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DSAZIHA1000118237.pdf
by KOA Speer Electronics
Partial File Text
NETWORKS THICK FILM R-NETWORKS STRUCTURE 1 Ceramic substrate 2 Pin connection 3 Printe
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d conductor (Ag, Pd) 4 Resistive layer 5 Glass layer 6 Solder plated copper term. 7 Epoxy powde
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Pb Free
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