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    Abstract: aon4409 AON3404 AON3603 AON4404 AON4605 AON4604 AON4703 Alpha Omega cross AON4405
    Text: Document No. DSMT-0003 Rev. 1 Page: 1/1 PCB Land Design and Surface Mount for DFN3x2 and DFN3x3 Punched Packages Introduction DFN package is a plastic encapsulated package with a copper lead frame substrate. It offers near chip scale footprint, thin profile, low weight and good thermal and electrical performance.


    Original     		DSMT-0003 AON3603, AON3404) AON4402, AON4405, AON4602, AON4603, AON4701) package aon4409 AON3404 AON3603 AON4404 AON4605 AON4604 AON4703 Alpha Omega cross AON4405 PDF