TRANSISTOR REPLACEMENT GUIDE d882
Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,
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ASTM d792
Abstract: astm D150 conductivity meter circuit for second tear C351 D149 D150 D2240 D257 D374
Text: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R • Thermal conductivity = 1.5 W/mK • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction
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1500R
D2240
ASTM d792
astm D150
conductivity meter circuit
for second tear
C351
D149
D150
D2240
D257
D374
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bergquist
Abstract: BERGQUIST GP1500 E1269 D149 D150 D2240 D257 D374 D575 D792
Text: Gap Pad 1500 Thermally Conductive, Un-Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500 PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Un-reinforced construction for additional compliancy • Conformable, low hardness
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E1269
D2240
bergquist
BERGQUIST GP1500
E1269
D149
D150
D2240
D257
D374
D575
D792
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Untitled
Abstract: No abstract text available
Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE
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conductivity meter circuit
Abstract: ASTM D5470 ASTM d792 ASTM D374 conductivity meter astm D150 ASTM D2240 ph meter circuit GP1500 D149
Text: Gap Pad 1500 Thermally Conductive, Unreinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500 PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Unreinforced construction for additional compliancy • Conformable, low hardness
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E1269
D2240
conductivity meter circuit
ASTM D5470
ASTM d792
ASTM D374
conductivity meter
astm D150
ASTM D2240
ph meter circuit
GP1500
D149
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ASTM D374
Abstract: 1500S30
Text: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K • Highly conformable / low hardness PROPERTY Color IMPERIAL VALUE
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1500S30
1500S30
ASTM D374
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Untitled
Abstract: No abstract text available
Text: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction
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1500R
E1269
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Untitled
Abstract: No abstract text available
Text: Gap Pad 1500 Thermally Conductive, Un-Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500 PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Un-reinforced construction for additional compliancy • Conformable, low hardness
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E1269
D2240
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Untitled
Abstract: No abstract text available
Text: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction
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1500R
E1269
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Untitled
Abstract: No abstract text available
Text: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K PROPERTY Color • Highly conformable / low hardness Reinforcement Carrier
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1500S30
E1269
D2240
1500S30
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Untitled
Abstract: No abstract text available
Text: Gap Pad Materials Application Note #116 Compressive Modulus of Elasticity for Gap Pad Materials Variability in Compressive Modulus Values Compressive modulus can be measured in various ways yielding different values for the same material, depending on the test
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TPS40304
Abstract: No abstract text available
Text: User's Guide SLUU412 – March 2010 CSD163CEVM-591 The CSD163CEVM-591 evaluation module EVM is a synchronous buck converter providing a fixed 1.2V output at up to 25A from a 12-V input bus. The EVM is designed to start-up from a single supply; so, no additional bias voltage is required for start-up. The module uses the TPS40304 high performance,
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CSD163CEVM-591
CSD163CEVM-591
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EC00296A
Abstract: NTC thermistor 20k HPA687 R85-R86 R92-R94 SCI 103M bq500100 elytone dc buzzer bq500110EVM
Text: User's Guide SLVU429A – December 2010 – Revised January 2011 bq500110EVM-688 Evaluation Module The bqTESLA wireless power evaluation kit from Texas Instruments is a high-performance, easy-to-use development kit for the design of wireless power solutions. Consisting of a single-channel transmitter and
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SLVU429A
bq500110EVM-688
bq500110EVM
bq25046EVM
EC00296A
NTC thermistor 20k
HPA687
R85-R86
R92-R94
SCI 103M
bq500100
elytone
dc buzzer
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schematic diagram atx Power supply 500w
Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
Text: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455
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P462-ND
P463-ND
LNG295LFCP2U
LNG395MFTP5U
US2011)
schematic diagram atx Power supply 500w
pioneer PAL 012A
1000w inverter PURE SINE WAVE schematic diagram
600va numeric ups circuit diagrams
winbond bios 25064
TLE 9180 infineon
smsc MEC 1300 nu
TBE schematic diagram inverter 2000w
DK55
circuit diagram of luminous 600va UPS
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