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    28FEB02 Search Results

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    AT91 TC CAPTURE

    Abstract: AT91FR40162
    Text: Features • Incorporates the ARM7TDMI ARM® Thumb® Processor Core • • • • • • • • • • • • • – High-performance 32-bit RISC Architecture – High-density 16-bit Instruction Set – Leader in MIPS/Watt – Embedded ICE In-circuit Emulation


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    32-bit 16-bit 1024K 128-bit 2632D 15-Sep-05 documents/doc6186 AT91 TC CAPTURE AT91FR40162 PDF

    2632b

    Abstract: No abstract text available
    Text: Features • Incorporates the ARM7TDMI ARM Thumb® Processor Core • • • • • • • • • • • • • – High-performance 32-bit RISC Architecture – High-density 16-bit Instruction Set – Leader in MIPS/Watt – Embedded ICE In-circuit Emulation


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    32-bit 16-bit 1024K 2632B PDF

    GMS05F

    Abstract: No abstract text available
    Text: GMS05F Vishay Semiconductors New Product formerly General Semiconductor Surface Mount TVS Diode Array SOT-23-5L 0.120 3.05 0.110 (2.80) 5 Top View 4 0.118 (3.00) 0.102 (2.60) VIN SW Pin Configuration SOT-23-5L (Top View) SHDN GND 0.070 (1.75) 0.059 (1.50)


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    GMS05F OT-23-5L 28-Feb-02 GMS05F PDF

    Leaded Magnetics and Inductors

    Abstract: IRF power mosfets catalog dale ihd-3 Irf 1540 N SRF 2769 irf 3719 34051 fet 2SF 826 transistor IRF 9734 irf 1507 data sheet
    Text: VISHAY I N T E R T E C H N O L O G Y , I N C . INTERACTIVE data book LEADED MAGNETICS AND INDUCTORS vishay DALE vsD-db0058-0112 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents


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    vsD-db0058-0112 Leaded Magnetics and Inductors IRF power mosfets catalog dale ihd-3 Irf 1540 N SRF 2769 irf 3719 34051 fet 2SF 826 transistor IRF 9734 irf 1507 data sheet PDF

    DO-204AL

    Abstract: GP08A GP08B GP08D GP08J
    Text: GP08A thru GP08J Vishay Semiconductors formerly General Semiconductor Glass Passivated Junction Rectifiers DO-204AL DO-41 * d e t n e t Pa Features 1.0 (25.4) MIN. 0.107 (2.7) 0.080 (2.0) DIA. 0.205 (5.2) 0.160 (4.1) • Plastic package has Underwriters Laboratory


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    GP08A GP08J DO-204AL DO-41) MIL-S-19500 50mVp-p 28-Feb-02 DO-204AL GP08B GP08D GP08J PDF

    Untitled

    Abstract: No abstract text available
    Text: MBRD835L New Product Vishay Semiconductors formerly General Semiconductor Low VF Surface Mount Schottky Rectifier TO-252 DPAK 0.265 (6.73) 0.255 (6.48) 0.094 (2.39) 0.087 (2.21) 0.198 (5.03) 0.190 (4.83) Reverse Voltage 35V Forward Current 8A Forward Voltage


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    MBRD835L O-252 28-Feb-02 PDF

    65 diode 1N

    Abstract: MIL-S-19500 1N5615GP 1N5623GP DO-204AC
    Text: 1N5615GP THRU 1N5623GP Vishay Semiconductors formerly General Semiconductor DO-204AC DO-15 Glass Passivated Junction Fast Switching Rectifier Reverse Voltage 200 to 1000 V Forward Current 1.0 A Features 0.034 (0.86) 0.028 (0.71) Dia. * d e t n e t Pa 1.0 (25.4)


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    1N5615GP 1N5623GP DO-204AC DO-15) MIL-S-19500 50mVp-p 28-Feb-02 65 diode 1N MIL-S-19500 1N5623GP DO-204AC PDF

    Untitled

    Abstract: No abstract text available
    Text: 1N5615 thru 1N5623 Vishay Semiconductors formerly General Semiconductor Glass Passivated Fast Switching Rectifier DO204AP 0.034 0.86 0.028 (0.71) DIA. 1.0 (25.4) MIN. * Features d e t n e t a P • High temperature metallurgically bonded construction • Hermetically sealed package


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    1N5615 1N5623 DO204AP MIL-S-19500 28-Feb-02 PDF

