Untitled

    Abstract: No abstract text available
    Text: DRAWING No.:—M 2 2 -6 1 3 X X X X SHEET 2 OF 2 IF IN DOUBT - ASK NOT TO S C A L E THIRD ANGLE PROJECTION A L L DIMENSIONS IN mm -2,00 x No, OF WAYS PER ROW MAX. -2.00 x No. OF PITCHES PER ROW- ORDER CQDEi M22-613 NUMBER OF WAYS 03 TO 25 PLATING FIN ISH -06 = TIN /LEAD


    OCR Scan     		PDF M22-613) 0018X

    BS3G210

    Abstract: T5747
    Text: Customer Information Shee DRAWING No.: M80-613XXXX SHEET 2 OF 2 I IF IN DOUBT - ASK j ç \ j NOT TO SCALE ALL DIMENSIONS IN mm THIRD ANGLE PROJECTION SPECIFICATION S: MATERIAL; MOULDING - HIGH TEMPERATURE POLYAMIDE 46, UL94V-0, BLACK CLIP = BERYLLIUM COPPER


    OCR Scan     		PDF M80-613XXXX UL94V-0, BS3G210 T5747

    C26000

    Abstract: 56-LL
    Text: PART NO. ENG. NO. 02-06-2131 1 8 5 4 - 0 0 1 02-06-2132 1854 — 9 0 l)L 02-06-2134 1 8 5 4 - 0 0 1)1 02-06-6137 18 54 - (5 9 1) 02-06-6136 1854-159 l)L 02-06-6138 18 5 4 - ( 5 6 1) 02-06-6139 l 8 5 4 - ( 5 6 l)L 02-06-6130 l854-(550) 02-06-6135 I854-(550)L


    OCR Scan     		PDF l854-( MAX68 C26000, UCR2002-0270 -C5T51L I854XI SD-1854- C26000 56-LL

    Untitled

    Abstract: No abstract text available
    Text: REVISIONS NOTES: 1. 2. 3. FINISH PLATING THICKNESS IN MICRO-INICHES BRASS PER Q Q -B-626 BRASS PER Q Q -B-613 GOLD PL, 3 MIN. THICK OVER NICKEL PL. 100 MIN, THICK OVER COPPER STRIKE 4. BERYLLIUM COPPER PER QQ-C-530 5. GOLD PL. 00 MIN. THICK OVER NICKEL PL. 100 MIN. THICK


    OCR Scan     		PDF -B-626 -B-613 QQ-C-530 10-56X15 MMCX7071A1 MMCX70 MMCX7071A MMCX7471A X7471A

    Untitled

    Abstract: No abstract text available
    Text: REVISIONS ISS ZONE d e s c r ip t io n Xpep p e q u e s t / date RECOMMENDED MOUNTING HOLE NOTES: FINISH PLATING THICKN ESS 1 . MAX. PANEL THICKN ESS = 2.4m m IN M IC RO - IN C H ES 1. BRASS PER Q Q -B -626 2. BRASS PER Q Q -B -613 3 CONTACT PIN NOTE 1


    OCR Scan     		PDF -3GT3DG-50

    Untitled

    Abstract: No abstract text available
    Text: K » E eng 10 7 1 5 9 2 - 7 2 ¿ 2 M « FILE COP* 2950-6135 NOTES: 1. MATING: Interface Dimensions per Mil-C-39012/SMA Series and Solitron/Microwave MD-107. 2. MATERIALS: Body: Stainless Steel per QQ-S-764, Type 303, Cond. . Contact: Beryllium Copper per QQ-C-530, Cond.'


    OCR Scan     		PDF Mil-C-39012/SMA MD-107. QQ-S-764, QQ-C-530, MH-P-19468A, L-P-403, Mil-G-45204, Mil-C-26074, Mil-C-14550,

    Untitled

    Abstract: No abstract text available
    Text: K A C IO 7 1 9 5 2 - 7 2 2 2950-6136 EMÙ FILE C U ' . "OTES: 1. MATING: Interface Dimensions per Mil-C-39012/SMA Series and Solitron/Microwave MD-107. 2. MATERIALS: Body: Stainless Steel per QQ-S-764, Type 303, C o nd.A. Contact: Beryllium Copper per QQ-C-530y Cond.ti.


    OCR Scan     		PDF Mil-C-39012/SMA MD-107. QQ-S-764, QQ-C-530y Mil-G-45204, Mil-C-26074, Mil-C-14550, MIL-STD-202