DIP42 package
Abstract: 600-MIL
Text: SANYO Semiconductor Dual In-line Package 42Pin Plastic DIP42 600mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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42Pin
DIP42
600mil)
ED-7303A)
51MIN
DIP42
DIP42 package
600-MIL
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566 pin diagram
Abstract: bq 735 565 pin diagram micro controller bm p71 BM P60
Text: EM78567/566/565 8-BIT MICRO CONTROLLER IV.Pin Configuration P75/INT5 P76/INT6 P77/INT7 XIN XOUT PLLC GND TONE P80 P81 P82 42pin SDIP EM78567AR EM78567BR EM78566AR EM78566BR P70/INT0 P71/INT1 P72/INT2 P73/INT3 P74/INT4 P75/INT5 P76/INT6 P77/INT7 XIN XOUT PLLC
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EM78567/566/565
P75/INT5
P76/INT6
P77/INT7
42pin
EM78567AR
EM78567BR
EM78566AR
EM78566BR
P70/INT0
566 pin diagram
bq 735
565 pin diagram
micro controller
bm p71
BM P60
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SSOP42-P-450-0
Abstract: No abstract text available
Text: APPENDIX 3.9 Package outline 3.9 Package outline 42P2R-A Plastic 42pin 450mil SSOP EIAJ Package Code SSOP42-P-450-0.80 Weight g 0.63 JEDEC Code – Lead Material Alloy 42/Cu Alloy e b2 22 Caution ! E HE e1 I2 42 F Symbol TBD 21 1 A D Recommended Mount Pad
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42P2R-A
42pin
450mil
SSOP42-P-450-0
42/Cu
42P2R-A
42P4in
42S1B-A
600mil
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42-PIN
Abstract: No abstract text available
Text: 42S1B-A Metal seal 42pin 600mil DIP EIAJ Package Code WDIP42-C-600-1.78 JEDEC Code – Weight g 1 21 e1 22 E 42 c D A1 L A A2 Symbol Z e b b1 SEATING PLANE A A1 A2 b b1 c D E e e1 L Z Dimension in Millimeters Min Nom Max – – 5.0 – – 1.0 3.44 – –
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42S1B-A
42pin
600mil
WDIP42-C-600-1
42-PIN
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SOJ42-P-400-1
Abstract: SOJ42-P-400 SOJ42
Text: 42P0K Plastic 42pin 400mil SOJ Weight g Lead Material Alloy 42 e b2 D 42 e1 c I2 JEDEC Code – I1 EIAJ Package Code SOJ42-P-400-1.27 22 e1 HE E Recommended Mount Pad Symbol 1 21 L A A1 b1 e y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2 Dimension in Millimeters
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42P0K
42pin
400mil
SOJ42-P-400-1
SOJ42-P-400
SOJ42
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P42C
Abstract: No abstract text available
Text: 42PIN PLASTIC SHRINK DIP 600 mil 42 22 1 21 A K H G J I L F B D N R M C M NOTES 1) Each lead centerline is located within 0.17 mm (0.007 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed parallel.
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42PIN
P42C-70-600A-1
P42C
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H 9311
Abstract: SSOP42-P-450-0
Text: Recommended 42P2R-A EIAJ Package Code SSOP42-P-450-0.80 JEDEC Code – Plastic 42pin 450mil SSOP Weight g 0.63 e b2 22 E Recommended Mount Pad F Symbol 1 21 A D G A2 e y A1 b L L1 HE e1 I2 42 Lead Material Alloy 42/Cu Alloy A A1 A2 b c D E e HE L L1 z Z1
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42P2R-A
SSOP42-P-450-0
42pin
450mil
42/Cu
H 9311
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Untitled
Abstract: No abstract text available
Text: April 2007 TLCS-870 Family TLCS-870/C1 Series TMP89FH40NG 42pin TMP89FM40NG 8-bit microcontrollers delivering high functionality and performance in low-pin-count packages TLCS-870/C1 CPU Core •Operating voltage 4.5 to 5.5 V@8 MHz 2.7 to 5.5 [email protected] MHz ·Clock gear
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TLCS-870
TLCS-870/C1
TMP89FH40NG
42pin
TMP89FM40NG
10-bit
16-bit
TMP89FH40NG*
TMP89FM40NG*
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Untitled
Abstract: No abstract text available