    2KBP005M

    Abstract: 2KBP10M 3N253 3N254 3N255 3N259
    Text: 2KBP005M thru 2KBP10M, 3N253 thru 3N259 Vishay Semiconductors formerly General Semiconductor Glass Passivated Single-Phase Bridge Rectifier Case Style KBPM Features 0.600 15.24 0.560 (14.22) 0.125 x 45o (3.2) 0.460 (11.68) 0.420 (10.67) Dimensions in inches and


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    2KBP005M 2KBP10M, 3N253 3N259 E54214 50mVp-p 28-Feb-02 2KBP10M 3N254 3N255 3N259 PDF

    DO-204AL

    Abstract: RGP10A RGP10M
    Text: RGP10A thru RGP10M Vishay Semiconductors formerly General Semiconductor Glass Passivated Junction Fast Switching Rectifier DO-204AL DO-41 1.0 (25.4) MIN. *Features d e t n e t a P 0.107 (2.7) 0.080 (2.0) DIA. • Plastic package has Underwriters Laboratories


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    RGP10A RGP10M DO-204AL DO-41) MIL-S-19500 50mVp-p 28-Feb-02 DO-204AL RGP10M PDF

    SMD MARKING CODE b24

    Abstract: SMD MARKING CODE B15 bzv55c3v3 BZV55-C5V1 SOD80C BZV55A5V1 BZV55C16 PHILIPS smd code dn BZV55 ordering SMD MARKING CODE B36 SOD80c
    Text: Philips Semiconductors - PIP - BZV55 series; Voltage regulator diodes Submit Que Philips Semiconductors Home ProductBuy MySemiconductors ContactProduct Information catalogonline BZV55 series; Voltage regulator diodes Information as of 2003-01-21 My.Semiconductors.COM.


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    BZV55 SMD MARKING CODE b24 SMD MARKING CODE B15 bzv55c3v3 BZV55-C5V1 SOD80C BZV55A5V1 BZV55C16 PHILIPS smd code dn BZV55 ordering SMD MARKING CODE B36 SOD80c PDF

    2r2 DALE

    Abstract: HP4342A 5940-N R47 DALE 34093 ISC-1812 LC130 HP4191A HP4192A IMC-1210-91
    Text: ISC-1812 Vishay Dale Surface Mount, Molded, Shielded Inductors FEATURES STANDARD ELECTRICAL SPECIFICATIONS IND. µH 0.10 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 0.82 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10.0 12.0 15.0 18.0 22.0 27.0


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    ISC-1812 2r2 DALE HP4342A 5940-N R47 DALE 34093 ISC-1812 LC130 HP4191A HP4192A IMC-1210-91 PDF

    SOT-353 MARKING G2

    Abstract: No abstract text available
    Text: GMF05 Vishay Semiconductors New Product formerly General Semiconductor TVS Diode Array For ESD & Latch-Up Protection SOT-353 0.087 2.20 0.071 (1.80) Pin Configuration (Top View) Top View 5 4 0.087 (2.20) 0.079 (2.00) 0.053 (1.35) 0.045 (1.15) 1 0.012 (0.30)


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    GMF05 OT-353 OT-353 28-Feb-02 SOT-353 MARKING G2 PDF

    Untitled

    Abstract: No abstract text available
    Text: lie Rechte vorbehalten/ HU rights r t s m t i 3 Mating face according to MIL-C-2A308 / DIN 41 652 / CECC 75301-802 No. 1 contact CVI cn - 2,84 8,08 9, 5 Printed board layout(1,6±0,2 thick View component side Dot. Detail. 2 8 - F E B - 0 2 09 68 09 68


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    MIL-C-2A308 28-FEB-02 F-95972 PDF

    Untitled

    Abstract: No abstract text available
    Text: lie Rechte vorbehalten/ HU rights r t s m t i 3 Mating face according to MIL-C-2A308 / DIN 41 652 / CECC 75301 -802 No. 1 contact screw lock thread CVI CO 2 <L t 2,84 Printed board layoutll,6±0,2 thick View component si de 8,08 9, 5 Connector insertion force on PCB = maxi 80 N


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    MIL-C-2A308 28-FEB-02 F-95972 68according PDF

    Untitled

    Abstract: No abstract text available
    Text: lie Rechte vorbehalten/ HU rights r t s m t i 3 Mating face according to MIL-C-2A308 / DIN 41 652 / CECC 75301 -802 No. 1 contact O O O (D | (D O O O screw lock thread (D CP CP CP CP 37 uuuuuuuuuuiluuuuuuuuuuuuuuuuuu CVI CO w 2 <!_ t 2,84 8,08 00,6 Printed board layoutll,6±0,2 thick


