AMD79C978
Abstract: CN7221 EPB5034
Text: Home Phone Networking Analog Magnetics Module with 10/100 Base-T ELECTRONICS INC. EPB5034 • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •
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EPB5034
AMD79C978,
CN7221
DP83851
CSB5034
AMD79C978
CN7221
EPB5034
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AMD79C978
Abstract: CN7221 EPB5135G
Text: Low Profile Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5135G • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File # 132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •
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EPB5135G
AMD79C978,
CN7221
DP83851
CSB5135G
AMD79C978
CN7221
EPB5135G
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AMD79C978
Abstract: EPB5048G
Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5048G • Optimized for AMD79C978, Conexant CN 7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •
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EPB5048G
AMD79C978,
DP83851
CSB5048G
AMD79C978
EPB5048G
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AMD79C978
Abstract: CN7221 EPB5032 RX513
Text: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5032 • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •
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EPB5032
AMD79C978
CN7221
DP83851
CSB5032
CN7221
EPB5032
RX513
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AMD79C978
Abstract: CN7221 EPB5035GM
Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5035GM • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •
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EPB5035GM
AMD79C978
CN7221
DP83851
CSB5035GM
CN7221
EPB5035GM
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EPF8185SL
Abstract: No abstract text available
Text: 10/100 LAN Interface Module for PC Card Applications ELECTRONICS INC. EPF8185SL • UL/IEC 950 Approved File #132261 • including Nordic deviations for creepage and clearance • Guaranteed to operate with 8 mA DC bias at 70°C • • Low profile, fully integrated with two channels •
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EPF8185SL
BT/100
EPF8185SL
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AMD79C978
Abstract: CN7221 EPB5037GM
Text: Home Phone NetworkingAnalog Magnetics Module with 10/100 Base-T ELECTRONICS INC. EPB5037GM • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •
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EPB5037GM
AMD79C978
CN7221
DP83851
CSB5037GM
CN7221
EPB5037GM
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AMD79C978
Abstract: CN7221 EPB5040GM SIDACTOR
Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5040GM • Optimized for AMD79C978 ,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •
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EPB5040GM
AMD79C978
CN7221
DP83851
CSB5040GM
AMD79C978
CN7221
EPB5040GM
SIDACTOR
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AMD79C978
Abstract: CN7221 EPB5040G a539
Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5040G • Opitimized for AMD79C978 , Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •
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EPB5040G
AMD79C978
CN7221
DP83851
CSB5040G
AMD79C978
CN7221
EPB5040G
a539
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CSB503
Abstract: AMD79C978 EPB5032G CN7221
Text: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5032G • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEC 802.3 Requirements •
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EPB5032G
AMD79C978
CN7221
DP83851
CSB5032G
CSB503
EPB5032G
CN7221
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Untitled
Abstract: No abstract text available
Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5098G • Optimized for Intel Chipset • • UL/IEL 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes • • Temperature Range -40°C to +85°C •
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EPB5098G
EPB5098G
CSB5098G
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EPB5036G
Abstract: AMD79C978 CN7221 132261
Text: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5036G • Optimized For AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •
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EPB5036G
AMD79C978,
CN7221
DP83851
CSB5036G
EPB5036G
AMD79C978
CN7221
132261
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AMD79C978
Abstract: CN7221 EPB5036WG
Text: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5036WG • Optimized For AMD79C978 ,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •
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EPB5036WG
AMD79C978
CN7221
DP83851
AMD79C978
CN7221
EPB5036WG
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EPB5047AS
Abstract: No abstract text available
Text: Home Phone Networking Magnetic Module ELECTRONICS INC. EPB5047AS • Designed to work with Broadcom’s BCM 4210 • • UL/IEC 950 Approved File #132261 • • Robust construction allows for IR processes • • 1500 Vrms Isolation • • Enhanced Common Mode Attenuation to pass FCC Class B •
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EPB5047AS
CSB5047AS
EPB5047AS
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AMD79C978
Abstract: CN7221 EPB5035G C 6090
Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5035G • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •
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EPB5035G
AMD79C978,
CN7221
DP83851
CSB5035G
AMD79C978
CN7221
EPB5035G
C 6090
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AMD79C978
Abstract: CN7221 EPB5037G
Text: Home Phone Networking Analog Magnetics Module with 10/100 Base-T ELECTRONICS INC. EPB5037G • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •
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EPB5037G
AMD79C978
CN7221
DP83851
HPNA250
CSB5037G
CN7221
EPB5037G
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EPB5047S
Abstract: No abstract text available
Text: Home Phone Networking Magnetic Module ELECTRONICS INC. EPB5047S • Optimized for Broadcom’s BCM 4210 • • UL/IEC 950 Approved File #132261 • • Robust construction allows for IR/VP processes • • 1500 Vrms Isolation • • Enhanced Common Mode Attenuation to pass FCC Class B •
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EPB5047S
CSB5047S
EPB5047S
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AMD79C978
Abstract: CN7221 EPB5036GM
Text: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5036GM • Optimized for AMD79C978 & Conexant CN7221 Chips • • UL/IEC 950 Approved File #132261 • • Includes 10 Base-T Magnetics with Common Mode Chokes • • Supports TUT Systems HPN Architecture •
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EPB5036GM
AMD79C978
CN7221
CSB5036GM
AMD79C978
EPB5036GM
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hpna
Abstract: EPB5174G
Text: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5174G • Supports TUT Systems HPN Architecture • • UL/IEC 950 Approved File #132261 • • Meets UL 1950 Spplementary Insulation Requirements • • Meets or exceeds IEEE802.3 Requirements •
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EPB5174G
IEEE802
10-Base-T
CSB5174G
hpna
EPB5174G
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AMD79C978
Abstract: CN7221 EPB5045G
Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5045G • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • Supports TUT Sysems HPN Architecture • • Robust construction allows for reflow processes •
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EPB5045G
AMD79C978,
CN7221
DP83851
SB5045G
AMD79C978
CN7221
EPB5045G
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triac tag 8518
Abstract: 70146 DS3654 X2864AD 7 segment display RL S5220 TC9160 la 4440 amplifier circuit diagram 300 watt philips ecg master replacement guide vtl 3829 A-C4 TCA965 equivalent
Text: 1985 0 / 0 / CONTENTS VOLUME I Introduction to IC MASTER 3 Advertisers’ Index 8 Master Selection Guide Function Index I0 Part Number Index 40 Part Number Guide 300 Logo Guide 346 Application Note Directory 349 Military Parts Directory 50I Testing 506 Cross Reference
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