DSAEDA00058928.pdf by Bergquist

Partial File Text Gap Pad 2200SF Â® Thermally Conductive, Silicone-Free Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2200SF PROPERTY Color â¢ Thermal conductivity: 2.0 W/m-K â
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
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