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    MIL-C-2A308 28-FEB-02 F-95972 PDF

    Untitled

    Abstract: No abstract text available
    Text: 4 TH IS DRAWING IS U N P U B LIS H E D . RELEASED FOR PUBLICATIO N ALL COPYRIGHT 2 3 RIGHTS - - DIST LOC RESERVED. 00 EH BY TYCO ELECTRONICS CORPORATION. R E V IS IO N S LTR F D E SC RIPTIO N DATE DWN 03MAR2006 REV PER ECO— 0 6 — 0 0 5 0 0 4 APVD LHS c c


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    ECQ-06-005004 03MAR2006 28FEB2002 28FEB02 2BFEB02 31MAR2000 US035067 \Larry\ECO-0B-005004\219153 PDF

    amphenol 74868

    Abstract: No abstract text available
    Text: 930-I02J-5IP NOTES: DRAWING TH 1RD DO NOT S C A L E THIS DRAWING. MATERIALS AND FINISHES: BODY - BRASS, G O L D PLA T I N G .000010 THICK MIN OVER NICKEL C O N T A C T - BeCu, G O L D P L A T I N G ( . 0 0 0 0 3 0 TH I CK MIN) O V E R NI CK E L I NSULATOR - PTFE


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    930-I02J-5IP, 930-102J 28-FEB-02 \QMA\930- 930-I02J-5IP amphenol 74868 PDF

    Untitled

    Abstract: No abstract text available
    Text: lie Rechte vorbehalten/ HU rights r t s m t i 3 Mating face according to MIL-C-2A308 / DIN 41 652 / CECC 75301-802 No. 1 c o n t a c t *— i_ n LD CD— / 1 \D 0 -0 - -0 — 0 — ( — 9— - ®— ®— 9— 9-13)| 0 t t u _e— e — ®— o — e — e - 9 9 9— 9


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    MIL-C-2A308 28-FEB-029â 28-FEB-02 F-95972 PDF

    Untitled

    Abstract: No abstract text available
    Text: SMA R E V 1S I O N S 9 3 0 - I00A-5IS NOTES: I. MATERIALS AND FINISHES: BODY - BRASS, WHITE BRONZE PLATING .000080 THICK CONTAC T - BE RYLLIU M COPPER, GOLD PLATING (.000030) INSULATOR - PTFE 2. ELECTRICAL: A. I M P E D A N C E : 50 O H M B. I N S E R T I O N L O S S :


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    5X-1777-1 930-I00A-5IS L-STD-348 ST-300-1 28-Feb-02 \QMA\930- PDF

    Untitled

    Abstract: No abstract text available
    Text: Alle Rechle vorbehallen/ 411 rights reserred 3 Mating face according to Ml L- C- 2 ^308 / DIN L 1 652 / CECC 75301 -802 No. 1 contoct screw lock thread C P r i n t e d board I a y o u t 1 , 6 ±0 , 2 t hi ck Vi ew component side Connector i n s e r t i o n force on PCB = maxi 80 N


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    28-FEB-02 28-JUN-04 28-FEB-01 PDF

    Untitled

    Abstract: No abstract text available
    Text: Alle Rechte Vorbehalten/ àtl rights reserné 2,54 58,42 3, 81 x 19= 48,26 2,54 1,27 Osl <T> 1. ' T T T T T Kontakt 1 er 1. Ln Osl i s t contact contact Kontakt îs t contact 1er all contact holes Pr inted b o a r d layout C o m p o n e n t side il 00.05


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    2B-FEB-02 28-FEB-02 F-95972 0919540x32x PDF

    Untitled

    Abstract: No abstract text available
    Text: Alle Rechte Vorbehalten/ àtl rights reserné 2,54 58,42 3, 81 x 19 = 4 8 , 2 6 1,27 Printed Osl o*> board Component 1. layout side Kontakt 1st contact 1er LO LO contact 4,1 JL _ft C7> 0,64x0,64 CO lo co 0,55 2,54 CD % lai LO 19x2,54=148,26! CD co 2,54 CD


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    28-FEB-02 0919540x32x F-95972 PDF

    Untitled

    Abstract: No abstract text available
    Text: Engineering Note VISHAY Vishay Dale ILB, ILBB Ferrite Beads, Electro-Magnetic Interference and Electro-Magnetic Compatibility EMI/EMC Figure 2 IN T R O D U C T IO N Manufacturers of electrical and electronic equipment regularly subm it their products for EM I/EMC testing to ensure


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    radiaIMC-1812-91, IMC-1210-91, ISC-181291, ISC-1210-91 28-Feb-02 PDF