Text: 42P3U-E Plastic 42pin 300mil TSOP EIAJ Package Code TSOPII 42-P-300-0.65 Weight(g) 0.29 JEDEC Code – Lead Material Alloy 42 e b2 I2 F ME 22 E Recommended Mount Pad Symbol 21 1 A D L c L1 HE 42 e b y A2 Detail F A1 A A1 A2 b c D E e HE L L1 y ME I2 b2
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42P3U-E
42pin
300mil
42-P-300-0
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DIP42-P-600-2
Abstract: No abstract text available
Text: 42P4Z Plastic 42pin 600mil DIP JEDEC Code – Lead Material Alloy 42 22 1 21 E 42 e1 c EIAJ Package Code DIP42-P-600-2.54 Weight g 6.06 D L A1 A A2 Symbol SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5 0.51
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42P4Z
42pin
600mil
DIP42-P-600-2
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DIP42S
Abstract: DIP-42S
Text: SANYO Semiconductor Shrink Dual In-line Package 42Pin Plastic DIP42S 600mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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42Pin
DIP42S
600mil)
ED-7303A)
51min
DIP42S
DIP-42S
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SSOP42-P-450-0
Abstract: 42p2r-a
Text: 42P2R-A Plastic 42pin 450mil SSOP EIAJ Package Code SSOP42-P-450-0.80 JEDEC Code – Weight g 0.63 Lead Material Alloy 42/Cu Alloy e 22 E F Recommended Mount Pad Symbol 1 21 A D y b A1 L e A2 L1 HE e1 I2 42 b2 c Detail F A A1 A2 b c D E e HE L L1 y b2 e1
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42P2R-A
42pin
450mil
SSOP42-P-450-0
42/Cu
42p2r-a
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42P4B
Abstract: 42-PIN
Text: 42P4B Plastic 42pin 600mil SDIP Weight g 4.1 JEDEC Code – Lead Material Alloy 42/Cu Alloy 22 1 21 E 42 e1 c EIAJ Package Code SDIP42-P-600-1.78 Symbol L A1 A A2 D e SEATING PLANE b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max
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42P4B
42pin
600mil
42/Cu
SDIP42-P-600-1
42P4B
42-PIN
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TLCS-870
Abstract: TMP86C846NG TMP86CH46ANG TMP86CM46ANG TMP86FH46ANG TMP86PH46NG TMP86PM46NG
Text: May 2008 TLCS-870 Family TLCS-870/C Series 42pin TMP86FH46ANG 8-bit microcontroller with flash memory, 10-bit AD converter and two serial interfaces TLCS-870/C CPU Core •Operating voltage: 2.7 to 5.5 V ·Minimum instruction execution time: 250 ns at 16 MHz/ 4.5 to 5.5 V
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TLCS-870
TLCS-870/C
42pin
TMP86FH46ANG
10-bit
16-bit
TMP86C846NG
TMP86CH46ANG
TMP86C846NG
TMP86CH46ANG
TMP86CM46ANG
TMP86FH46ANG
TMP86PH46NG
TMP86PM46NG
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SSOP42-P-450-0
Abstract: No abstract text available
Text: APPENDIX 3.6 Package outline 3.6 Package outline MMP 42P4B EIAJ Package Code SDIP42-P-600-1.78 Plastic 42pin 600mil SDIP Weight g 4.1 Lead Material Alloy 42/Cu Alloy 22 1 21 E 42 e1 c JEDEC Code – Symbol L A1 A A2 D e b1 b2 b SEATING PLANE A A1 A2 b b1
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42P4B
SDIP42-P-600-1
42pin
600mil
42/Cu
42P2R-A/E
450mil
SSOP42-P-450-0
42S1B-A
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ffc cable
Abstract: No abstract text available
Text: A B C D E G F H 60 47 . 220 20 20 20 1 3 7 6 2 90 25.5 40 2 40 1 8 3 4 1 9 8 7 6 4 3 2 4 5 4 3 2 1 5 9 5 01 RELEASED Rev.No. DESCRIPTION A B C D E 1 117-93-642-41-005 42Pin S-DIP Socket PRECI-DIP 1 1 1 1 4 1 1 1 NAC-S-FPC-294 Sheild FPC TET I-51500 FFC Cable
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42Pin
50pin
12pin
NAC-S-FPC-294
I-51500
I-51499
8913-120-178S
50S-HF-E3000
SDA-042
ffc cable
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1903260-1
Abstract: No abstract text available
Text: 107-68323 Packaging Specification Nov.13,06 Rev H 0.635mm PITCH BAY CONN. 42PIN 1. PURPOSE 目的 Define the packaging specifiction and packaging method of 0.635mm PITCH BAY CONN. 42PIN. 订定 0.635mm PITCH BAY CONN. 42PIN 产品之包装规格及包装方式。
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635mm
42PIN
42PIN.
