Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAQ00271325.pdf by Bergquist

    • Gap Pad 3000S30 ® Thermally Conductive, Reinforced, Soft "S-Class" Gap Filling Material Features and Benefits · Thermal conductivity: 3.0 W/m-K · Low "S-Class" thermal resistance at very low pres
    • Original
    • Unknown
    • Unknown
    • Unknown
    • Powered by Findchips

    DSAQ00271325.pdf preview

    User Tagged Keywords

    3000S30 BERGQUIST conductivity
    Supplyframe Tracking Pixel