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    LGA voiding

    Abstract: CCGA APD-SCC-201 IBM ccga 67F4333 ceramic rework 810E N100 cte table flip chip substrate cte table epoxy
    Text: CLASP CERAMIC COLUMN GRID ARRAY TECHNOLOGY FOR FLIP CHIP CARRIERS S. Ray, M. Interrante, L. Achard * , M. Cole, I. DeSousa(*), L. Jimarez, G. Martin, and C. Reynolds, IBM Microelectronics Division Hopewell Jct., NY (*) IBM Canada, Bromont, QUE Biography Sudipta Ray is a Senior Engineer in Interconnections


    Original     		PDF 67F4333, F52977, APD-SCC-201 LGA voiding CCGA IBM ccga 67F4333 ceramic rework 810E N100 cte table flip chip substrate cte table epoxy