1565635-X
1903260-1
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Untitled
Abstract: No abstract text available
Text: 42P3U-F Plastic 42pin 300mil TSOP II EIAJ Package Code TSOPII 42-P-300-0.65 JEDEC Code – Weight(g) 0.29 Lead Material Alloy 42 e b2 E ME 21 1 Recommended Mount Pad Symbol 22 42 A D L c L1 HE I2 F e b y A2 A1 Detail F A A1 A2 b c D E e HE L L1 y ME I2 b2
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42P3U-F
42pin
300mil
42-P-300-0
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P42C-70-600B
Abstract: No abstract text available
Text: 42PIN PLASTIC SHRINK DIP 600 mil 42 22 1 21 A K I L J F D C N R M M H B G NOTES 1) Each lead centerline is located within 0.17 mm (0.007 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed parallel.
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42PIN
P42C-70-600B-1
P42C-70-600B
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HYM564124
Abstract: HY5118164 c044 HYM5641
Text: H • { H Y U N D A I Y M 5 6 4 1 2 X 4 - S e r i e s 1M x 64-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION TTie HYM564124 is a 1M x 64-blt EDO mode CMOS DRAM module consisting of four HY5118164B in 42/42pin SOJ, two 16-bit BiCMOS line driver in TSSOP on a 168 pin glass-epoxy printed circuit board. 0.22|iF decoupling
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64-bit
HYM564124
64-blt
HY5118164B
42/42pin
16-bit
HYM564124XG/SLXG
DQ0-DQ63)
1EC05-10-APR95
HY5118164
c044
HYM5641
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D01400
Abstract: 281 C 38 100 D
Text: •HYUNDAI HYM564224 X-Series 2M X 64-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION The HYM564224 is a 2M x 64-bit EDO mode CMOS DRAM module consisting of eight HY5118164B in 42/42pin SOJ, two 16-bit BiCMOS line driver in TSSOP on a 168 pin glass-epoxy printed circuit board. 0.22nF decoupling
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HYM564224
64-bit
HY5118164B
42/42pin
16-bit
HYM564224XG/SLXG
DQ0-DQ63)
ECO5-10-APR95
D01400
281 C 38 100 D
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M37540RSS
Abstract: No abstract text available
Text: 7540 42pin pin configuration 1999/4/22 Revised by Kubo M37540RSS pin configuration P14/CNTR0 <•— k j NC NC P20/AN0 P21/AN1 * — -► 3 - I4 *— -* d NC F P23/AN3 «— * — - P24/AN4 — P25/AN5 <— -► [jm * — - P" 12 *— P22/AN2 P26/AN6 P27/AN7
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42pin
M37540RSS
P14/CNTR0
P20/AN0
P21/AN1
P22/AN2
P23/AN3
P24/AN4
P25/AN5
P26/AN6
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Untitled
Abstract: No abstract text available
Text: HYUNDAI HYM564100 X-Series IM X 64-bit CMOS DRAM MODULE DESCRIPTION The HYM564100 is a 1M x 64-bit Fast page mode CMOS DRAM module consisting of four HY5116160 in 42/42pin SOJ, two 16-bit and one 4-bit BiCMOS line driver in TSSOP on a 168 pin glass-epoxy printed circuit board. 0.22p.F
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HYM564100
64-bit
HY5116160
42/42pin
16-bit
HYM564100XG/SLXG
A0-A11
DQ0-DQ63)
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STI321000A
Abstract: No abstract text available
Text: STI321000A 72-PIN SIMMS 1M X 32 DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • The Simple Technology STI321000A is a 1M bit x 32 Dynamic RAM high density memory module. The Simple Technology STI321000A consist of two CMOS 1M x 16 bit DRAMs in 42pin SOJ package mounted on a 72-pin glass epoxy substrate.
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STI321000A
STI321000A-60
STI321000A-70
STI321000A-80
110ns
130ns
150ns
72-PIN
STI321000A
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