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    Abstract: No abstract text available
    Text: N -C H A N N E L J U N C T IO N FET CHIP NUMBER CONTACT METALLIZATION r". Top Contact: > A Aluminum 12,000 017" 0 432mm Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS 017" (0 432mm) It is advisable that: a) the die be eutectically mounted with gold silicon preform 98/2%.


    OCR Scan     		PDF 432mm) 0254mm) 2N4771 2N4119, 2N4119A-2N -10nA

    2n4117 equivalent

    Abstract: 2N4117 2n4117a equivalent 2N4771 2N4119A equivalent 2n4119 2n4117a 2N3452 equivalent 2n4118 2n5902-2n5909
    Text: l?[^@[D LD ir ©AITAtL ' IM-CHAIMIMEL J U N C T IO N FET CHIP NUMBER CONTACT METALLIZATION Top Contact: > A Aluminum r * 12,000 017" . (0 432mm) Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS 017" (0 432mm) It is advisable that: a) the die be eutectically mounted with gold silicon preform 98/2%.


    OCR Scan     		PDF 0254mm) 2N4117A-2N4119A 2N4117-2N4119 2N4771 2N4119, 2N4119A-2N4119A 2N4117 2N4119A-2N4119A 2n4117 equivalent 2n4117a equivalent 2N4119A equivalent 2n4119 2n4117a 2N3452 equivalent 2n4118 2n5902-2n5909