DSAE0032002.pdf by Freescale Semiconductor

Partial File Text Freescale Semiconductor Application Note AN1907 Rev. 3, 5/2009 Solder Reflow Attach Method for High Power RF Devices in Over - Molded Plastic Packages By: Keith Nelson, Quan Li, Lu Li, and
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3478A 95Sn5Sb AN1907 ausi die attach bts 2140 Copper Alloy C151 HP 3478A RF Power Devices SAC305 SAC305 Dispense transistors and IC