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    Samtec Inc ECUE-12-693-T1-FF-01-1

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    Samtec Inc ECUE-12-699-T1-FF-01-1

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    Samtec Inc ECUE-12-697-T1-FF-01-1

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    Vishay Intertechnologies RS005R1540FE1269

    Wirewound Resistors - Through Hole 5watts .154ohms 1%
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    Mouser Electronics RS005R1540FE1269
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    ROHDE&SCHWARZ RTE1154-WE12690

    Extension Of The 3 Year Standard Product Warranty To 4 Years For Rte1154: - All Repairs And All Necessary R&s Manufacturer-Calibrations In Case Of Repair |Rohde & Schwarz RTE1154-WE12690
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    Newark RTE1154-WE12690 Bulk 1
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    E1269 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    SED1330

    Abstract: No abstract text available
    Text: These drawings and specifications are the property of Densitron Corporation and may not be reproduced, copied or used without written permission 1. 2. 3. 4. REVISIONS REV. DESCRIPTION A RELEASED ON ECN #E1269 DATE APPROVED 02/12/02 MA Specification subject to change without notice.


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    E1269 LM4729· 128G240 LM4729 SED1330 PDF

    RJ45 speed tech

    Abstract: HALO HFJ11-S101E-s1 HFJ11-S101E-s1 HFJ11-S101E hfj11 speed tech rj45 S101E
    Text: APPROVED MANUFACTURERS LIST FOR WEB PARTS 498-0070 -WEB ITEM NUMBER PART DESCRIPTION CONNECTOR/TRANSFORMER RJ45 10 BASE-T REVISION HISTORY Rev B C D ECO # Description of Change E12399 Release part to web store. E12694 Add Speed Tech part. E12784 REMOVE SPEED TECH/PRIDE TECH.


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    E12399 E12694 E12784 HFJ11-S101E-S1 RJ45 speed tech HALO HFJ11-S101E-s1 HFJ11-S101E-s1 HFJ11-S101E hfj11 speed tech rj45 S101E PDF

    Toshiba TLX-1741-C3M LCD display

    Abstract: kcb104vg2ca-a43 LQ088H9DR01 TOSHIBA TLX-1741-C3M KCS077VG2EA-A43 LM32P073 tlx-1741-c3m M170EN04 LP104S06-A1 DMF50081N
    Text: LCD Module to ERG Inverter Part Number Cross-Reference Guide LCD Manufacturer Acer Acer AND AND AND AND AND AND AND AND AND AND AND AND AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics


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    L150X2M-1 L170E3-4 AND08C351-HB AND10C209A-4HB AND10C209A-DHB AND10C209A-HB AND10C273-4HB AND10C273-DHB AND10C273-HB AND10C306L Toshiba TLX-1741-C3M LCD display kcb104vg2ca-a43 LQ088H9DR01 TOSHIBA TLX-1741-C3M KCS077VG2EA-A43 LM32P073 tlx-1741-c3m M170EN04 LP104S06-A1 DMF50081N PDF

    bergquist

    Abstract: 2500S2
    Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at


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    2500S20 2500S20 bergquist 2500S2 PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K PROPERTY Color • Highly conformable / low hardness Reinforcement Carrier


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    1500S30 E1269 D2240 1500S30 PDF

    a3000

    Abstract: No abstract text available
    Text: Gap Pad A3000 Thermally Conductive, Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.6 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Reduced tack on one side to aid in application assembly • Electrically isolating


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    A3000 E1269 a3000 PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at


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    2500S20 E1269 D2240 2500S20 PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad VO Ultimate Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material Features and Benefits • Thermal conductivity: 1.3 W/m-K • Ultra conformability • Gel-like modulus TYPICAL PROPERTIES OF GAP PAD VO ULTIMATE PROPERTY


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    E1269 PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad VO Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO • Thermal conductivity: 0.8 W/m-K • Enhanced puncture, shear and tear resistance • Conformable gap filling material • Electrically isolating


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    E1269 PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad HC1000 “Gel-Like” Modulus Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD HC1000 PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus • Fiberglass reinforced for puncture,


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    HC1000 E1269 PDF

    bergquist

    Abstract: BERGQUIST GP1500 E1269 D149 D150 D2240 D257 D374 D575 D792
    Text: Gap Pad 1500 Thermally Conductive, Un-Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500 PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Un-reinforced construction for additional compliancy • Conformable, low hardness


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    E1269 D2240 bergquist BERGQUIST GP1500 E1269 D149 D150 D2240 D257 D374 D575 D792 PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Filler 1100SF Two-Part Thermally Conductive, Silicone-Free, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 1100SF PROPERTY Color / Part A • Thermal conductivity: 1.1 W/m-K • No silicone outgassing or extraction


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    100SF 1100SF 1100SF PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 5000S35 High thermal conductivity plus “S-Class” softness and conformability Features and Benefits • High thermal conductivity: 5 W/m-K • Highly conformable,“S-Class” softness TYPICAL PROPERTIES OF GAP PAD 5000S35 PROPERTY Color IMPERIAL VALUE


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    5000S35 5000S35 PDF

    gf3500s35

    Abstract: GF-3500 D2196 3500S35 GF35 D149 D150 D2240 D257 D792
    Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 • Thermal conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage


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    3500S35 D2196 E1269 3500S35 gf3500s35 GF-3500 D2196 GF35 D149 D150 D2240 D257 D792 PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 1000SF Thermally Conductive, Silicone-Free Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1000SF PROPERTY Color • Thermal conductivity: 0.9 W/m-K • No silicone outgassing • No silicone extraction • Reduced tack on one side to aid in


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    1000SF E1269 1000SF PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad VO Soft Highly Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO SOFT • Thermal conductivity: 0.8 W/m-K • Conformable, low hardness • Enhanced puncture, shear and tear resistance


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    E1269 PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad VO Ultra Soft Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus


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    PDF

    bergquist

    Abstract: No abstract text available
    Text: Sil-Pad A2000 Higher Performance, High Reliability Insulator Features and Benefits • Thermal impedance: 0.32°C-in2/W @50 psi • Optimal heat transfer • High thermal conductivity: 3.0 W/m-K TYPICAL PROPERTIES OF SIL-PAD A2000 PROPERTY Color IMPERIAL VALUE


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    A2000 D2240 E1269 bergquist PDF

    Untitled

    Abstract: No abstract text available
    Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE


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    PDF

    bergquist

    Abstract: D575 E1269 5000S35 D149 D150 D2240 D257 D374 D792
    Text: Gap Pad 5000S35 High thermal conductivity plus “S-Class” softness and conformability Features and Benefits TYPICAL PROPERTIES OF GAP PAD 5000S35 • High thermal conductivity: 5 W/m-K PROPERTY • Highly conformable,“S-Class” softness Color • Natural inherent tack reduces interfacial


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    5000S35 E1269 D2240 5000S35 bergquist D575 E1269 D149 D150 D2240 D257 D374 D792 PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction


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    1500R E1269 PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Filler 1000 Two-Part Thermally Conductive,Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 1000 PROPERTY Color / Part A • Thermal conductivity: 1.0 W/m-K • Ultra-conforming,designed for fragile and low-stress applications


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    D2196 PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad A2000 High Performance,Thermally Conductive Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD A2000 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Electrically isolating


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    A2000 E1269 D2240 PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 2200SF Thermally Conductive, Silicone-Free Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2200SF PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Silicone-free formulation • Medium compliance with easy handling


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    2200SF E1269 D2240 2200SF PDF